Recently added

Growth of Wurtzite InAs nanowires on Si (111) substrates by selective area MOVPE

Liu, Ziyang; Merckling, Clement; Caymax, Matty; Rooyackers, Rita; Veloso, Anabela; Richard, Olivier; Bender, Hugo; Collaert, Nadine; Thean, Aaron; Vandervorst, Wilfried; Heyns, Marc (2015)

Defect characterization after ESD stress: merging TLP and Pulsed-IV techniques

Linten, Dimitri; Ji, Zhigang; Boschke, Roman; Hellings, Geert; Chen, Shih-Hung; Scholz, Mirko; Alian, AliReza; Collaert, Nadine; Thean, Aaron (2015)

ESD reliability of FinFETs and 3D ICs

Linten, Dimitri (2015-07)

Feasibility study of grapho-epitaxy DSA for complementing EUV lithography beyond N10

Lin, Chenxi; Zou, Yi; Ambesi, Davide; Druzhinina, Tamara; Wuister, Sander; Karageorgos, Ioannis; Ryckaert, Julien; Raghavan, Praveen; Gronheid, Roel (2015)

N-junctionless transistor prototype: manufacturing using a focused ion beam system

Lima, Lucas Petersen Barbosa; Puydinger dos Santos, M.V.; Keiler, M.A.; Dekkers, Harold; De Gendt, Stefan; Diniz, Jose (2015)

Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below

Li, Yunlong; Van Huylenbroeck, Stefaan; Roussel, Philippe; Brouri, Mohand; Gopinath, Sanjay; Anjos, Daniela M.; Thorum, Matthew; Yu, Jengyi; Beyer, Gerald; Beyne, Eric; Croes, Kristof (2015)

Process simplification and improvement of rear side of IBC cells by means of PECVD SiOx and epitaxy

Li, Yuandong; Recaman Payo, Maria; Zielinski, Bartosz; Debucquoy, Maarten; Poortmans, Jef (2015)

Plasmonic-fluidic hybrid nanopores

Li, Yi; Chen, Chang; Jonsson, Magnus; Nicoli, Francesca; Willems, Kherim; Kerman, Sarp; Lagae, Liesbet; Groeseneken, Guido; Stakenborg, Tim; Zandbergen, Henny; Dekker, Cees; Van Dorpe, Pol (2015)

An ELISA-based amperometric biosensor within a photo-patternable adhesive microfluidic channel

Li, Yan; Van Roy, Wim; Vereecken, Philippe; Lagae, Liesbet (2015)

An energy efficient 18Gbps LDPC decoding processor for 802.11ad in 28nm CMOS

Li, Meng; Weijers, Jan-Willem; Derudder, Veerle; Vos, Ilse; Rykunov, Maxim; Dupont, Steven; Debacker, Peter; Dewilde, Andy; Huang, Yanxiang; Van der Perre, Liesbet; Van Thillo, Wim (2015)

Design rules for nanoplasmonic biosensors: distinguishing bulk and surface sensitivities

Li, Jiaqi; Chen, Chang; Verellen, Niels; Li, Yi; Ryken, Jef; Jans, Hilde; Van Roy, Wim; Moshchalkov, Victor; Lagae, Liesbet; Van Dorpe, Pol (2015)

<30 MW rectangular-to-polar conversion processor in 802.11AD polar transmitter

Li, Chunshu; Bourdoux, André; Verhelst, Marian; Huang, Yanxiang; Li, Min; Van der Perre, Liesbet; Pollin, Sofie (2015)

Experimentally demonstrate the origin for asymmetric resonance splitting and contributions from couplers to backscattering in SOI microrings

Li, Ang; Van Vaerenbergh, Thomas; De Heyn, Peter; Xing, Yufei; Bienstman, Peter; Bogaerts, Wim (2015)

Conference contributions: Recent submissions

Growth of Wurtzite InAs nanowires on Si (111) substrates by selective area MOVPE

Defect characterization after ESD stress: merging TLP and Pulsed-IV techniques

ESD reliability of FinFETs and 3D ICs

Feasibility study of grapho-epitaxy DSA for complementing EUV lithography beyond N10

