Browsing Conference contributions by imec author "e632831b6ad7576998b3cf24720d40acca7a111e"
Now showing items 1-20 of 47
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193nm immersion lithography for high performance silicon photonic circuits
Selvaraja, Shankar; Absil, Philippe; Van Campenhout, Joris; Winroth, Gustaf; Murdoch, Gayle; Locorotondo, Sabrina; Milenin, Alexey; Delvaux, Christie; Ong, Patrick; Sterckx, Gunther; Lepage, Guy; Pathak, Shibnath; Bogaerts, Wim; Van Thourhout, Dries; Xie, Weiqiang (2014) -
A 35nm diameter vertical silicon nanowire short-gate tunnelFET
Vandooren, Anne; Rooyackers, Rita; Leonelli, Daniele; Iacopi, Francesca; De Gendt, Stefan; Verhulst, Anne; Heyns, Marc; Kunnen, Eddy; Nguyen, Duy; Demand, Marc; Ong, Patrick; Lee, Willie; Moonens, Jos; Richard, Olivier; Vandenberghe, William; Groeseneken, Guido (2009) -
A 400GHz fMAX fully self-aligned SiGe:C HBT architecture
Van Huylenbroeck, Stefaan; Sibaja-Hernandez, Arturo; Venegas, Rafael; You, Shuzhen; Winderickx, Gillis; Radisic, Dunja; Lee, Willie; Ong, Patrick; Vandeweyer, Tom; Nguyen, Duy; De Meyer, Kristin; Decoutere, Stefaan (2009-10) -
Advanced 300-mm waferscale patterning for silicon photonics devices with record low loss and phase errors
Selvaraja, Shankar; Murdoch, Gayle; Milenin, Alexey; Delvaux, Christie; Ong, Patrick; Pathak, Shibnath; Vermeulen, Diedrik; Sterckx, Gunther; Winroth, Gustaf; Verheyen, Peter; Lepage, Guy; Bogaerts, Wim; Baets, Roel; Van Campenhout, Joris; Absil, Philippe (2012) -
An improved CMP process for integration of high mobility channel materials
Teugels, Lieve; Ong, Patrick; Usman Ibrahim, Ansar; Delande, Tinne; Bhonsle, Rithu; Siebert, Max; Garcia Romero, Ivan; Struyf, Herbert; Leunissen, Leonardus (2016) -
An improved CMP process for integration of high mobility channel materials
Teugels, Lieve; Ong, Patrick; Ansar, Sheik; Delande, Tinne; Bhonsle, Rithu; Siebert, Max; Garcia Romero, Ivan; Struyf, Herbert; Leunissen, Leonardus (2016) -
An InGaAs/InP quantum well FinFET using the replacement fin process integrated in an RMG flow on 300mm Si substrates
Waldron, Niamh; Merckling, Clement; Guo, Weiming; Ong, Patrick; Teugels, Lieve; Ansar, Sheikh; Tsvetanova, Diana; Sebaai, Farid; van Dorp, Dennis; Milenin, Alexey; Lin, Dennis; Nyns, Laura; Mitard, Jerome; Pourghaderi, Mohammad Ali; Douhard, Bastien; Richard, Olivier; Bender, Hugo; Boccardi, Guillaume; Caymax, Matty; Heyns, Marc; Vandervorst, Wilfried; Barla, Kathy; Collaert, Nadine; Thean, Aaron (2014) -
CMP of Ge for high mobility channels
Ong, Patrick; Witters, Liesbeth; Leunissen, Peter (2010) -
CMP of novel materials
Ong, Patrick; Kellens, Kristof; Chiodarelli, Nicolo; Meuris, Marc; Leunissen, Peter (2009) -
CMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries
Ong, Patrick; Siebert, Max; Huang, Kevin; Teugels, Lieve; Ansar, Sheik; Leunissen, Peter (2014) -
CMP on SiGe materials – linking chemical and physical properties to design low defect and selective slurries
