Browsing by Author "Roda Neve, Cesar"
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Publication A simple and efficient RF technique for the TSV characterization
Proceedings paper2017, 37th Electronic Components and Technology Conference - ECTC, 30/05/2017, p.1431-1436Publication A study on power integrity in a 3D chip stack using dynamic power supply current emulation and power noise monitoring
Proceedings paper2014, Electronics System-Integration Technology Conference - ESTC, 16/09/2014, p.1-5Publication Active-lite interposer for 2.5 & 3D integration
Proceedings paper2015, IEEE Symposium on VLSI Technology, 16/06/2015, p.T222-T223Publication Broadband metal-insulator-metal capacitors on silicon interposer for low impedance power distribution network
Meeting abstract2015, DATE Workshop: 3D Integration Technology, Architecture, Design, Package, Automation, and Test, 13/03/2015Publication Decoupling capacitor integration in passive silicon interposer
Meeting abstract2015, Global Interposer Technology Workshop -GIT, 4/11/2015Publication ESD protection design in active interposer for 2.5 and 3D systems-in-package
Proceedings paper2015-09, EOS/ESD Symposium, 27/09/2015Publication High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
; ; ; ; Proceedings paper2016, IEEE International Conference on 3D System Integration - 3DIC, 8/11/2016, p.1-4Publication Investigation of chip-to-chip interconnections for memory-logic communication on 3D interposer technology
Proceedings paper2014, IEEE 18th Workshop on Signal and Power Integrity - SPI, 11/05/2014, p.1-4Publication Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
Proceedings paper2015, IEEE MTT-S International Microwave Symposium - IMS, 17/05/2015, p.1-4Publication Semi-additive Cu-Polymer RDL process for interposers applications
Proceedings paper2014, Electronics System-Integration Technology Conference - ESTC, 16/09/2014, p.1-6Publication Technology optimization for high bandwidth density applications on 3D interposer
Meeting abstract2016, Electronics System-integration Technology Conference and Exhibition - ESTC, 13/09/2016, p.1-6