Browsing by author "Beynet, Julien"
Now showing items 1-11 of 11
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Highly-conformal plasma-enhanced atomic-layer deposition silicon dioxide liner for high aspect-ratio through-silicon via 3D interconnections
Civale, Yann; Redolfi, Augusto; Velenis, Dimitrios; Heylen, Nancy; Beynet, Julien; Jung, Insoo; Woo, Jeong-Jun; Swinnen, Bart; Beyer, Gerald; Beyne, Eric (2012) -
Integration and dielectric reliability of 30nm 1/2 pitch structures in Aurora LK HM
Demuynck, Steven; Huffman, Craig; Claes, Martine; Suhard, Samuel; Versluijs, Janko; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Croes, Kristof; Struyf, Herbert; Vereecke, Guy; Verdonck, Patrick; De Roest, David; Beynet, Julien; Sprey, Hessel; Beyer, Gerald (2009) -
Integration and dielectric reliability of 30nm ½ pitch structures in Aurora® LK HM
Demuynck, Steven; Huffman, Craig; Claes, Martine; Suhard, Samuel; Versluijs, Janko; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Croes, Kristof; Struyf, Herbert; Vereecke, Guy; Verdonck, Patrick; De Roest, David; Beynet, Julien; Sprey, Hessel; Beyer, Gerald (2010) -
Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
De Roest, David; Vereecke, Bart; Huffman, Craig; Heylen, Nancy; Croes, Kristof; Arai, H; Takamure, N; Beynet, Julien; Sprey, Hessel; Matsushita, K; Kobayashi, N; Verdonck, Patrick; Demuynck, Steven; Beyer, Gerald; Tokei, Zsolt (2009) -
Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
De Roest, David; Vereecke, Bart; Huffman, Craig; Heylen, Nancy; Croes, Kristof; Arai, H.; Takamure, N.; Beynet, Julien; Sprey, Hessel; Matsushita, K.; Kobayashi, N.; Verdonck, Patrick; Demuynck, Steven; Beyer, Gerald; Tokei, Zsolt (2009) -
Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials
Travaly, Youssef; Van Aelst, Joke; Truffert, Vincent; Verdonck, Patrick; Dupont, Tania; Camerotto, Elisabeth; Richard, Olivier; Bender, Hugo; Croes, Kristof; De Roest, David; Vereecke, Guy; Claes, Martine; Le, Quoc Toan; Kesters, Els; Van Cauwenberghe, Marc; Beynet, Julien; Kaneko, S.; Struyf, Herbert; Baklanov, Mikhaïl; Matsushita, K.; Kobayashi, N.; Sprey, Hessel; Beyer, Gerald (2008) -
Low temperature plasma-enhanced ALD enables cost-effective spacer defined double patterning (SDDP)
Beynet, Julien; Wong, Patrick; Miller, Andy; Locorotondo, Sabrina; Vangoidsenhoven, Diziana; Yoon, Tae-Ho; Demand, Marc; Park, Hyung-Sang; Vandeweyer, Tom; Sprey, Hessel; Yoo, Yong-Min; Maenhoudt, Mireille (2009) -
Plasma enhanced atomic layer deposition of silicon oxide for through silicon via
Kwon, Hak-Yong; Kim, Jeon-Ho; Kim, Young-Hoon; Kim, Young-Jae; Kim, Dae-Youn; Choi, Seung-Woo; Park, Hyung-Sang; Yoo, Yong-Min; Thangaraju, Sarasvathi; Redolfi, Augusto; Travaly, Youssef; Swinnen, Bart; Beynet, Julien (2010) -
Relationships between deposition parameters, step coverage, throughput, and electrical properties of PEALD SiO2 insulation liners for HVM TSV application
Jung, In Soo; Woo, Jeong-Jun; Kwon, Hak Yong; Kim, Young-Jae; Kang, Dong-Suk; Park, Ju-Hyuk; Ahn, Dae-Young; Choi, Seung-Woo; Park, Hyung-Sang; Yoo, Yong Min; Civale, Yann; Redolfi, Augusto; Thangaraju, Sarasvathi; Travaly, Youssef; Swinnen, Bart; Beyne, Eric; De Roest, David; Beynet, Julien (2011) -
Use of MIR-FTIR and k-value measurements to assess potential solutions to reduce damage during porous low-k integration
Beynet, Julien; De Roest, David; Rochat, N.; Kellens, Kristof; Verdonck, Patrick; Sprey, Hessel (2009) -
Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route
De Roest, David; Travaly, Youssef; Beynet, Julien; Sprey, Hessel; Labat, Julianne; Huffman, Craig; Verdonck, Patrick; Kaneko, S.; Matsushita, K.; Kobayashi, N.; Beyer, Gerald (2009)