Browsing by Author "Beynet, Julien"

Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections

Integration and dielectric reliability of 30nm 1/2 pitch structures in Aurora LK HM

Integration and dielectric reliability of 30nm ½ pitch structures in Aurora® LK HM

Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability

Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability

Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials

Low temperature plasma-enhanced ALD enables cost-effective spacer defined double patterning (SDDP)

Plasma enhanced atomic layer deposition of silicon oxide for through silicon via

Relationships between deposition parameters, step coverage, throughput, and electrical properties of PEALD SiO2 insulation liners for HVM TSV application

Use of MIR-FTIR and k-value measurements to assess potential solutions to reduce damage during porous low-k integration

Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route