Browsing by author "Nagar, Magi"
Now showing items 1-20 of 26
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Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, Katrien; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2009) -
Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Radisic, Alex; Nagar, Magi; Strubbe, K.; Armini, Silvia; El-Mekki, Zaid; Volders, Henny; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Armini, Silvia; Demuynck, Steven; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Radisic, Alex; Heylen, Nancy; Beyer, Gerald; Leunissen, Peter; Vereecken, Philippe (2011-05) -
Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Armini, Silvia; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Demuynck, Steven (2013) -
Direct copper plating on a RuTa substrate
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2010) -
Elucidating advanced inhibitor material in Copper CMP: K-sorbate as an inhibitor in Copper CMP slurry
Nagar, Magi; Vaes, Jan; Ein Eli, Yair (2008) -
Exploration of process window for fill of sub 30 nm features by direct plating
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2012) -
From high-density nanoparticle deposits to nanometer thin continuous by growth inhibited nucleation enhancement
Vereecken, Philippe; Vanpaemel, Johannes; Nagar, Magi; Radisic, Alex (2014) -
Galvanic corrosion issues related to copper/barrier CMP via inline electrochemical measurements
Teugels, Lieve; Nagar, Magi; Li, Yunlong; Heylen, Nancy (2010) -
K-sorbate as a passivator in copper chemical mechanical planarization (CMP) slurries
Nagar, Magi; Vaes, Jan; Ein Eli, Yair (2008) -
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang, Liu; Radisic, Alex; Nagar, Magi; Deconinck, Johan; Leunissen, Peter; Vereecken, Philippe; West, Alan (2012-10) -
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang, Liu; Radisic, Alex; Nagar, Magi; Deconinck, Johan; Vereecken, Philippe; West, Alan (2012) -
Nucleation and growth of copper on Ru-based substrates: I. the effect of the inorganic components
Nagar, Magi; Vereecken, Philippe; Strubbe, Katrien; Radisic, Alex (2011) -
Nucleation and growth of copper on Ru-Based Substrates: I. The effect of the inorganic components
Nagar, Magi; Vereecken, Philippe; Strubbe, Katrien; Radisic, Alex (2012) -
Nucleation and growth of copper on Ru-based substrates: II. the effect of the suppressor additive
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2011) -
Nucleation and growth of copper on Ru-based substrates: II. The effect of the suppressor additive
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2012) -
Polyether suppressors for filling sub 30 nm features by direct plating
Nagar, Magi; Radisic, Alex; Strubbe, Katrien; Vereecken, Philippe (2012) -
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance
Nagar, Magi; Vaes, Jan; Ein-Eli, Yair (2010) -
Potassium sorbate as an inhibitor in copper chemical mechanical planarization. Part I. Elucidating slurry chemistry
Nagar, Magi; Starosvetsky, David; Vaes, Jan; Ein-Eli, Yair (2010) -
Seed-less copper electrochemical deposition on barrier materials as a replacement/enhancement for PVD Cu seed layers in HAR TSVs
Armini, Silvia; Philipsen, Harold; El-Mekki, Zaid; Redolfi, Augusto; Van Ammel, Annemie; Radisic, Alex; Nagar, Magi; Ruythooren, Wouter (2010)