Recently added

Time synchronization with channel hopping scheme for LoRa networks

Singh, Akash; Berkvens, Rafael; Weyn, Maarten (2020)

On the Correlation Between Static and Low-Frequency Noise Parameters of Vertical Nanowire nMOSFETs

Simoen, Eddy; Vaisman Chasin, Adrian; Matagne, Philippe; Rosseel, Erik; Hikavyy, Andriy; Loo, Roger; Favia, Paola; Bender, Hugo; Vancoille, Eric; Horiguchi, Naoto; Veloso, Anabela (2020-05)

On the correlation between static and low-frequency noise parameters of vertical nanowire nMOSFETs

Simoen, Eddy; Vaisman Chasin, Adrian; Matagne, Philippe; Rosseel, Erik; Hikavyy, Andriy; Loo, Roger; Favia, Paola; Bender, Hugo; Vancoille, Eric; Veloso, Anabela (2020)

Materials and defect aspects of III-V and III-N devices for high-speed analog/RF applications

Simoen, Eddy; Hsu, Brent; Yu, Hao; Wang, Hongyue; Zhao, Ming; Takakura, Kenichiro; Putcha, Vamsi; Peralagu, Uthayasankaran; Parvais, Bertrand; Waldron, Niamh; Collaert, Nadine (2020)

Optimization of wafer-level low-impedance contact CDM testers

Simicic, Marko; Wu, Wei-Min; Jack, Nathan; Tamura, Shinichi; Shimada, Yohei; Sawada, Masanori; Chen, Shih-Hung (2020-11)

A set based design method using bayesian active learning

Shintani, K.; Sugai, T.; Ishizaki, K.; Knudde, Nicolas; Couckuyt, Ivo; Dhaene, Tom (2020)

Hardware-accelerator aware VNF-chain recovery

Sharma, Prateek Sharma; Tavernier, Wouter; Colle, Didier; Pickavet, Mario (2020)

Improving resource utilization with virtual media function decomposition

Sharma, Gourav Prateek; Colle, Didier; Tavernier, Wouter; Pickavet, Mario (2020)

Experimental investigation into SLS glass surface modification using KrF excimer laser

Shahryar, Nateh; Vijverman, Pieter; Missinne, Jeroen; Belis, Jan (2020)

Evaluating latchup (LU) risk in advanced CMOS technologies

Serbulova, Kateryna; Groeseneken, Guido; Chen, Shih-Hung; Hellings, Geert (2020)

Towards information-centric edge platform for mesh networks : the case of CityLab testbed

Selimi, Mennan; Freitag, Felix; Navarro, Leandro; Braem, Bart (2020)

Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices

Seema Saseendran, Sandeep; Paneri, Abhilash; Tobback, Bert; Kutrzeba Kotowska, Bogumila; Vecchio, Emma; Jamieson, Geraldine; Paraschiv, Vasile; Figeys, Bruno; Suh, Hyo Seon; Sabuncuoglu Tezcan, Deniz; Takahashi, Kohei; Fujikane, Masaki; Himeno, Atsushi; Nakamura, Kunihiko; Tambo, Naoki; Nakata, Yuki; Tanaka, Hiroyuki; Naito, Yasuyuki (2020)

Towards country scale photovoltaic energy yield modelling

Schils, A.; Clymans, W.; Duchene, F.; Horvath, Imre T; Uljee, I.; Meinke-Hubeny, F.; Cathoor, F.; Voroshazi, Eszter; Meuris, Marc (2020)

Standardization of holographic compression: JPEG Pleno

Schelkens, Peter; Gilles, Antonin; Saeed, Mahmoudpour; Oh, Kwan-Jung; Perra, Cristian; Pinheiro, Antonio (2020)

The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation

Schaubroeck, David; Li, Changzheng; Verplancke, Rik; Cuypers, Dieter; Cauwe, Maarten; Op de Beeck, Maaike (2020)

