Browsing by Author "Yamashita, Fumiko"
Now showing 1 - 7 of 7
- Results Per Page
- Sort Options
Publication A novel CBRAM integration using subtractive dry-etching process of Cu enabling high-performance memory scaling down to 10nm node
Proceedings paper2015, IEEE Symposium on VLSI Technology, 15/06/2015, p.134-135Publication Demonstration of an N7 integrated fab process for metal oxide EUV photoresist
Proceedings paper2016, Extreme Ultraviolet (EUV) Lithography VII, 21/02/2016, p.97760BPublication Direct etched Cu characterization for advanced interconnects
Proceedings paper2015, IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM, 18/05/2015, p.173-176Publication Magnetic tunnel junctions etch and encapsulation process optimization for high-density STT-MRAM applications
Meeting abstract2016, AVS 63rd International Symposium and Exhibition, 6/11/2016, p.PS-ThP33Publication Pattern transfer challenges of the Sequential Infiltration Synthesis (SIS) of of Directed Self-Assembly (DSA) for line/space applications
Proceedings paper2016, 42nd Micro- and Nano-Engineering - MNE, 19/09/2016Publication Process window study of SAQP gratings used to pattern a dual damascene structure at 7nm technology node
Meeting abstract2016, Plasma Etch and Strip in Microtechnology - PESM, 9/05/2016Publication Short- and damage-free process for patterning magnetic tunnel junctions for high-density application
Meeting abstract2015, AVS 62nd International Symposium & Exhibition, 18/10/2015, p.PS1-TuA12