Browsing by Author "Altmann, Frank"
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Publication 3D Localization of liner breakdown within Cu filled TSV?s by backside LIT and PEM defocusing series
Proceedings paper2017, 43rd International Symposium for Testing and Failure Analysis - ISTFA, 5/11/2017, p.38-43Publication Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band
Proceedings paper2017, 43rd Intenational Symposium for Testing and Failure Analysis - ISTFA, 5/11/2017Publication Challenges and Perspectives for Vertical GaN-on-Si Trench MOS Reliability: From Leakage Current Analysis to Gate Stack Optimization
Journal article review2021, MATERIALS, (14) 9, p.2316Publication Fast and distributed thermal model for thermal modeling of GaN power devices
Journal article2018-10, IEEE Transactions on Components, Packaging and Manufacturing Technology, (8) 10, p.1747-1755Publication New access to soft breakdown parameters of low k dielectrics through localization-based analysis
Publication Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
Journal article2019, Microelectronics Reliability, 92, p.73-78Publication Root cause analysis of gate shorts in semi-vertical GaN MOSFET devices
Publication Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Proceedings paper2021, 17th IEEE International Conference on Automation Science and Engineering (CASE), AUG 23-27, 2021, p.395-400