Conference contributions: Recent submissions

Time synchronization with channel hopping scheme for LoRa networks

On the Correlation Between Static and Low-Frequency Noise Parameters of Vertical Nanowire nMOSFETs

On the correlation between static and low-frequency noise parameters of vertical nanowire nMOSFETs

Materials and defect aspects of III-V and III-N devices for high-speed analog/RF applications

Optimization of wafer-level low-impedance contact CDM testers

A set based design method using bayesian active learning

Hardware-accelerator aware VNF-chain recovery

Improving resource utilization with virtual media function decomposition

Experimental investigation into SLS glass surface modification using KrF excimer laser

Evaluating latchup (LU) risk in advanced CMOS technologies

Towards information-centric edge platform for mesh networks : the case of CityLab testbed

Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices

Towards country scale photovoltaic energy yield modelling

Standardization of holographic compression: JPEG Pleno

The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation

Investigation of semi-vertical GaN FET structures function using EBIC method

Progression of logic device and DTCO to enable advance scaling

Effect of inductively coupled electro-magnetic field on bottom oxide etch in a high aspect ratio trench

Effect of inductively coupled electro-magnetic field on bottom oxide etch in a high aspect ratio trench

On the feasibility of location-based discovery and vertical handover in IEEE 802.11ah

Conference contributions: Recent submissions

Time synchronization with channel hopping scheme for LoRa networks ﻿

On the Correlation Between Static and Low-Frequency Noise Parameters of Vertical Nanowire nMOSFETs ﻿

On the correlation between static and low-frequency noise parameters of vertical nanowire nMOSFETs ﻿

Materials and defect aspects of III-V and III-N devices for high-speed analog/RF applications ﻿

Optimization of wafer-level low-impedance contact CDM testers ﻿

A set based design method using bayesian active learning ﻿

Hardware-accelerator aware VNF-chain recovery ﻿

Improving resource utilization with virtual media function decomposition ﻿

Experimental investigation into SLS glass surface modification using KrF excimer laser ﻿

Evaluating latchup (LU) risk in advanced CMOS technologies ﻿

Towards information-centric edge platform for mesh networks : the case of CityLab testbed ﻿

Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices ﻿

Towards country scale photovoltaic energy yield modelling ﻿

Standardization of holographic compression: JPEG Pleno ﻿

The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation ﻿

Investigation of semi-vertical GaN FET structures function using EBIC method ﻿

Progression of logic device and DTCO to enable advance scaling ﻿

Effect of inductively coupled electro-magnetic field on bottom oxide etch in a high aspect ratio trench ﻿

Effect of inductively coupled electro-magnetic field on bottom oxide etch in a high aspect ratio trench ﻿

On the feasibility of location-based discovery and vertical handover in IEEE 802.11ah ﻿

Time synchronization with channel hopping scheme for LoRa networks

On the Correlation Between Static and Low-Frequency Noise Parameters of Vertical Nanowire nMOSFETs

On the correlation between static and low-frequency noise parameters of vertical nanowire nMOSFETs

Materials and defect aspects of III-V and III-N devices for high-speed analog/RF applications

Optimization of wafer-level low-impedance contact CDM testers

A set based design method using bayesian active learning

Hardware-accelerator aware VNF-chain recovery

Improving resource utilization with virtual media function decomposition

Experimental investigation into SLS glass surface modification using KrF excimer laser

Evaluating latchup (LU) risk in advanced CMOS technologies

Towards information-centric edge platform for mesh networks : the case of CityLab testbed

Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices

Towards country scale photovoltaic energy yield modelling

Standardization of holographic compression: JPEG Pleno

The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation

Investigation of semi-vertical GaN FET structures function using EBIC method

Progression of logic device and DTCO to enable advance scaling

Effect of inductively coupled electro-magnetic field on bottom oxide etch in a high aspect ratio trench

Effect of inductively coupled electro-magnetic field on bottom oxide etch in a high aspect ratio trench

On the feasibility of location-based discovery and vertical handover in IEEE 802.11ah