Browsing by Author "Bex, Pieter"
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Publication 10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.617-622Publication 3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication 3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Proceedings paper2016, IEEE 18th Electronic Packaging Technology Conference - EPTC, 30/11/2016, p.791-796Publication 3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly
Meeting abstract2015, International Conference on Electronic Packaging & iMAPS All Asia Conference - ICEP-IACC, 14/04/2015, p.56-60Publication 3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
Proceedings paper2017, IEEE International Interconnect Technology Conference - IITC, 16/05/2017, p.1-3Publication A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.607-613Publication A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks
Proceedings paper2017, IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference - IEEE S3S, 16/10/2017, p.7.4Publication A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
Meeting abstract2020, IMAPS 53rd International Symposium on Microelectronics, 6/10/2020Publication A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
; ; ; ; Publication A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.1119-1124Publication A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
Oral presentation2017, Electronic Components and Technology Conference - ECTCPublication Acoustic modulation during laser debonding of collective hybrid bonded dies
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2126-2133Publication Advances in temporary carrier technology for high density fan-out device build-up
Proceedings paper2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 28/05/2019, p.340-345Publication An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
; ; ; ; Proceedings paper2018, 7th Electronic System-Integration Technology Conference - ESTC, 18/09/2018, p.1-8Publication Backside power delivery with a direct 14:1/19:1 high-ratio point-of-load power converter for servers and datacenters
Proceedings paper2021, 2021 Symposia on VLSI Technology, 13/06/2021Publication Carrier Systems for Collective Die-to-Wafer Bonding
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.2058-2063Publication Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Meeting abstract2017, Materials for Advanced Metallization Conference - MAM, 26/03/2017Publication Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.7-11Publication Demonstration of a collective hybrid die-to-wafer integration
Proceedings paper2020, 70th IEEE Electronic Components and Technology Conference (ECTC), JUN 03-30, 2020, p.1315-1321Publication Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2064-2070
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