Browsing by author "Detalle, Mikael"
Now showing items 1-20 of 35
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3D stacking using ultra thin dies
La Manna, Antonio; Velenis, Dimitrios; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Zhang, Wenqi; Beyne, Eric (2012) -
A 16 × 16 non-volatile silicon photonic switch circuit
D'heer, Herbert; Saurav, Kumar; Lerma Arce, Cristina; Detalle, Mikael; Lepage, Guy; Verheyen, Peter; Watte, Jan; Van Thourhout, Dries (2018) -
A calibrated pathfinding model for signal integrity analysis on interposer
Kim, Jaemin; Kim, Sunyoung; Ryckaert, Julien; Detalle, Mikael; Van Hoovels, Nele; Marchal, Pol (2012) -
Active-lite interposer for 2.5 & 3D integration
Hellings, Geert; Scholz, Mirko; Detalle, Mikael; Velenis, Dimitrios; de Potter de ten Broeck, Muriel; Roda Neve, Cesar; Li, Yunlong; Van Huylenbroeck, Stefaan; Chen, Shih-Hung; Marinissen, Erik Jan; La Manna, Antonio; Van der Plas, Geert; Linten, Dimitri; Beyne, Eric; Thean, Aaron (2015) -
Analysis of 3D interconnect performances Versus Si interposer substrate resistivity
Sun, Xiao; Van der Plas, Geert; Detalle, Mikael; Beyne, Eric (2014) -
Analysis of microbump induced stress effects in 3D stacked IC technologies
Ivankovic, Andrej; Van der Plas, Geert; Moroz, V.; Choi, M.; Cherman, Vladimir; Mercha, Abdelkarim; Marchal, Pol; Gonzalez, Mario; Eneman, Geert; Zhang, Wenqi; Buisson, Thibault; Detalle, Mikael; La Manna, Antonio; Verkest, Diederik; Beyer, Gerald; Beyne, Eric; Vandevelde, Bart; De Wolf, Ingrid; Vandepitte, Dirk (2012) -
Broadband metal-insulator-metal capacitors on silicon interposer for low impedance power distribution network
Ueda, Nao; Roda Neve, Cesar; Detalle, Mikael; Beyne, Eric; Van der Plas, Geert; Nagata, Makoto (2015) -
Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices
La Manna, Antonio; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Velenis, Dimitrios; Zhang, Wenqi; Beyne, Eric (2012-06) -
Chip embedding by spin-on-dielectrics
Duval, Fabrice; Soussan, Philippe; Detalle, Mikael; Beyne, Eric (2012) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
CMOS compatible anodization process for low cost high density capacitors
Detalle, Mikael; Rakowski, Michal; Potoms, Goedele; Mercha, Abdelkarim; de Potter de ten Broeck, Muriel; Phommahaxay, Alain; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe (2010) -
Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges
De Vos, Joeri; Cherman, Vladimir; Detalle, Mikael; Wang, Teng; Salahouelhadj, Abdellah; Daily, Robert; Van der Plas, Geert; Beyne, Eric (2014) -
Cost comparison between 3D and 2.5D integration
Velenis, Dimitrios; Detalle, Mikael; Civale, Yann; Marinissen, Erik Jan; Beyer, Gerald; Beyne, Eric (2012) -
Cost components for 3D system integration
Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Rebibis, Kenneth June; Marinissen, Erik Jan; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Decoupling capacitor integration in passive silicon interposer
Detalle, Mikael; Roda Neve, Cesar; Nolmans, Philip; Miller, Andy; La Manna, Antonio; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2015) -
ESD protection design in active interposer for 2.5 and 3D systems-in-package
Scholz, Mirko; Hellings, Geert; Chen, Shih-Hung; Linten, Dimitri; Detalle, Mikael; Roda Neve, Cesar; Shibkov, Andrei; La Manna, Antonio; Van der Plas, Geert; Beyne, Eric (2015-09) -
ESD protection design in smart interposer
Scholz, Mirko; Hellings, Geert; Linten, Dimitri; Detalle, Mikael; La Manna, Antonio; Van der Plas, Geert; Beyne, Eric (2015-05) -
Fat damascene wires for high bandwidth routing in silicon interposer
Detalle, Mikael; Kim, Jaemin; Nolmans, Philip; Sun, Xiao; Ryckaert, Julien; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
High density, low leakage back-end 3D capacitors for mixed signals applications
Detalle, Mikael; Barrenetxea, Mikel; Muller, Philippe; Potoms, Goedele; Phommahaxay, Alain; Soussan, Philippe; Vaesen, Kristof; De Raedt, Walter (2010) -
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
Roda Neve, Cesar; Detalle, Mikael; Nolmans, Philip; Li, Yunlong; De Vos, Joeri; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2016)