N-junctionless transistor prototype: manufacturing using a focused ion beam system

Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below

Process simplification and improvement of rear side of IBC cells by means of PECVD SiOx and epitaxy

Plasmonic-fluidic hybrid nanopores

An ELISA-based amperometric biosensor within a photo-patternable adhesive microfluidic channel

An energy efficient 18Gbps LDPC decoding processor for 802.11ad in 28nm CMOS

Design rules for nanoplasmonic biosensors: distinguishing bulk and surface sensitivities

<30 MW rectangular-to-polar conversion processor in 802.11AD polar transmitter

Experimentally demonstrate the origin for asymmetric resonance splitting and contributions from couplers to backscattering in SOI microrings

A method of image-based aberration metrology for EUVL tools

Cryoetching processes applied to ULK material

Cryogenic etching of porous organosilicate low-k materials: fluorine based plasma analysis

Cryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage

Silicon photonics biosensing: different packaging platforms and apllication possibilities

Overlay metrology solutions in a triple patterning scheme

Hybrid overlay metrology with CDSEM in a BEOL patterning scheme

Conference contributions: Recent submissions

Growth of Wurtzite InAs nanowires on Si (111) substrates by selective area MOVPE ﻿

Defect characterization after ESD stress: merging TLP and Pulsed-IV techniques ﻿

ESD reliability of FinFETs and 3D ICs ﻿

Feasibility study of grapho-epitaxy DSA for complementing EUV lithography beyond N10 ﻿

N-junctionless transistor prototype: manufacturing using a focused ion beam system ﻿

Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below ﻿

Process simplification and improvement of rear side of IBC cells by means of PECVD SiOx and epitaxy ﻿

Plasmonic-fluidic hybrid nanopores ﻿

An ELISA-based amperometric biosensor within a photo-patternable adhesive microfluidic channel ﻿

An energy efficient 18Gbps LDPC decoding processor for 802.11ad in 28nm CMOS ﻿

Design rules for nanoplasmonic biosensors: distinguishing bulk and surface sensitivities ﻿

<30 MW rectangular-to-polar conversion processor in 802.11AD polar transmitter ﻿

Experimentally demonstrate the origin for asymmetric resonance splitting and contributions from couplers to backscattering in SOI microrings ﻿

A method of image-based aberration metrology for EUVL tools ﻿

Cryoetching processes applied to ULK material ﻿

Cryogenic etching of porous organosilicate low-k materials: fluorine based plasma analysis ﻿

Cryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage ﻿

Silicon photonics biosensing: different packaging platforms and apllication possibilities ﻿

Overlay metrology solutions in a triple patterning scheme ﻿

Hybrid overlay metrology with CDSEM in a BEOL patterning scheme ﻿

Growth of Wurtzite InAs nanowires on Si (111) substrates by selective area MOVPE

Defect characterization after ESD stress: merging TLP and Pulsed-IV techniques

ESD reliability of FinFETs and 3D ICs

Feasibility study of grapho-epitaxy DSA for complementing EUV lithography beyond N10

N-junctionless transistor prototype: manufacturing using a focused ion beam system

Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below

Process simplification and improvement of rear side of IBC cells by means of PECVD SiOx and epitaxy

Plasmonic-fluidic hybrid nanopores

An ELISA-based amperometric biosensor within a photo-patternable adhesive microfluidic channel

An energy efficient 18Gbps LDPC decoding processor for 802.11ad in 28nm CMOS

Design rules for nanoplasmonic biosensors: distinguishing bulk and surface sensitivities

<30 MW rectangular-to-polar conversion processor in 802.11AD polar transmitter

Experimentally demonstrate the origin for asymmetric resonance splitting and contributions from couplers to backscattering in SOI microrings

A method of image-based aberration metrology for EUVL tools

Cryoetching processes applied to ULK material

Cryogenic etching of porous organosilicate low-k materials: fluorine based plasma analysis

Cryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage

Silicon photonics biosensing: different packaging platforms and apllication possibilities

Overlay metrology solutions in a triple patterning scheme

Hybrid overlay metrology with CDSEM in a BEOL patterning scheme