Recently added

Electrochemical processing of carbon nanostructures

Vereecken, Philippe; Radisic, Alex; Cott, Daire (2013)

Conformal deposition For 3D thin-film batteries

Vereecken, Philippe; Huyghebaert, Cedric (2013)

Conformal deposition for3D thin-film batteries

Vereecken, Philippe (2013)

Wetting behavior of aqueous solutions on high aspect ratio nanopillars with hydrophilic surface finish

Vereecke, Guy; Xu, XiuMei; Tsai, Wei-Kang; Yang, Hui; Armini, Silvia; Delande, Tinne; Doumen, Geert; Kentie, Frank; Shi, Xiaoping; Simms, Ihsan; Nafus, Kathleen; Holsteyns, Frank; Struyf, Herbert; De Gendt, Stefan (2013)

Wetting behavior of aqueous solutions on high aspect ratio nanopillars with hydrophilic surface finish

Vereecke, Guy; Xu, XiuMei; Tsai, Wei-Kang; Armini, Silvia; Delande, Tinne; Doumen, Geert; Kentie, Frank; Shi, Xiaoping; Holsteyns, Frank; Struyf, Herbert; De Gendt, Stefan (2013)

Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young�s modulus

Verdonck, Patrick; Wang, Cong; Souriau, Laurent; Vanstreels, Kris; Baklanov, Mikhaïl (2013)

A 2.1 mW 11b 410 MS/s dynamic pipelined SAR ADC with background calibrationn in 28nm digital CMOS

Verbruggen, Bob; Iriguchi, Masao; de la Guia, Manuel; Glorieux, Guy; Deguchi, Kazuaki; Malki, Badr; Craninckx, Jan (2013)

Integration challenges and options of replacement high-k/metal gate technology for (Sub-)22nm technology nodes

Veloso, Anabela; Ragnarsson, Lars-Ake; Schram, Tom; Chew, Soon Aik; Boccardi, Guillaume; Thean, Aaron; Horiguchi, Naoto (2013)

Highly scalable effective work function engineering approach for multi-VT modulation of planar and FinFET-based RMG high-k last devies for (sub-)22nm nodes

Veloso, Anabela; Boccardi, Guillaume; Ragnarsson, Lars-Ake; Higuchi, Yuichi; Lee, Jae Won; Simoen, Eddy; Roussel, Philippe; Cho, Moon Ju; Chew, Soon Aik; Schram, Tom; Dekkers, Harold; Van Ammel, Annemie; Witters, Thomas; Brus, Stephan; Dangol, Anish; Paraschiv, Vasile; Vecchio, Emma; Shi, Xiaoping; Sebaai, Farid; Kellens, Kristof; Heylen, Nancy; Devriendt, Katia; Richard, Olivier; Bender, Hugo; Chiarella, Thomas; Arimura, Hiroaki; Thean, Aaron; Horiguchi, Naoto (2013)

Thermal and SF6-plasma treatments for improved (sub-)1nm EOT planar and FinFET-based RMG high-k last devices and enabling a simplified scalable CMOS integration scheme

Veloso, Anabela; Boccardi, Guillaume; Ragnarsson, Lars-Ake; Higuchi, Yuichi; Arimura, Hiroaki; Lee, Jae Woo; Simoen, Eddy; Cho, Moon Ju; Roussel, Philippe; Paraschiv, Vasile; Shi, Xiaoping; Schram, Tom; Chew, Soon Aik; Brus, Stephan; Dangol, Anish; Vecchio, Emma; Sebaai, Farid; Kellens, Kristof; Heylen, Nancy; Devriendt, Katia; Dekkers, Harold; Van Ammel, Annemie; Witters, Thomas; Conard, Thierry; Vaesen, Inge; Richard, Olivier; Bender, Hugo; Athimulam, Raja; Chiarella, Thomas; Thean, Aaron; Horiguchi, Naoto (2013)

Si Interposer build-up options and impact on 3D system cost

Velenis, Dimitrios; Detalle, Mikael; Marinissen, Erik Jan; Beyne, Eric (2013)

Reducing power consumption in body-centric Zigbee communication links by means of wearable textile antennas

Vanveerdegehem, P.; Jooris, B.; Van Torre, Patrick; Rogier, Hendrik; Moerman, Ingrid; Knockaert, J. (2013-05)

Intrinsic effect of porosity on the stiffness and fracture energy of nano porous ultra low-k dielectrics

Vanstreels, Kris; Wu, Chen; Verdonck, Patrick; Schneider, Dieter; Gonzalez, Mario; Martini, Roberto; Baklanov, Mikhaïl (2013)

