Browsing by Author "Ratchev, Petar"
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Publication A reliable and compact polymer-based package for capacitive RF-MEMS switches
Proceedings paper2004-12, Technical Digest International Electron Device Meeting - IEDM, 13/12/2004, p.31-34Publication A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders
Proceedings paper2005, Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition - EPMC, 12/06/2005, p.248-252Publication Advanced wire bonding: bonding on copper
Proceedings paper2002, Proceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE, 16/06/2002, p.27-32Publication Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Proceedings paper2002, Proceedings 4th Electronics Packaging Technology Conference, 10/12/2002, p.60-64Publication Brittle to ductile fracture transition in bulk Pb-free solders
Journal article2007, IEEE Trans. Components and Packaging Technologies, (30) 3, p.416-423Publication Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
Proceedings paper2005-06, Proceeding of the 2005 Electronic Components and Technology conference ECTC '05. Proceedings, 31/05/2005, p.449-451Publication Copper wire bonding to advanced copper back-end integrated circuits
Oral presentation2003, Semicon Europe, Advanced Packaging SeminarPublication Creep as a reliability problem in MEMS
Journal article2004, Microelectronics Reliability, (44) 9_11, p.1733-1738Publication Creep as a reliability problem in MEMS
Proceedings paper2004, Proceedings 15th MicroMechanics Europe Workshop, 5/09/2004, p.84-87Publication Creep characterization of Al alloy thin films for use in MEMS applications
Publication Creep resistant aluminum alloys for use in MEMS
Journal article2005, J. of Micromechanics and Microengineering, (15) 7, p.S165-S170Publication Direct gold and copper wires bonding on copper
Journal article2003, Microelectronics Reliability, (43) 6, p.913-923Publication Dry oxidation mechanisms of copper in trenches
Journal article2002, Microelectronic Engineering, (64) 1_4, p.63-71Publication Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
Proceedings paper2003, IMAPS-Nordic, 21/09/2003, p.126-132Publication Effect of the intermetallics particles size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt% Cu solder
Proceedings paper2005-10, IPC/JEDEC 10th International Conference on Lead Free Electronic Components and Assemblies, 18/10/2005Publication FCOB: packaging issues for RF-MEMS applications and reliability study
Proceedings paper2005, Proceedings 15th European Microelectronics and Packaging Conference - EPMC, 12/06/2005, p.195-200