Authors

Jung, In Soo; Woo, Jeong-Jun; Kwon, Hak Yong; Kim, Young-Jae; Kang, Dong-Suk; Park, Ju-Hyuk; Ahn, Dae-Young; Choi, Seung-Woo; Park, Hyung-Sang; Yoo, Yong Min; Civale, Yann; Redolfi, Augusto; Thangaraju, Sarasvathi; Travaly, Youssef; Swinnen, Bart; Beyne, Eric; De Roest, David; Beynet, Julien

Conference

11th International Conference on Atomic Layer Deposition - ALD

Title

Relationships between deposition parameters, step coverage, throughput, and electrical properties of PEALD SiO2 insulation liners for HVM TSV application

Publication type

Meeting abstract