Browsing by Author "Lepage, Muriel"
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Publication Applying a thin imaging resist system to substrates with topography
Journal article2000, Solid State Technology, (43) 8, p.127Publication Characterization and integration in Cu damascene structures of AURORA, an inorganic low-k dielectric
Proceedings paper2001, Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics, 23/04/2000, p.D5.14.1-D5.14-6Publication Characterization and integration of a new Si-O-C film deposited by CVD
Proceedings paper2001, Advanced Metallization Conference 2000, 3/10/2000, p.595-601Publication Dry etch and clean aspects for advanced integration of low k dielectrics
Oral presentation2000, 5th International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability IssuesPublication Lithography as a critical step for low-k dual damascene: from 248nm to 193nm
Proceedings paper2000, International Interconnect Technology Conference - IITC, 5/06/2000, p.87-90Publication Lithography aspects of dual damascene interconnect technology
Proceedings paper2001, Lithography for Semiconductor Manufacturing II, 30/05/2001, p.1-14Publication Material characteristics and damascene patterning of a fluoropolymer low-k film
Oral presentation2000, Advanced Metallization Conference; October 2000; San Diego, CA, USA.Publication Optimization of etching and stripping chemistries for Z3MS TM low-k
Proceedings paper2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference ; 4-6 June 2001; Burlingame, CA, USA., p.174-176Publication Physical and electrical characterization of silsesquioxane-based ultra-low k dielectric films
Publication Process optimization and integration of trimethylsilane-deposited a-SiC:H and a-SiCO:H dielectric thin films for damascene processing
Journal article2003, Journal of the Electrochemical Society, (150) 7, p.G404-G411Publication Studies on XLK film characterization and integration in copper damascene processes
Proceedings paper2001, Advanced Metallization Conference 2000, 3/10/2000, p.287-293