Browsing by Author "Garaud, Sylvain"
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Publication Advanced wafer surface cleaning technology
Oral presentation2004, SEMICON Korea 2004 STS, S5: Contamination-free Manufacturing SeminarPublication Challenges with respect to high-k/metal gate stack etching and cleaning
Proceedings paper2007, Physics and Technology of High-k Dielectrics, 7/10/2007, p.275-283Publication Galvanic corrosion of stacked metal gate electrodes during cleaning in HF solutions
Proceedings paper2008, Ultra Clean Processing of Semiconductor Surfaces VIII - UCPSS, 18/09/2006, p.87-90Publication Impact of galvanic corrosion on metal gate stacks
Oral presentation2008, 9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces - UCPSSPublication Introducing novel metal gate materials for decananometer CMOS in the agile fab: a case study
Proceedings paper2004, Proceedings of the International Symposium on Semiconductor Manufacturing - ISSM, 27/09/2004, p.53-56Publication Materials characterization of WNxCy, WNx and WCx films for advanced barriers
Journal article2007, Microelectronic Engineering, (84) 11, p.2441-2465Publication Selective wet removal of Hf-based layers and post-dry etch residues high-k and metal gate
Oral presentation2004, 7th International Symposium on Ultra Clean Processing of Silicon Surfacess - UCPSSPublication Selective wet removal of Hf-based layers and post-dry etch residues in high-k and metal gate stacks
Proceedings paper2005, Ultra Clean Processing of Silicon Surfaces VII: Proceedings of the 7th International Symposium, 20/09/2004, p.93-96Publication Wafer backside cleaning strategies for high-k/metal gate processing
; ; ;Garaud, Sylvain ;De Waele, Rita; ; Kraus, HaraldOral presentation2004, 7th International Symposium Ultra-clean Processing of Silicon - UCPSSPublication Wafer backside cleaning strategies for high-k/metal gate processing
; ; ;Garaud, Sylvain ;De Waele, Rita; ; Kraus, HaraldProceedings paper2005, Ultra Clean Processing of Silicon Surfaces VII: Proceedings of the 7th International Symposium, 20/09/2004, p.241-244