Browsing by Author "Sun, Yiting"
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Publication Effect of 147nm photons on porous Organo-Silicon Glass materials and damage improvement by optimized Cu/low-k integration approaches
Meeting abstract2014, AVS 61st International Symposium and Exhibition, 9/11/2014, p.PS-MoM4Publication Electrical properties of amino SAM layers studied with conductive AFM
Journal article2013, European Polymer Journal, (49) 8, p.1952-1956Publication Electrical properties of APTMS SAM layers studied with conductive atomic force microscope
Oral presentation2012, International Conference on Scanning Probe Microscopy on Soft and Polymeric MaterialsPublication Impact of plasma pretreatment and pore size on the sealing of ultra low-k dielectrics by self-assembling monolayers
Journal article2014, Langmuir, (30) 13, p.3832-3844Publication Improved plasma resistance for porous low-k dielectrics by pore stuffing approach
Journal article2015, ECS Journal of Solid State Science and Technology, (4) 1, p.N3098-N3107Publication Investigation of sealing efficiency of self-assembled monolayers deposited on porous k=2.0 dielectrics as a function of dielectric surface preparation by plasma
Meeting abstract2013, MRS Spring Meeting Symposium AA: Advanced Interconnects for Micro- and Nanoelectronics - Materials, Processes, and Reliability, 1/04/2013, p.AA5.22Publication Optimization and upscaling of spin coating with organosilane monolayers for low-k pore sealing
Journal article2017, Microelectronic Engineering, 137, p.32-36Publication Pore sealing of porous ultralow-k dielectrics by self-assembled monolayers combined with atomic layer deposition
Journal article2012, ECS Solid State Letters, (1) 2, p.P42-P44Publication Scaled-down deposited underlayers for EUV lithography
Proceedings paper2023, Conference on Advances in Patterning Materials and Processes XL, FEB 27-MAR 01, 2023, p.Art. 124980RPublication Sealing of low-k dielectric (k=2.0) with self-assembled monolayers (SAMs) for the atomic layer deposition (ALD) of TiN
Proceedings paper2013, Advanced Interconnects for Micro- and Nanoelectronics - Materials, Processes, and Reliability, 1/04/2013, p.AA05.22Publication Self-assembled monolayers assisted pore sealing of k 2.0 dielectrics
Meeting abstract2013, Materials for Advanced Metallization - MAM, 11/03/2013, p.125-126Publication Self-organized organic/inorganic films functional to next generation metallization schemes
Meeting abstract2014, IUMRS-ICEM - International Conference on Electronic Materials, 8/06/2014, p.C4-IT-0541Publication Stuffing-enabled confinement of self-assembled monolayer used as sealing agent on plasma-exposed 2.0 p-OSG films
Meeting abstract2014, 23rd Conference on Materials for Advanced Metallization - MAM, 2/03/2014Publication Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films
; ; ; ; ; Journal article2015, Microelectronic Engineering, 137, p.70-74Publication Substantial Dose Reduction Using Dry Deposited Underlayer for EUV Lithography While Maintaining Roughness and Minimizing Defects
Proceedings paper2024, 2024 International Conference on Extreme Ultraviolet Lithography, SEP 30-OCT 03, 2024, p.Art. 132150MPublication Surface-confined activation of ultra low-k dielectrics in CO2 plasma
Journal article2016, Applied Physics Letters, (108) 26, p.262902Publication The effect of Ar/H2 plasma pretreatments on porous k=2.0 dielectrics for pore sealing by self-assembled monolayers deposition
Proceedings paper2013, Ultra Clean Processing of Semiconductor Surfaces XI - UCPSS, 17/09/2012, p.146-149Publication The influence of solvents on the quality of SAMs for low-k pore sealing purpose
Meeting abstract2016, Materials for Advanced Metallization Conference - MAM, 20/03/2016, p.115-116