EISBN
979-8-3503-1097-9
ISSN
2380-632X
Conference
IEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
Journal
IEEE International Conference on Interconnect Technology
Title
Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations
Publication type
Proceedings paper
Embargo date
9999-12-31