Ong, Patrick; Siebert, Max; Leunissen, Leonardus H. A.; Ibrahim, Sheikh Ansar Usman; Teugels, Lieve (2014) -
CMP process development for high mobility channel materials
Ong, Patrick; Gillot, C.; Ansar, S.; Noller, B.; Li, Y. (2012) -
CMP Slurries for germanium substrates in FEOL applications
Ong, Patrick; Siebert, Joerg Max; Noller, Bastian; Lan, Yongqing; Lauter, Michael; Proells, Julian; Huang, Kevin; Usman Ibrahim, Sheik Ansar (2013) -
Cu/Low-k thickness measurement for advanced Cu CMP process development and control
Li, Yunlong; Heylen, Nancy; Delande, Tinne; Kellens, Kristof; Ong, Patrick; Leunissen, Peter; Tarnowka, Alexandre; Eliyahu, Aviv (2009-03) -
Defect-free isolation on high-thermal-conductivity SOI substrates for complementary BiCMOS technology
Van Wichelen, Koen; Ong, Patrick; Moussa, Alain; Radisic, Dunja; Devriendt, Katia; Halder, Sandip; Kenis, Karine; Lee, Willie; Vandevelde, Bart; Soonekindt, Christophe; Shahar, Abdul Hadi; Smet, Tom; Van Huylenbroeck, Stefaan; Decoutere, Stefaan; Seacrist, Mike; Ries, Mike; Drobny, Vladimir; Wise, Rick (2009) -
Demonstration of scaled 0.099μm² FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology
Veloso, Anabela; Demuynck, Steven; Ercken, Monique; Goethals, Mieke; Locorotondo, Sabrina; Lazzarino, Frederic; Altamirano Sanchez, Efrain; Huffman, Craig; De Keersgieter, An; Brus, Stephan; Demand, Marc; Struyf, Herbert; De Backer, Johan; Hermans, Jan; Delvaux, Christie; Baudemprez, Bart; Vandeweyer, Tom; Van Roey, Frieda; Baerts, Christina; Goossens, Danny; Dekkers, Harold; Ong, Patrick; Heylen, Nancy; Kellens, Kristof; Volders, Henny; Hikavyy, Andriy; Vrancken, Christa; Rakowski, Michal; Verhaegen, Staf; Dusa, Mircea; Romijn, Leon; Pigneret, Charles; van Dijk, Andre; Schreutelkamp, Rob; Cockburn, Andrew; Gravey, Virginie; Meiling, H.; Hultermans, B.; Lok, S.; Shah, K.; Rajagopalan, R.; Gelatos, J.; Richard, Olivier; Bender, Hugo; Vandenberghe, Geert; Beyer, Gerald; Absil, Philippe; Hoffmann, Thomas Y.; Ronse, Kurt; Biesemans, Serge (2009-12) -
Development of a dielectric CMP process for replacement gate applications
Devriendt, Katia; Ong, Patrick; Kellens, Kristof; Veloso, Anabela; Crabbe, Yvo; Brus, Stephan; Claes, Martine; Leunissen, Peter (2010) -
Dummy design characterization for STI CMP with fixed abrasive
Tsvetanova, Diana; Devriendt, Katia; Ong, Patrick; Vandeweyer, Tom; Delande, Tinne; Chew, Soon Aik; Horiguchi, Naoto; Struyf, Herbert (2014-11) -
Dummy gate amorphous silicon CMP using in-situ profile CLC endpoint system for advanced FinFET
Tsvetanova, Diana; Iizumi, Takeshi; Ito, Ban; Royere, Gael; Durix, Fabien; Devriendt, Katia; Ong, Patrick; Struyf, Herbert (2017) -
First demonstration of MOVPE In1-xGaxAs macaroni channel for 3-D NAND memory devices
Ramesh, Siva; Vadakupudhu Palayam, Senthil; Rosseel, Erik; Arreghini, Antonio; Kunert, Bernardette; Baryshnikova, Marina; Zhang, Liping; Ong, Patrick; Teugels, Lieve; Pak, Murat; Jossart, Nico; Raymaekers, Tom; Stiers, Jimmy; Van den Bosch, Geert; Furnemont, Arnaud (2019)