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Browsing by Author "Salahuddin, Shairfe Muhammad"

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    3D SRAM Macro Design in 3D Nanofabric Process Technology

    Abdi, Dawit  
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    Salahuddin, Shairfe Muhammad  
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    Boemmels, Juergen  
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    Giacomin, Edouard
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    Weckx, Pieter  
    Journal article
    2023, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, (70) 7, p.2858-2867
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    3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes

    Chen, Rongmei  
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    Weckx, Pieter  
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    Salahuddin, Shairfe Muhammad  
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    Kim, Soon-Wook  
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    Sisto, Giuliano  
    Proceedings paper
    2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020
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    Buried Bitline for sub-5nm SRAM Design

    Mathur, R.
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    Bhargava, M.
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    Annamalai, S.
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    Chong, Y. K.
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    Sinha, S.
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    Cline, B.
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    Kulkarni, J. P.
    Proceedings paper
    2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020
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    Buried Interconnects for Sub-5 nm SRAM Design

    Mathur, R.
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    Bhargava, M.
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    Cline, B.
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    Salahuddin, Shairfe Muhammad  
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    Gupta, Anshul  
    Journal article
    2022, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 3, p.1041-1047
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    Buried Power Rail Metal exploration towards the 1 nm Node

    Gupta, Anshul  
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    Radisic, Dunja  
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    Maes, J.W.
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    Varela Pedreira, Olalla  
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    Soulie, Jean-Philippe
    Proceedings paper
    2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021
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    Buried power SRAM DTCO and system-level benchmarking in N3

    Salahuddin, Shairfe Muhammad  
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    Perumkunnil, Manu  
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    Dentoni Litta, Eugenio  
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    Gupta, Anshul  
    Proceedings paper
    2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020
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    CFET SRAM DTCO, Interconnect Guideline, and Benchmark for CMOS Scaling

    Liu, Hsiao-Hsuan
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    Salahuddin, Shairfe Muhammad  
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    Chan, Boon Teik
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    Schuddinck, Pieter  
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    Xiang, Yang  
    Journal article
    2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 3, p.883-890
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    CFET SRAM With Double-Sided Interconnect Design and DTCO Benchmark

    Liu, Hsiao-Hsuan
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    Schuddinck, Pieter  
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    Pei, Zhenlin
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    Verschueren, Lynn  
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    Mertens, Hans  
    Journal article
    2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 10, p.5099-5106
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    Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node

    Chen, Rongmei  
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    Sisto, Giuliano  
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    Jourdain, Anne  
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    Hiblot, Gaspard  
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    Stucchi, Michele  
    Proceedings paper
    2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021
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    Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access

    Pei, Zhenlin
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    Mayahinia, Mahta
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    Liu, Hsiao-Hsuan
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    Tahoori, Mehdi
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    Salahuddin, Shairfe Muhammad  
    Proceedings paper
    2023, 24th International Symposium on Quality Electronic Design (ISQED), APR 05-07, 2023, p.209-209
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    Extended Methodology to Determine SRAM Write Margin in Resistance-Dominated Technology Node

    Liu, Hsiao-Hsuan
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    Salahuddin, Shairfe Muhammad  
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    Abdi, Dawit  
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    Chen, Rongmei  
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    Weckx, Pieter  
    Journal article
    2022, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 6, p.3113-3117
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    From Design to System-Technology optimization for CMOS

    Ryckaert, Julien  
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    Chehab, Bilal  
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    Jang, Doyoung  
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    Mirabelli, Gioele  
    Proceedings paper
    2021, International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), APR 19-22, 2021
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    Future Design Direction for SRAM Data Array: Hierarchical Subarray With Active Interconnect

    Liu, Hsiao-Hsuan
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    Gilardi, Carlo
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    Salahuddin, Shairfe Muhammad  
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    Pei, Zhenlin
    Journal article
    2024, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, (71) 12, p.6495-6506
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    SRAM with buried power distribution to improve write margin and performance in advanced technology nodes

    Salahuddin, Shairfe Muhammad  
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    Shaik, Khaja Ahmad
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    Gupta, Anshul  
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    Chava, Bharani
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    Gupta, Mohit  
    Journal article
    2019, IEEE Electron Device Letters, (40) 8, p.1261-1274
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    System exploration and technology demonstration of 3D Wafer-to-Wafer integrated STT-MRAM based caches for advanced Mobile SoCs

    Perumkunnil, Manu  
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    Yasin, Farrukh  
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    Rao, Siddharth  
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    Salahuddin, Shairfe Muhammad  
    Proceedings paper
    2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020
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    Thermal stress-aware CMOS-SRAM partitioning in sequential 3-D technology

    Salahuddin, Shairfe Muhammad  
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    Dentoni Litta, Eugenio  
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    Gupta, Anshul  
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    Ritzenthaler, Romain  
    Journal article
    2020, IEEE Transactions on Electron Devices, (67) 11, p.4631-4635
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    Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations

    Spessot, Alessio  
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    Salahuddin, Shairfe Muhammad  
    ;
    Escobar Gavilanez, Ricardo  
    Proceedings paper
    2022, 14th IEEE International Memory Workshop (IMW), MAR 15-18, 2022, p.148-151

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