Recently added

Automated testing of bare die-to-die stacks

Marinissen, Erik Jan; De Wachter, Bart; Wang, Teng; Fiedler, Jens; Kiesewetter, Joerg; Stoll, Karsten (2015-05)

Automated testing of bare die-to-die stacks

Marinissen, Erik Jan; De Wachter, Bart; Wang, Teng; Fiedler, Jens; Kiesewetter, Joerg; Stoll, Karsten (2015-10)

Direct comparison of GaN-based e-mode architectures (recessed MISHEMT and p-GaN HEMTs) processed on 200mm GaN-on-Si with Au-free technology

Marcon, Denis; Van Hove, Marleen; De Jaeger, Brice; Posthuma, Niels; Wellekens, Dirk; You, Shuzhen; Kang, Xuanwu; Wu, Tian-Li; Willems, Maarten; Stoffels, Steve; Decoutere, Stefaan (2015)

200mm GaN-on-Si epitaxy and e-mode device technology

Marcon, Denis; Saripalli, Yoga; Decoutere, Stefaan (2015)

Capacitive micromachined ultrasonic transducers for acoustic manipulation

Mao, Shengping; Zhong, Kuo; Rochus, Veronique; Severi, Simone; Nauwelaers, Bart; Tilmans, Harrie; Rottenberg, Xavier (2015)

A 3D electrical characterization of single stacking faults in InP by conductive-AFM

Mannarino, Manuel; Celano, Umberto; Lu, Augustin; Chintala, Ravi Chandra; Paredis, Kristof; Vandervorst, Wilfried (2015)

Maintaining Moore's law: enabling cost-friendly dimensional scaling

Mallik, Arindam; Ryckaert, Julien; Mercha, Abdelkarim; Verkest, Diederik; Ronse, Kurt; Thean, Aaron (2015)

A 150 kHz-80 MHz BW DT analog baseband for SDR RX using a 5th-order IIR LPF, active FIR and 10b 300 MS/s ADC in 28nm CMOS

Malki, Badr; Verbruggen, Bob; Martens, Ewout; Wambacq, Piet; Craninckx, Jan (2015)

True-color 640 ppi OLED arrays patterned by CA i-line photolithography

Malinowski, Pawel; Ke, Tung Huei; Nakamura, Atsushi; Chang, Camy; Gokhale, Pritesh; Steudel, Soeren; Janssen, Dimitri; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Heremans, Paul (2015)

Organic photodetectors with active layer patterned by lithography

Malinowski, Pawel; Georgitzikis, Epimitheas; Salas Redondo, Caterin; Cheyns, David; Steudel, Soeren; Schols, Sarah; Heremans, Paul (2015)

Two step silicon microfluidics for capillary valve applications

Majeed, Bivragh; Taher, Ahmed; Jones, Ben; Sabuncuoglu Tezcan, Deniz (2015)

3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications

Maggioni, Federica; Oprins, Herman; Milojevic, Dragomir; Beyne, Eric; De Wolf, Ingrid; Baelmans, Martine (2015)

Directed self-assembly (DSA) grapho-epitaxy template generation with immersion lithography

Ma, Yuansheng; Lei, Junjiang; Torres, J. Andres; Hong, Le; Word, James; Fenger, Germain; Tritchkov, Alexander; Lippincott, George; Gupta, Rachit; Lafferty, Neal; He, Yuan; Bekaert, Joost; Vandenberghe, Geert (2015)

AC NBTI of Ge pMOSFETs: impact of energy alternating defects on lifetime prediction

Ma, J.; Zhang, W.; Zhang, J.F.; Ji, Z.; Benbakhti, B.; Franco, Jacopo; Mitard, Jerome; Witters, Liesbeth; Collaert, Nadine; Groeseneken, Guido (2015)

Modeling EUV mask using alternative materials for mask 3D effect compensation

Luong, Vu; Philipsen, Vicky; Verduijn, Erik; Scholze, Frank; Hendrickx, Eric; Heyns, Marc; Wood, Obert (2015)

First-principles study of the performance degradation of 2D channel-based transistors with sub-10 nm gate lengths

Lu, Augustin; Pourtois, Geoffrey; Stokbro, Kurt; Thean, Aaron; Radu, Iuliana; Houssa, Michel (2015)

