Browsing by author "Blanco, Victor"
Now showing items 1-20 of 30
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21 nm Pitch dual-damascene BEOL process integration with full barrierless Ru metallization
Vega Gonzalez, Victor; Wilson, Chris; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Versluijs, Janko; Blanco, Victor; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Varela Pedreira, Olalla; Lesniewska, Alicja; Heylen, Nancy; El-Mekki, Zaid; van der Veen, Marleen; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Jourdan, Nicolas; Ciofi, Ivan; Contino, Antonino; Boccardi, Guillaume; Lariviere, Stephane; De Wachter, Bart; Vancoille, Eric; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Pardons, Katrien; Barla, Kathy; Tokei, Zsolt (2019) -
2D self-aligned via patterning strategy with EUV single exposure in 3nm technology
Choi, Suhyeong; Lee, Jae Uk; Blanco, Victor; Kim, Ryan Ryoung han; Shin, Youngsoo (2017) -
Alignment and overlay through opaque metal layers
Blanco, Victor; Canga, Eren; Jehoul, Christiane; Moussa, Alain; Tamaddon, Amir-Hossein; Tabery, C.; Gunjala, G.; Menchtchikov, B.; Zacca, V. G.; Lalbahadoersing, S.; den Boef, A.; Synowicky, R. (2023) -
Approaches to Enable Patterning of Tight Pitches towards High NA EUV
Tadatomo, Hiroki; Dauendorffer, Arnaud; Onitsuka, Tomoya; Genjima, Hisashi; Ido, Yasuyuki; Okada, Soichiro; Kuwahara, Yuhei; Hara, Arisa; Dinh, Congque; Fujimoto, Seiji; Kawakami, Shinichiro; Muramatsu, Makoto; Shimura, Satoru; Nafus, Kathleen; Oikawa, Noriaki; Ono, Kenta; Feurprier, Yannick; Demand, Marc; Negreira, Ainhoa Romo; Nagahara, Seiji; Blanco, Victor; Foubert, Philippe; De Simone, Danilo (2022) -
Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes
Sah, Kaushik; Cross, Andrew; Das, Sayantan; Blanco, Victor; Kljucar, Luka; Halder, Sandip; Leray, Philippe (2021) -
Design and pitch scaling for affordable node transition and EUV insertion scenario
Kim, Ryan Ryoung han; Ryckaert, Julien; Raghavan, Praveen; Sherazi, Yasser; Debacker, Peter; Trivkovic, Darko; Gillijns, Werner; Tan, Ling Ee; Drissi, Youssef; Blanco, Victor; Bekaert, Joost; Mao, Ming; Lariviere, Stephane; McIntyre, Greg (2017) -
Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers
Lariviere, Stephane; Wilson, Chris; Kutrzeba Kotowska, Bogumila; Versluijs, Janko; Decoster, Stefan; Mao, Ming; van der Veen, Marleen; Jourdan, Nicolas; El-Mekki, Zaid; Heylen, Nancy; Kesters, Els; Verdonck, Patrick; Beral, Christophe; Van Den Heuvel, Dieter; De Bisschop, Peter; Bekaert, Joost; Blanco, Victor; Ciofi, Ivan; Wan, Danny; Briggs, Basoene; Mallik, Arindam; Hendrickx, Eric; Kim, Ryan Ryoung han; McIntyre, Greg; Ronse, Kurt; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2018) -
EUV photoresist patterning characterization for imec N7/N5 technology
De Simone, Danilo; Rutigliani, Vito; Lorusso, Gian; De Bisschop, Peter; Vesters, Yannick; Blanco, Victor; Vandenberghe, Geert (2018) -
EUV single patterning for logic metal layers: achievement and challenge
Kim, Ryan Ryoung han; Gillijns, Werner; Drissi, Youssef; Trivkovic, Darko; Blanco, Victor; Lariviere, Stephane; De Ruyter, Rudi; Dehan, Morin; McIntyre, Greg; Tan, Ling Ee (2017) -
Exploration of EUV-based self-aligned multipatterning (SAMP) options targeting pitches below 20 nm
