Browsing by Author "Spiess, Walter"
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Publication Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material
; ; ; ; ; Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.1685-1690Publication Optimization of an advanced positive DUV photoresist towards 150 nm and beyond
Oral presentation1999, MNE'99 - Micro and Nano Engineering ConferencePublication Optimization of an advanced positive DUV resist for 248 nm L/S pattern printing
Journal article1999, Microelectronic Engineering, (46) 1_4, p.353-357Publication Optimization of an advanced positive DUV resist for 248 nm L/S pattern printing
Oral presentation1998, MNE 98 - Micro- and Nano-Engineering Conference; 22-24 Sept. 1998; Leuven, Belgium.Publication Optimization of an advanced positive tone DUV photoresist towards 150nm and beyond
Journal article2000, Microelectronic Engineering, (53) 1_4, p.443-447Publication Process characterization of thin wafer debonding with thermoplastic materials
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down
Proceedings paper2012, IEEE 62nd Electronic Components and Technology Conference - ECTC, 29/05/2012, p.1255-1259Publication The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Proceedings paper2019, 2019 International Wafer Level Packaging Conference (IWLPC), 13/10/2019Publication Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
Proceedings paper2012, IEEE International 3D Systems Integration Conference - 3DIC, 31/01/2012