Browsing by author "Steegen, An"
Now showing items 21-40 of 40
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Layout-induced stress effects in 14nm & 10nm FinFETs and their impact on performance
Garcia Bardon, Marie; Moroz, Victor; Eneman, Geert; Schuddinck, Pieter; Dehan, Morin; Yakimets, Dmitry; Jang, Doyoung; Van der Plas, Geert; Mercha, Abdelkarim; Thean, Aaron; Verkest, Diederik; Steegen, An (2013) -
Local mechanical stress induced defects for Ti and Co/Ti silicidation in sub-0.25μm MOS-technologies
Steegen, An; Maex, Karen; De Wolf, Ingrid (1998) -
Local mechanical stress induced during Ti- and Co/Ti silicidation reaction in sub-0.25 µm MOS technologies
Steegen, An; De Wolf, Ingrid; Bender, Hugo; Maex, Karen (1998) -
Materials aspects, electrical performance, and scalability of Ni-silicide towards sub-0.13μm technologies
Lauwers, A.; Steegen, An; de Potter de ten Broeck, Muriel; Lindsay, Richard; Satta, Alessandra; Bender, Hugo; Maex, Karen (2001) -
Opportunities and challenges in device scaling by the introduction of EUV lithography
Ronse, Kurt; De Bisschop, Peter; Vandenberghe, Geert; Hendrickx, Eric; Gronheid, Roel; Vaglio Pret, Alessandro; Mallik, Arindam; Verkest, Diederik; Steegen, An (2012) -
Orientation dependent stress build-up during the formation of epitaxial CoSi2
Steegen, An; Detavernier, C.; Maex, Karen; Van Meirhaeghe, R. L.; Cardon, F. (2000) -
Orientation-dependent stress build-up during the formation of epitaxial CoSi2
Steegen, An; Detavernier, C.; Lauwers, A.; Maex, Karen; Van Meirhaeghe, R. L.; Cardon, F. (2001) -
Pattern dependent corrosion effects in HF based post-Cu CMP cleanings
Fyen, Wim; Teerlinck, Ivo; Lagrange, Sébastien; Brongersma, Sywert; Steegen, An; Mertens, Paul; Heyns, Marc (2001) -
Performance and manufacturability of the Co/Ti (cap) silicidation process for 0.25μm MOS technologies
Lauwers, Anne; Besser, Paul; de Potter de ten Broeck, Muriel; Kondoh, Eiichi; Roelandts, Nico; Steegen, An; Stucchi, Michele; Maex, Karen (1998) -
Self-aligned CoSi2 for 0.18mm and below
Maex, Karen; Lauwers, A.; Besser, Paul; Kondoh, Eiichi; de Potter de ten Broeck, Muriel; Steegen, An (1999) -
Silicide and shallow trench isolation line width dependent stress induced junction leakage
Steegen, An; Lauwers, Anne; de Potter de ten Broeck, Muriel; Badenes, Gonçal; Rooyackers, Rita; Maex, Karen (2000) -
Silicide induced mechanical stress in Si: what are the consequences for MOS technology
Maex, Karen; Steegen, An (2000) -
Silicide induced pattern density and orientation dependent transconductance in MOS transistors
Steegen, An; Stucchi, Michele; Lauwers, A.; Maex, Karen (1999) -
Silicide-induced stress in Si: origin and consequences for MOS technologies
Steegen, An; Maex, Karen (2002) -
Stress build-up during the Ni-silicidation in and around narrow silicide lines
Steegen, An; Lauwers, Anne; Chamirian, Oxana; Bender, Hugo; De Wolf, Ingrid; de Potter de ten Broeck, Muriel; De Tavernier, C.; Maex, Karen (2000) -
Study of CoSi2 formation from a Co-Ni alloy
Chamirian, Oxana; Steegen, An; Bender, Hugo; Lauwers, Anne; de Potter de ten Broeck, Muriel; Marabelli, F.; Maex, Karen (2002) -
Technology innovation in an IoT era
Steegen, An (2015) -
The economic impact of EUV lithography on critical process modules
Mallik, Arindam; Horiguchi, Naoto; Boemmels, Juergen; Thean, Aaron; Barla, Kathy; Vandenberghe, Geert; Ronse, Kurt; Ryckaert, Julien; Mercha, Abdelkarim; Altimime, Laith; Verkest, Diederik; Steegen, An (2014) -
The need for EUV lithography at advanced technology for sustainable wafer cost
Mallik, Arindam; Vansumere, Wim; Ryckaert, Julien; Mercha, Abdelkarim; Horiguchi, Naoto; Demuynck, Steven; Boemmels, Juergen; Tokei, Zsolt; Vandenberghe, Geert; Ronse, Kurt; Thean, Aaron; Verkest, Diederik; Lebon, Hans; Steegen, An (2013) -
TiSi2 and CoSi2: relevant materials issues for deep sub-micron technologies
Maex, Karen; Howard, Dave; De Wolf, Ingrid; Steegen, An (1997)