Decoster, Stefan; Lazzarino, Frederic; Vangoidsenhoven, Diziana; Blanco, Victor; Tamaddon, Amir-Hossein; Kesters, Els; Lorant, Christophe (2019) -
High volume manufacturing compatible dry development rinse process (DDRP): patterning and defectivity performance for EUVL
Sayan, Safak; Vanelderen, Pieter; Hetel, Iulian; Chan, BT; Raghavan, Praveen; Blanco, Victor; Foubert, Philippe; D'Urzo, Lucia; De Simone, Danilo; Vandenberghe, Geert (2017) -
Imaging of buried overlay and alignment markers using picosecond acoustic microscopy
Mehendale, Manjusha; Antonelli, Andy; Mair, Robin; Mukundhan, Priya; Bogdanowicz, Janusz; Blanco, Victor; Charley, Anne-Laure; Leray, Philippe (2022) -
IMEC N7, N5 and beyond: DTCO, STCO and EUV insertion strategy to maintain affordable scaling trend
Kim, Ryan Ryoung han; Sherazi, Yasser; Debacker, Peter; Raghavan, Praveen; Ryckaert, Julien; Mallik, Arindam; Verkest, Diederik; Lee, Jae Uk; Gillijns, Werner; Tan, Ling Ee; Blanco, Victor; Ronse, Kurt; McIntyre, Greg (2018) -
Impact of sequential infiltration synthesis (SIS) on roughness and stochastic nano-failures for EUVL patterning
Vanelderen, Pieter; Blanco, Victor; Mao, Ming; Tomczak, Yoann; De Roest, David; Kissoon, Nicola; Rincon Delgadillo, Paulina; Rispens, Gijsbert; Schiffelers, Guido; Pathak, Abhinav; Lazzarino, Frederic; De Simone, Danilo; De Poortere, Etienne; Mc Manus, Moyra; Piumi, Daniele; Hendrickx, Eric; Vandenberghe, Geert (2019) -
Improving exposure latitude and aligning best focus through pitch by curing M3D effects with controlled aberrations
Franke, Joern-Holger; Bekaert, Joost; Blanco, Victor; Van Look, Lieve; Wahlisch, Felix; Lyakhova, Kateryna; Van Adrichem, Paul; Maslow, Mark John; Schiffelers, Guido; Hendrickx, Eric (2019) -
iN5 EUV Single Expose Patterning Evaluation for Via Layers
Das, Argho; Blanco, Victor; Das, Sayantan; Kissoon, Nicola; Halder, Sandip; Dusa, Mircea (2021) -
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Tokei, Zsolt; Vega Gonzalez, Victor; Murdoch, Gayle; O'Toole, Martin; Croes, Kristof; Baert, Rogier; van der Veen, Marleen; Adelmann, Christoph; Soulie, Jean-Philippe; Boemmels, Juergen; Wilson, Chris; Park, Seongho; Sankaran, Kiroubanand; Pourtois, Geoffrey; Swerts, Johan; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Lazzarino, Frederic; Versluijs, Janko; Blanco, Victor; Ercken, Monique; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank; Heylen, Nancy; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Morin, Pierre; Jourdan, Nicolas; Van Elshocht, Sven; Ciofi, Ivan; Gupta, Anshul; Zahedmanesh, Houman; Vanstreels, Kris; Na, Myung Hee (2020) -
Investigating metal oxide resists for patterning 28-nm pitch structures using single exposure extreme ultraviolet: defectivity, electrical test, and voltage contrast study
Sarkar, Sujan Kumar; Das, Sayantan; Blanco, Victor; Leray, Philippe; Halder, Sandip (2022) -
Large area EUV via yield analysis for single damascene process: voltage contrast, CD and defect metrology
Blanco, Victor; Paolillo, Sara; van der Veen, Marleen; Lariviere, Stephane; Lorusso, Gian; De Poortere, Etienne; Tabery, Cyrus; Qiao, Fu; Lai, Shu-yu; Kea, Marc; Wang, Luke; Su, Yu Chi; Oh, Joe; Huang, Jim; Chen, Jimmy; Huang, Jonathan (2019) -
Large marginal 2D self-aligned via patterning for sub-5nm technology
Choi, Suhyeong; Lee, Jae Uk; Blanco, Victor; Debacker, Peter; Raghavan, Praveen; Kim, Ryan Ryoung han; Shin, Youngsoo (2017)