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A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication
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Authors
Kruv, Anastasiia
;
Gonzalez, Mario
;
Okudur, Oguzhan Orkut
;
Spampinato, Valentina
;
Franquet, Alexis
;
Vadakupudhu Palayam, Senthil
;
Arreghini, Antonio
;
Van den Bosch, Geert
;
Rosmeulen, Maarten
;
De Wolf, Ingrid
DOI
10.1016/j.mee.2021.111660
ISSN
0167-9317
Issue
February
Journal
MICROELECTRONIC ENGINEERING
Volume
254
Title
A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication
Publication type
Journal article
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Date
Summary
3
20.500.12860/41936.3
*
2023-08-07T11:16:24Z
validation by library/open access desk
1
20.500.12860/41936
2023-06-20T10:36:17Z
*Selected version
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