Browsing by Author "Kim, Ryan Ryoung Han"
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Publication Design, patterning, and process integration overview for 2nm node
Proceedings paper2022, Conference on DTCO and Computational Patterning, APR 24-MAY 27, 2022, p.120520FPublication Enhancement of DOF through RET and mask manufacturability in high-NA EUV
Proceedings paper2025, 2025 Conference on DTCO and Computational Patterning, 2025-04-22, p.1-9Publication EUV DRAM Patterning Historic Overview and Future Assumption
Proceedings paper2025, 2025 Conference on DTCO and Computational Patterning, 2025-04-25, p.134250V-1-134250V-13Publication EUV low-n attenuated phase-shift mask on random logic Via single patterning at pitch 36nm
; ; ; ; ; Proceedings paper2022-05-26, Conference on Optical and EUV Nanolithography XXXV Part of SPIE Advanced Conference, APR 24-MAY 27, 2022, p.120510PPublication Innovative design solutions for avoiding at-resolution field stitching in high-NA EUV lithography
Proceedings paper2025-04-22, 2025 Conference on DTCO and Computational Patterning, 2025-04-22, p.134250E-1Publication Investigation of die-cost scaling scenarios in future technologies
; ;Tsai, Y.-P. ;Chang, Y.-H.; ; Proceedings paper2024, Conference on DTCO and Computational Patterning III, 2024-02-25, p.129540EPublication Logic and memory patterning breakthrough using High-NA lithography
Proceedings paper2024, 2024 Conference on Photomask Technology, 2024-09-29, p.1321604Publication Multi-Patterning Options for 5nm and Below_SADP, SAQP, SALELE
Journal article2019, White paper on Mentor graphicsPublication NA0.33 EUV extension for HVM: Testing single patterning limits
Proceedings paper2025, 2025 Conference on Optical and EUV Nanolithography, 2025-04-25, p.1342403-1-1342403-7Publication SAQP spacer merge and EUV self-aligned block decomposition at 28nm metal pitch on imec 7nm node
Meeting abstract2019, Design-Process-Technology Co-optimization for Manufacturability XIII, 24/02/2019, p.109620NPublication Source mask optimization ( SMO) study for high-NA EUV lithography to achieve single patterning on random logic metal
Proceedings paper2024, Conference on DTCO and Computational Patterning III, FEB 26-29, 2024, p.Art. 129540XPublication The influence of reflectivity on EUV lithography performance of low-n and binary masks for random logic via implementation
Proceedings paper2024, 2024 Conference on Photomask Technology, 2024-09-30, p.132161C