Assessment of mechanical properties in nanotechnology: porous low-k dielectrics, TSVs and bumps

Vanstreels, Kris; De Wolf, Ingrid; Hangen, Ude (2013)

In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

Vanstreels, Kris; Czarnecki, Piotr; Kirimura, Tomoyuki; Siew, Yong Kong; Tokei, Zsolt; Boemmels, Juergen; Croes, Kristof (2013)

Growth-inhibited nucleation of Ni nanoparticles on TiN substrates

Vanpaemel, Johannes; van der Veen, Marleen; De Gendt, Stefan; Vereecken, Philippe (2013)

Low temperature CNT growth kinetics for interconnects

Vanpaemel, Johannes; Masahito, Sugiura; Cott, Daire; van der Veen, Marleen; Tokei, Zsolt; De Gendt, Stefan; Vereecken, Philippe (2013)

PCB technology based stretchable circuits

Vanfleteren, Jan; Gonzalez, Mario; Bossuyt, Frederick; Vervust, Thomas; De Wolf, Ingrid; Jablonski, Michal (2013)

Draagbare elektronica met ultradunne chips en elastische circuits

Vanfleteren, Jan (2013)

Flexible and stretchable electronics

Vanfleteren, Jan (2013)

Conference contributions: Recent submissions

Electrochemical processing of carbon nanostructures ﻿

Conformal deposition For 3D thin-film batteries ﻿

Conformal deposition for3D thin-film batteries ﻿

Wetting behavior of aqueous solutions on high aspect ratio nanopillars with hydrophilic surface finish ﻿

Wetting behavior of aqueous solutions on high aspect ratio nanopillars with hydrophilic surface finish ﻿

Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young�s modulus ﻿

A 2.1 mW 11b 410 MS/s dynamic pipelined SAR ADC with background calibrationn in 28nm digital CMOS ﻿

Integration challenges and options of replacement high-k/metal gate technology for (Sub-)22nm technology nodes ﻿

Highly scalable effective work function engineering approach for multi-VT modulation of planar and FinFET-based RMG high-k last devies for (sub-)22nm nodes ﻿

Thermal and SF6-plasma treatments for improved (sub-)1nm EOT planar and FinFET-based RMG high-k last devices and enabling a simplified scalable CMOS integration scheme ﻿

Si Interposer build-up options and impact on 3D system cost ﻿

Reducing power consumption in body-centric Zigbee communication links by means of wearable textile antennas ﻿

Intrinsic effect of porosity on the stiffness and fracture energy of nano porous ultra low-k dielectrics ﻿

Assessment of mechanical properties in nanotechnology: porous low-k dielectrics, TSVs and bumps ﻿

In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures ﻿

Growth-inhibited nucleation of Ni nanoparticles on TiN substrates ﻿

Low temperature CNT growth kinetics for interconnects ﻿

PCB technology based stretchable circuits ﻿

Draagbare elektronica met ultradunne chips en elastische circuits ﻿

Flexible and stretchable electronics ﻿

Electrochemical processing of carbon nanostructures

Conformal deposition For 3D thin-film batteries

Conformal deposition for3D thin-film batteries

Wetting behavior of aqueous solutions on high aspect ratio nanopillars with hydrophilic surface finish

Wetting behavior of aqueous solutions on high aspect ratio nanopillars with hydrophilic surface finish

Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young�s modulus

A 2.1 mW 11b 410 MS/s dynamic pipelined SAR ADC with background calibrationn in 28nm digital CMOS

Integration challenges and options of replacement high-k/metal gate technology for (Sub-)22nm technology nodes

Highly scalable effective work function engineering approach for multi-VT modulation of planar and FinFET-based RMG high-k last devies for (sub-)22nm nodes

Thermal and SF6-plasma treatments for improved (sub-)1nm EOT planar and FinFET-based RMG high-k last devices and enabling a simplified scalable CMOS integration scheme

Si Interposer build-up options and impact on 3D system cost

Reducing power consumption in body-centric Zigbee communication links by means of wearable textile antennas

Intrinsic effect of porosity on the stiffness and fracture energy of nano porous ultra low-k dielectrics

Assessment of mechanical properties in nanotechnology: porous low-k dielectrics, TSVs and bumps

In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

Growth-inhibited nucleation of Ni nanoparticles on TiN substrates

Low temperature CNT growth kinetics for interconnects

PCB technology based stretchable circuits

Draagbare elektronica met ultradunne chips en elastische circuits

Flexible and stretchable electronics