Browsing by author "Torregiani, Cristina"
Now showing items 1-20 of 26
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A comparison of spike, flash, SPER and laser annealing for 45nm CMOS
Lindsay, Richard; Pawlak, Bartek; Kittl, Jorge; Henson, Kirklen; Torregiani, Cristina; Giangrandi, Simone; Surdeanu, Radu; Vandervorst, Wilfried; Mayur, A.; Ross, J.; McCoy, S.; Gelpey, J.; Elliott, K.; Pagès, Xavier; Satta, Alessandra; Lauwers, Anne; Stolk, P.; Maex, Karen (2003) -
A finite element study of process induced stress in the transistor channel: effects of silicide contact and gate stack
Torregiani, Cristina; Liu, Joy; Vandevelde, Bart; Degryse, Dominiek; Van Dal, Mark; Benedetti, Alessandro; Lauwers, Anne; Maex, Karen (2004) -
Addressing key concerns for implementation of Ni FUSI into manufacturing for 45/32 nm CMOS
Shickova, Adelina; Kauerauf, Thomas; Rothschild, Aude; Aoulaiche, Marc; Sahhaf, Sahar; Kaczer, Ben; Veloso, Anabela; Torregiani, Cristina; Pantisano, Luigi; Lauwers, Anne; Zahid, Mohammed; Rost, Tim; Tigelaar, H.; Pas, M.; Fretwell, J.; McCormack, J.; Hoffmann, Thomas; Kerner, Christoph; Chiarella, Thomas; Brus, Stephan; Harada, Yoshinao; Niwa, Masaaki; Kaushik, Vidya; Maes, Herman; Absil, Philippe; Groeseneken, Guido; Biesemans, Serge; Kittl, Jorge (2007) -
Advanced physical analysis of 3D interconnect
Ramachandran, Vidhya; Torregiani, Cristina; Dong Wook, Kim; Gu, Sam; Nowak, Matt; DiBattista, Michael; Babak, Motamedi; Civale, Yann; Redolfi, Augusto; Beyne, Eric; Croes, Kristof; Li, Yunlong; Routh, Bryan; Rue, Chad (2012) -
Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
Oprins, Herman; Cherman, Vladimir; Vandevelde, Bart; Torregiani, Cristina; Stucchi, Michele; Van der Plas, Geert; Marchal, Pol; Beyne, Eric (2011-05) -
Compact thermal modeling of hot spots in advanced 3D-stacked structures
Torregiani, Cristina; Oprins, Herman; Vandevelde, Bart; Beyne, Eric; De Wolf, Ingrid (2009) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC
Minas, Nikolaos; Van der Plas, Geert; Oprins, Herman; Mercha, Abdelkarim; Cherman, Vladimir; Torregiani, Cristina; Rakowski, Michal; Marchal, Pol (2012) -
Effect of TSV presence on FEOL yield and reliability
Kauerauf, Thomas; Branka, Anna; Croes, Kristof; Redolfi, Augusto; Civale, Yann; Torregiani, Cristina; Groeseneken, Guido; Beyne, Eric (2013) -
Fine grain thermal modelling and expermintal validation of 3D-ICs
Oprins, Herman; Srinivasan, Adi; Cupak, Miroslav; Cherman, Vladimir; Torregiani, Cristina; Stucchi, Michele; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Cheng, Ed (2011-04) -
Gatestacks for scalable high-performance FinFETs
Vellianitis, Georgios; Van Dal, Mark; Witters, Liesbeth; Curatola, Gilberto; Doornbos, Gerben; Collaert, Nadine; Jonville, C.; Torregiani, Cristina; Lai, Li-Shyue; Petry, Jasmine; Pawlak, Bartek; Duffy, Ray; Demand, Marc; Beckx, Stephan; Mertens, Sofie; Delabie, Annelies; Vandeweyer, Tom; Delvaux, Christie; Leys, Frederik; Hikavyy, Andriy; Rooyackers, Rita; Kaiser, M.; Weemaes, R.G.R.; Voogt, F.; Roberts, H.; Donnet, D.; Biesemans, Serge; Jurczak, Gosia; Lander, Rob (2007) -
Impact of mold compound filler particles on local thermo-mechanical stress variations
Vanderstraeten, Daniel; Blansaer, Eddy; Gillon, Renaud; Torregiani, Cristina; Vandevelde, Bart (2008) -
Impact of Ni-silicide grain orientation on the strain and stress fields induced in patterned silicon
Torregiani, Cristina; Maex, Karen; Benedetti, Alessandro; Bender, Hugo; Van Houtte, P.; Pawlak, Bartek; Kittl, Jorge (2007) -
Kinetics of Ni3Si2 formation in the Ni2Si-NiSi thin film reaction from in situ measurements
Kittl, Jorge; Pawlak, Malgorzata; Torregiani, Cristina; Lauwers, Anne; Demeurisse, Caroline; Vrancken, Christa; Absil, Philippe; Biesemans, Serge; Detavernier, Christophe; Jordan-Sweet, Jean; Lavoie, Christian (2007) -
Modelling and experimental investigation of silicide-induced mechanical stress and strain in transistors technology
Torregiani, Cristina (2008-03) -
Nanometer scale characterisation of CoSi2 and NiSi induced strain in silicon by convergent beam electron diffraction
Benedetti, Alessandro; Bender, Hugo; Torregiani, Cristina; Van Dal, Mark; Maex, Karen (2004) -
On the splitting of high order Laue zone lines in CBED analysis of stress in silicon
Benedetti, Alessandro; Bender, Hugo; Torregiani, Cristina (2007) -
Silicides and Germanides for Nano-CMOS Applications
Kittl, Jorge; Opsomer, Karl; Torregiani, Cristina; Demeurisse, Caroline; Mertens, Sofie; Brunco, David; Van Dal, Mark; Lauwers, Anne (2008) -
Silicides for advanced CMOS devices
Lauwers, Anne; Kittl, Jorge; Van Dal, Mark; Chamirian, Oxana; Kmieciak, Malgorzata; Torregiani, Cristina; Liu, J.; Benedetti, Alessandro; Richard, Olivier; Bender, Hugo; van Berkum, J.G.M.; Kaiser, M.; Veloso, Anabela; Kottantharayil, Anil; de Potter de ten Broeck, Muriel; Maex, Karen (2005) -
Stress evolution during Ni-Si compound formation for fully silicided (FUSI) gates
Torregiani, Cristina; Van Bockstael, Charlotte; Detavernier, Christophe; Lavoie, Christian; Lauwers, Anne; Kittl, Jorge (2007)