Browsing by author "Lagrange, Sébastien"
Now showing items 1-16 of 16
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A controlled deposition of organic contamination and the removal with ozone based cleaning
Claes, Martine; De Gendt, Stefan; Kenens, Conny; Conard, Thierry; Bender, Hugo; Storm, Wolfgang; Bauer, T.; Lagrange, Sébastien; Mertens, Paul; Heyns, Marc (2001) -
Critical issues in post Cu CMP cleaning
Fyen, Wim; Vos, Rita; Teerlinck, Ivo; Lagrange, Sébastien; Lauerhaas, Jeff; Meuris, Marc; Mertens, Paul; Heyns, Marc (2000) -
Evaluation of ozonated water spray for resist cleaning applications
De Gendt, Stefan; Lux, Marcel; Claes, Martine; Jassal, A. S.; Van Hoeymissen, Jan; Lagrange, Sébastien; Bergman, E.; Mertens, Paul; Heyns, Marc (1999) -
Evaluation of ozonated water spray for resist cleaning applications
De Gendt, Stefan; Lux, Marcel; Claes, Martine; Van Hoeymissen, Jan; Conard, Thierry; Worth, W.; Lagrange, Sébastien; Bergman, E.; Jassal, A. S.; Mertens, Paul; Heyns, Marc (2000) -
Making the cleaner greener
Bergman, E.; Lagrange, Sébastien; Claes, M. (2001) -
Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
Brongersma, Sywert; Vervoort, Iwan; Judelewicz, Moshe; Bender, Hugo; Conard, Thierry; Vandervorst, Wilfried; Beyer, Gerald; Richard, Emmanuel; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (1999) -
Ozonated HF applications in a spray processing tool
Claes, M.; Röhr, Erika; De Gendt, Stefan; Heyns, Marc; Lagrange, Sébastien; Bergman, E. (2001) -
Ozonated HF applications in a spray processing tool
Claes, Martine; Röhr, Erika; De Gendt, Stefan; Lagrange, Sébastien; Bergman, E.; Heyns, Marc (2002) -
Pattern dependent corrosion effects in HF based post-Cu CMP cleanings
Fyen, Wim; Teerlinck, Ivo; Lagrange, Sébastien; Brongersma, Sywert; Steegen, An; Mertens, Paul; Heyns, Marc (2001) -
Pre-diffusion cleaning using ozone and HF
Bergman, E. J.; Lagrange, Sébastien; Claes, Martine; De Gendt, Stefan; Röhr, Erika (2001) -
Roles of additive during filling process of damascene structures with electrochemical deposited copper
Richard, Emmanuel; Vervoort, Iwan; Brongersma, Sywert; Beyer, Gerald; Bender, Hugo; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (1999) -
Roles of additives during filling process of damascene structures with electrochemical deposited copper
Richard, Emmanuel; Vervoort, Iwan; Brongersma, Sywert; Bender, Hugo; Beyer, Gerald; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (2000) -
Self-annealing characterization of electroplated copper films
Lagrange, Sébastien; Brongersma, Sywert; Judelewicz, Moshe; Saerens, Annelies; Vervoort, Iwan; Richard, Emmanuel; Palmans, Roger; Maex, Karen (1999) -
Self-annealing characterization of electroplated copper films
Lagrange, Sébastien; Brongersma, Sywert; Judelewicz, Moshe; Saerens, Annelies; Vervoort, Iwan; Richard, Emmanuel; Palmans, Roger; Maex, Karen (2000) -
TOFSIMS evaluation of the removal of resists on silicon by ozone-based cleaning
Conard, Thierry; Kenens, Conny; De Gendt, Stefan; Claes, Martine; Lagrange, Sébastien; WorthA, W.; Jassal, S.; Vandervorst, Wilfried (2000) -
Two-step room temperature grain growth in electroplated copper
Brongersma, Sywert; Richard, Emmanuel; Vervoort, Iwan; Bender, Hugo; Vandervorst, Wilfried; Lagrange, Sébastien; Beyer, Gerald; Maex, Karen (1999)