Browsing by Author "Salahuddin, Shairfe Muhammad"
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Publication 3D SRAM Macro Design in 3D Nanofabric Process Technology
Journal article2023, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, (70) 7, p.2858-2867Publication 3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes
Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication Buried Bitline for sub-5nm SRAM Design
;Mathur, R. ;Bhargava, M. ;Annamalai, S. ;Chong, Y. K. ;Sinha, S. ;Cline, B.Kulkarni, J. P.Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication Buried Interconnects for Sub-5 nm SRAM Design
Journal article2022, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 3, p.1041-1047Publication Buried Power Rail Metal exploration towards the 1 nm Node
Proceedings paper2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021Publication Buried power SRAM DTCO and system-level benchmarking in N3
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication CFET SRAM DTCO, Interconnect Guideline, and Benchmark for CMOS Scaling
Journal article2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 3, p.883-890Publication CFET SRAM With Double-Sided Interconnect Design and DTCO Benchmark
Journal article2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 10, p.5099-5106Publication Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node
Proceedings paper2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021Publication Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access
Proceedings paper2023, 24th International Symposium on Quality Electronic Design (ISQED), APR 05-07, 2023, p.209-209Publication Extended Methodology to Determine SRAM Write Margin in Resistance-Dominated Technology Node
Journal article2022, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 6, p.3113-3117Publication From Design to System-Technology optimization for CMOS
Proceedings paper2021, International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), APR 19-22, 2021Publication Future Design Direction for SRAM Data Array: Hierarchical Subarray With Active Interconnect
Journal article2024, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, (71) 12, p.6495-6506Publication SRAM with buried power distribution to improve write margin and performance in advanced technology nodes
Journal article2019, IEEE Electron Device Letters, (40) 8, p.1261-1274Publication System exploration and technology demonstration of 3D Wafer-to-Wafer integrated STT-MRAM based caches for advanced Mobile SoCs
Proceedings paper2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020Publication Thermal stress-aware CMOS-SRAM partitioning in sequential 3-D technology
Journal article2020, IEEE Transactions on Electron Devices, (67) 11, p.4631-4635Publication Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations
Proceedings paper2022, 14th IEEE International Memory Workshop (IMW), MAR 15-18, 2022, p.148-151