Browsing by author "Boelen, Pieter"
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Cu resistivity scaling limits for 20 nm copper damascene lines
Van Olmen, Jan; List, Scott; Tokei, Zsolt; Carbonell, Laure; Brongersma, Sywert; Volders, Henny; Kunnen, Eddy; Heylen, Nancy; Ciofi, Ivan; Khandelwal, A.; Gelatos, J.; Mandrekar, T.; Boelen, Pieter (2007) -
Electrochemical nucleation and growth of copper on resistive substrates
Radisic, Alex; Boelen, Pieter; Rosenfeld, Aron; Hernandez, Jose Luis; Beyer, Gerald; Vereecken, Philippe (2007) -
Electrochemical nucleation and growth of copper on resistive substrates
Radisic, Alex; Boelen, Pieter; Rosenfeld, Aron; Hernandez, Jose Luis; Beyer, Gerald; Vereecken, Philippe (2008) -
Full-field EUV and immersion lithography integration in 0.186μm² FinFET 6T-SRAM cell
Veloso, Anabela; Demuynck, Steven; Ercken, Monique; Goethals, Mieke; Demand, Marc; de Marneffe, Jean-Francois; Altamirano Sanchez, Efrain; De Keersgieter, An; Delvaux, Christie; De Backer, Johan; Brus, Stephan; Hermans, Jan; Baudemprez, Bart; Van Roey, Frieda; Lorusso, Gian; Baerts, Christina; Goossens, Danny; Vrancken, Christa; Mertens, Sofie; Versluijs, Janko; Truffert, Vincent; Huffman, Craig; Laidler, David; Heylen, Nancy; Ong, Patrick; Parvais, Bertrand; Rakowski, Michal; Verhaegen, Staf; Hikavyy, Andriy; Meiling, H.; Hultermans, B.; Romijn, L.; Pigneret, C.; Lok, S.; Van Dijk, A.; Shah, K.; Noori, A.; Gelatos, J.; Arghavani, R.; Schreutelkamp, Rob; Boelen, Pieter; Richard, Olivier; Bender, Hugo; Witters, Liesbeth; Collaert, Nadine; Rooyackers, Rita; Absil, Philippe; Lauwers, Anne; Jurczak, Gosia; Hoffmann, Thomas Y.; Vanhaelemeersch, Serge; Cartuyvels, Rudi; Ronse, Kurt; Biesemans, Serge (2008) -
Integration of 50 nm half pitch single damascene copper trenches in BDII by means of double patterning 193 nm immersion lithography on metal hardmask
Van Olmen, Jan; Al-Bayati, A; Beyer, Gerald; Boelen, Pieter; Carbonell, Laure; Zhao, Chao; Ciofi, Ivan; Claes, Martine; Cockburn, Andrew; Druais, Gael; Hendrickx, Dirk; Heylen, Nancy; Kesters, Els; Lytle, S.; Noori, A.; Op de Beeck, Maaike; Struyf, Herbert; Tokei, Zsolt; Versluijs, Janko (2007) -
Manufacturable processes for =32-nm-node CMOS enhancement by synchronous optimization of strain-engineered channel and external parasitic resistances
Noori, Atif; Balseanu, Mihaela; Boelen, Pieter; Cockburn, Andrew; Demuynck, Steven; Felch, Susan; Gandikota, Srinivas; Gelatos, jerry; Khandelwal, Amit; Kittl, Jorge; Lauwers, Anne; Lee, Wen-Chin; Lei, Jianxin; Mandrekar, Tushar; Schreutelkamp, Rob; Shah, Kavita; Thompson, Scott; Verheyen, Peter; Wang, Ching-Ya; Xia, Li-Qun; Arghavani, Reza (2008) -
O2 post deposition anneal of Al2O3 blocking dielectric for higher performance and reliability of TANOS flash memory
Rothschild, Aude; Breuil, Laurent; Van den Bosch, Geert; Richard, Olivier; Conard, Thierry; Franquet, Alexis; Cacciato, Antonio; Debusschere, Ingrid; Jurczak, Gosia; Van Houdt, Jan; Kittl, Jorge; Ganguly, Udayan; Date, Lucien; Boelen, Pieter; Schreutelkamp, Rob (2009) -
Poly- silicon etch with diluted ammonia: Application to replacement gate integration scheme
Sebaai, Farid; del Agua Borniquel, Jose Ignacio; Vos, Rita; Absil, Philippe; Chiarella, Thomas; Vrancken, Christa; Boelen, Pieter; Evans, Baiya (2008) -
Poly- silicon etch with diluted ammonia: application to replacement gate integration scheme
Sebaai, Farid; del Agua Borniquel, Jose Ignacio; Vos, Rita; Absil, Philippe; Chiarella, Thomas; Vrancken, Christa; Boelen, Pieter; Baiya, Evans (2009) -
Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Carbonell, Laure; Volders, Henny; Haider, A.; Heylen, Nancy; Richard, Olivier; Palmans, Roger; Travaly, Youssef; Tokei, Zsolt; Boelen, Pieter; Rosenfeld, A.; Mandrekar, T.; Hernandez, Jose Luis; Vanhaelemeersch, Serge (2007)