Browsing Conference contributions by imec author "d762612c84fe4cea5e04a13ab162c87d6ecb445e"
Now showing items 1-19 of 19
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A full-automatic test system for characterizing wide-I/O micro-bump probe cards
Marinissen, Erik Jan; Fodor, Ferenc; De Wachter, Bart; Kiesewetter, Joerg; Hill, Eric; Smith, Ken (2017-06) -
A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards
Marinissen, Erik Jan; Fodor, Ferenc; De Wachter, Bart; Kiesewetter, Joerg; Hill, Eric; Smith, Ken (2017-09) -
Accurate Measurements of Small Resistances in Vertical Interconnects with Small Aspect Ratios
Stucchi, Michele; Fodor, Ferenc; Marinissen, Erik Jan (2020) -
Automated probe mark analysis
Rong, Yu-Rong; Wu, Cheng-Wen; Fodor, Ferenc; Marinissen, Erik Jan (2018-06) -
Demonstration of a collective hybrid die-to-wafer integration
Suhard, Samuel; Phommahaxay, Alain; Kennes, Koen; Bex, Pieter; Fodor, Ferenc; Beyne, Eric; Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyer, Gerald (2020) -
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021) -
High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package
Podpod, Arnita; Velenis, Dimitrios; Phommahaxay, Alain; Bex, Pieter; Fodor, Ferenc; Marinissen, Erik Jan; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings
De Preter, Inge; Derakhshandeh, Jaber; Bex, Pieter; Fodor, Ferenc; Cherman, Vladimir; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
Leading-edge wide-I/O2 memory probing challenges: TPEG(TM) MEMS solution
Fodor, Ferenc; Marinissen, Erik Jan; Acconcia, Daniele; Vallauri, Raffaele (2018-06) -
Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology
Van Huylenbroeck, Stefaan; De Vos, Joeri; Teugels, Lieve; Iacovo, Serena; Fodor, Ferenc; Miller, Andy; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2021) -
New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding
De Messemaeker, Joke; Witters, Liesbeth; Zhang, Boyao; Tsau, Thomas; Fodor, Ferenc; De Vos, Joeri; Beyer, Gerald; Croes, Kristof; Beyne, Eric (2023) -
Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bonding
Kim, Soon-Wook; Fodor, Ferenc; Heylen, Nancy; Iacovo, Serena; De Vos, Joeri; Miller, Andy; Beyer, Gerald; Beyne, Eric (2020) -
Parametric test for next generation semiconductor technologies
De Wachter, Bart; Marinissen, Erik Jan; Fodor, Ferenc; Hiblot, Gaspard (2017) -
Probing complexities of 3D-stacked ICs – A test engineers' perspective
Fodor, Ferenc; De Wachter, Bart; Podpod, Arnita; Stucchi, Michele; Marinissen, Erik Jan (2020-11) -
Probing of large-array, fine-pitch microbumps for 3D ICs
Fodor, Ferenc; De Wachter, Bart; Marinissen, Erik Jan; Kiesewetter, Joerg; Smith, Ken (2017-05) -
Process development and characterization of 3D multi-die stacking
Gerets, Carine; Derakhshandeh, Aber; Bex, Pieter; Lofrano, Melina; Cherman, Vladimir; Fodor, Ferenc; De Wolf, Ingrid; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric (2020) -
Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects
Absil, Philippe; Croes, Kristof; De Heyn, Peter; Ban, Yoojin; Snyder, Brad; De Coster, Jeroen; Balakrishnan, Sadhishkumar; Lepage, Guy; Golshani, Negin; Verheyen, Peter; Pantouvaki, Marianna; Van Campenhout, Joris; Fodor, Ferenc; Lesniewska, Alicja; Simons, Veerle; Lardenois, Sebastien; Detalle, Mikael; Chen, Hongtao; Miller, Andy; Loo, Roger; Vanherle, Wendy (2017) -
Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits
Marinissen, Erik Jan; Fodor, Ferenc; Podpod, Arnita; Stucchi, Michele; Jian, Yu-Rong; Wu, Cheng-Wen (2018-11) -
Testing Embedded Toggle Pattern Generation Through On-Chip IR Drop Monitoring
Monta, Kazuki; Kataselas, Leonidas; Fodor, Ferenc; Hatzopoulos, Alkis; Nagata, Makoto; Marinissen, Erik Jan (2021)