Influence of etch process on contact hole local critical dimension uniformity in extreme-ultraviolet lithography

Lorusso, Gian; Mao, Ming; Reijnen, Liesbeth; Viatkina, Katja; Knops, Roel; Fliervoet, Timon (2015)

Effect of VUV photons on low-k OSG damage and etching by F atoms at the lowered temperature

Lopaev, D; Rakhimova, T; Mankelevich, Y; Kurchikov, K.; Zyryanov, S.; Zotovich, A.; Baklanov, Mikhaïl (2015)

Ge epitaxial layer growth on Si in ultra narrow STI patterned structures

Loo, Roger; Hikavyy, Andriy; Sun, Jianwu; Bender, Hugo; Thean, Aaron (2015-05)

Chip package interaction: A stress analysis on 3D IC's packages

Lofrano, Melina; Gonzalez, Mario; Guo, Wei; Van der Plas, Geert (2015)

Conference contributions: Recent submissions

Automated testing of bare die-to-die stacks ﻿

Automated testing of bare die-to-die stacks ﻿

Direct comparison of GaN-based e-mode architectures (recessed MISHEMT and p-GaN HEMTs) processed on 200mm GaN-on-Si with Au-free technology ﻿

200mm GaN-on-Si epitaxy and e-mode device technology ﻿

Capacitive micromachined ultrasonic transducers for acoustic manipulation ﻿

A 3D electrical characterization of single stacking faults in InP by conductive-AFM ﻿

Maintaining Moore's law: enabling cost-friendly dimensional scaling ﻿

A 150 kHz-80 MHz BW DT analog baseband for SDR RX using a 5th-order IIR LPF, active FIR and 10b 300 MS/s ADC in 28nm CMOS ﻿

True-color 640 ppi OLED arrays patterned by CA i-line photolithography ﻿

Organic photodetectors with active layer patterned by lithography ﻿

Two step silicon microfluidics for capillary valve applications ﻿

3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications ﻿

Directed self-assembly (DSA) grapho-epitaxy template generation with immersion lithography ﻿

AC NBTI of Ge pMOSFETs: impact of energy alternating defects on lifetime prediction ﻿

Modeling EUV mask using alternative materials for mask 3D effect compensation ﻿

First-principles study of the performance degradation of 2D channel-based transistors with sub-10 nm gate lengths ﻿

Influence of etch process on contact hole local critical dimension uniformity in extreme-ultraviolet lithography ﻿

Effect of VUV photons on low-k OSG damage and etching by F atoms at the lowered temperature ﻿

Ge epitaxial layer growth on Si in ultra narrow STI patterned structures ﻿

Chip package interaction: A stress analysis on 3D IC's packages ﻿

Automated testing of bare die-to-die stacks

Automated testing of bare die-to-die stacks

Direct comparison of GaN-based e-mode architectures (recessed MISHEMT and p-GaN HEMTs) processed on 200mm GaN-on-Si with Au-free technology

200mm GaN-on-Si epitaxy and e-mode device technology

Capacitive micromachined ultrasonic transducers for acoustic manipulation

A 3D electrical characterization of single stacking faults in InP by conductive-AFM

Maintaining Moore's law: enabling cost-friendly dimensional scaling

A 150 kHz-80 MHz BW DT analog baseband for SDR RX using a 5th-order IIR LPF, active FIR and 10b 300 MS/s ADC in 28nm CMOS

True-color 640 ppi OLED arrays patterned by CA i-line photolithography

Organic photodetectors with active layer patterned by lithography

Two step silicon microfluidics for capillary valve applications

3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications

Directed self-assembly (DSA) grapho-epitaxy template generation with immersion lithography

AC NBTI of Ge pMOSFETs: impact of energy alternating defects on lifetime prediction

Modeling EUV mask using alternative materials for mask 3D effect compensation

First-principles study of the performance degradation of 2D channel-based transistors with sub-10 nm gate lengths

Influence of etch process on contact hole local critical dimension uniformity in extreme-ultraviolet lithography

Effect of VUV photons on low-k OSG damage and etching by F atoms at the lowered temperature

Ge epitaxial layer growth on Si in ultra narrow STI patterned structures

Chip package interaction: A stress analysis on 3D IC's packages