Recently added

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface

Marinissen, Erik Jan; De Wachter, Bart; Smith, Ken; Kiesewetter, Joerg; Taouil, Mottaqiallah; Hamdioui, Said (2014-10)

Imec's 3D-DfT architecture: basics, extensions, and demonstrator results

Marinissen, Erik Jan; De Wachter, Bart; O'Loughlin, Stephen; Deutsch, Sergej; Papameletis, Christos; Burgherr, Tobias (2014-06)

A 3D-DfT demonstrator

Marinissen, Erik Jan; De Wachter, Bart; O'Loughlin, Stephen; Deutsch, Sergej; Papameletis, Christos; Burgherr, Tobias (2014-05)

Vesuvius-3D: A 3D-DfT demonstrator

Marinissen, Erik Jan; De Wachter, Bart; O'Loughlin, Stephen; Deutsch, Sergej; Papameletis, Christos; Burgherr, Tobias (2014-10)

A 3D-DfT demonstrator

Marinissen, Erik Jan; De Wachter, Bart; O'Loughlin, Stephen; Deutsch, Sergej; Papameletis, Christos; Burgherr, Tobias (2014-06)

Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack

Marinissen, Erik Jan; De Wachter, Bart; O'Loughlin, Stephen; Deutsch, Sergej; Papameletis, Christos; Burgherr, Tobias (2014-05)

IEEE P1838: What is it and What is it not?

Marinissen, Erik Jan (2014-10)

FEM simulation and measurement validation of a cMUT cell

Mao, Shengping; Rottenberg, Xavier; Rochus, Veronique; Nauwelaers, Bart; Tilmans, Harrie (2014)

Transmit and receive of a cMUT cell: Modeling and experiments

Mao, Shengping; Rottenberg, Xavier; Rochus, Veronique; Helin, Philippe; Verbist, Agnes; Severi, Simone; Nauwelaers, Bart; Tilmans, Harrie (2014)

Characterization of InP growth in nm-sized trenches by a combination of NC-AFM and STM

Mannarino, Manuel; Eyben, Pierre; Chintala, Ravi Chandra; Merckling, Clement; van Dorp, Dennis; Vandervorst, Wilfried (2014)

A novel approach of using STM and NC-AFM to study narrow trenches in an oxide matrix

Mannarino, Manuel; Chintala, Ravi Chandra; Eyben, Pierre; Vandervorst, Wilfried (2014)

Etch development for E-mode GaN power HEMT fabrication

Mannaert, Geert; Posthuma, Niels; De Jaeger, Brice; Van Hove, Marleen; Xu, Kaidong; Decoutere, Stefaan; Paraschiv, Vasile (2014)

Feasibility of compensating for EUV field edge effects through OPC

Maloney, Chris; Word, James; Fenger, Germain; Niroomand, Ardavan; Lorusso, Gian; Jonckheere, Rik; Hendrickx, Eric; Smith, Bruce (2014)

The economic impact of EUV lithography on critical process modules

Mallik, Arindam; Horiguchi, Naoto; Boemmels, Juergen; Thean, Aaron; Barla, Kathy; Vandenberghe, Geert; Ronse, Kurt; Ryckaert, Julien; Mercha, Abdelkarim; Altimime, Laith; Verkest, Diederik; Steegen, An (2014)

A complementary dynamic residue amplifier for a 67 dB SNDR 1.36 mW 170 MS/s pipelined SAR ADC

Malki, Badr; Verbruggen, Bob; Wambacq, Piet; Deguchi, Kazuaki; Iriguchi, Masao; Craninckx, Jan (2014)

Patterning of multicolor OLEDs with ultra-high resolution by photolithography

Malinowski, Pawel; Ke, Tung Huei; Nakamura, Atsushi; Steudel, Soeren; Janssen, Dimitri; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Heremans, Paul (2014)

Microbumping technology for hybrid IR detectors, 10 $lm pitch and beyond

Majeed, Bivragh; Soussan, Philippe; Le Boterf, P.; Bouillon, P. (2014)

Fabrication of silicon based microfluidics device for cell sorting applications

Majeed, Bivragh; Liu, Chengxun; Van Acker, Lut; Daily, Robert; Miyazaki, Tomokazu; Sabuncuoglu Tezcan, Deniz; Lagae, Liesbet (2014)

Metal1 patterning study for randon-logic applications with 193i, using calibrated OPC for litho and etch

Mailfert, Julien; Van de Kerkhove, Jeroen; De Bisschop, Peter; De Meyer, Kristin (2014)

Quantum diffusion and entropy production: an exactly solvable model

Magnus, Wim; Nelissen, Kwinten (2014)

Conference contributions: Recent submissions

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface ﻿

Imec's 3D-DfT architecture: basics, extensions, and demonstrator results ﻿

A 3D-DfT demonstrator ﻿

Vesuvius-3D: A 3D-DfT demonstrator ﻿

A 3D-DfT demonstrator ﻿

Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack ﻿

IEEE P1838: What is it and What is it not? ﻿

FEM simulation and measurement validation of a cMUT cell ﻿

Transmit and receive of a cMUT cell: Modeling and experiments ﻿

Characterization of InP growth in nm-sized trenches by a combination of NC-AFM and STM ﻿

A novel approach of using STM and NC-AFM to study narrow trenches in an oxide matrix ﻿

Etch development for E-mode GaN power HEMT fabrication ﻿

Feasibility of compensating for EUV field edge effects through OPC ﻿

The economic impact of EUV lithography on critical process modules ﻿

A complementary dynamic residue amplifier for a 67 dB SNDR 1.36 mW 170 MS/s pipelined SAR ADC ﻿

Patterning of multicolor OLEDs with ultra-high resolution by photolithography ﻿

Microbumping technology for hybrid IR detectors, 10 $lm pitch and beyond ﻿

Fabrication of silicon based microfluidics device for cell sorting applications ﻿

Metal1 patterning study for randon-logic applications with 193i, using calibrated OPC for litho and etch ﻿

Quantum diffusion and entropy production: an exactly solvable model ﻿

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface

Imec's 3D-DfT architecture: basics, extensions, and demonstrator results

A 3D-DfT demonstrator

Vesuvius-3D: A 3D-DfT demonstrator

A 3D-DfT demonstrator

Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack

IEEE P1838: What is it and What is it not?

FEM simulation and measurement validation of a cMUT cell

Transmit and receive of a cMUT cell: Modeling and experiments

Characterization of InP growth in nm-sized trenches by a combination of NC-AFM and STM

A novel approach of using STM and NC-AFM to study narrow trenches in an oxide matrix

Etch development for E-mode GaN power HEMT fabrication

Feasibility of compensating for EUV field edge effects through OPC

The economic impact of EUV lithography on critical process modules

A complementary dynamic residue amplifier for a 67 dB SNDR 1.36 mW 170 MS/s pipelined SAR ADC

Patterning of multicolor OLEDs with ultra-high resolution by photolithography

Microbumping technology for hybrid IR detectors, 10 $lm pitch and beyond

Fabrication of silicon based microfluidics device for cell sorting applications

Metal1 patterning study for randon-logic applications with 193i, using calibrated OPC for litho and etch

Quantum diffusion and entropy production: an exactly solvable model