Browsing by Author "Altmann, Frank"
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Publication 3D Localization of liner breakdown within Cu filled TSV?s by backside LIT and PEM defocusing series
Proceedings paper2017, 43rd International Symposium for Testing and Failure Analysis - ISTFA, 5/11/2017, p.38-43Publication Acoustic and photoacoustic inspection of through-silicon-vias in the GHz-frequency band
Proceedings paper2017, 43rd Intenational Symposium for Testing and Failure Analysis - ISTFA, 5/11/2017Publication Challenges and Perspectives for Vertical GaN-on-Si Trench MOS Reliability: From Leakage Current Analysis to Gate Stack Optimization
Journal article review2021, MATERIALS, (14) 9, p.2316Publication Doping investigation of structured GaN devices by highly lateral resolved TOF-SIMS
Journal article2025, POWER ELECTRONIC DEVICES AND COMPONENTS, (10) March, p.100082Publication Fast and distributed thermal model for thermal modeling of GaN power devices
Journal article2018, IEEE Transactions on Components, Packaging and Manufacturing Technology, (8) 10, p.1747-1755Publication New access to soft breakdown parameters of low k dielectrics through localization-based analysis
Publication Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
Journal article2019, Microelectronics Reliability, 92, p.73-78Publication Root cause analysis of gate shorts in semi-vertical GaN MOSFET devices
Publication Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)
Proceedings paper2021, 17th IEEE International Conference on Automation Science and Engineering (CASE), AUG 23-27, 2021, p.395-400