Browsing by author "Civale, Yann"
Now showing items 1-20 of 43
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1.9 nm wide ultra-high aspect-ratio bulk-Si FinFETs
Jovanovic, VladimirFaculty of Electrical; Poljak, Mirko; Suligoj, Tomislav; Civale, Yann; Nanver, Lis (2009) -
3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012) -
3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Duval, Fabrice; Jaenen, Patrick; Travaly, Youssef; Soussan, Philippe; Swinnen, Bart; Beyne, Eric (2011) -
Advanced physical analysis of 3D interconnect
Ramachandran, Vidhya; Torregiani, Cristina; Dong Wook, Kim; Gu, Sam; Nowak, Matt; DiBattista, Michael; Babak, Motamedi; Civale, Yann; Redolfi, Augusto; Beyne, Eric; Croes, Kristof; Li, Yunlong; Routh, Bryan; Rue, Chad (2012) -
Al-mediated solid-phase epitaxy of silicon-on-insulator
Sakic, A.; Civale, Yann; Nanver, L.K.; Biasotto, C.; Jovanovic, V. (2010) -
Bath stability monitoring for electroless Cu seed formation in high aspect ratio TSV
Inoue, Fumihiro; Philipsen, Harold; Armini, Silvia; Radisic, Alex; Civale, Yann; Leunissen, Peter; Shingubara, Shose (2012) -
Cost comparison between 3D and 2.5D integration
Velenis, Dimitrios; Detalle, Mikael; Civale, Yann; Marinissen, Erik Jan; Beyer, Gerald; Beyne, Eric (2012) -
Cu electrodeposition for Through-Silicon Via Technology
Philipsen, Harold; Luhn, Ole; Sabuncuoglu Tezcan, Deniz; Civale, Yann; Ruythooren, Wouter (2009) -
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Huyghebaert, Cedric; Van Olmen, Jan; Civale, Yann; Phommahaxay, Alain; Jourdain, Anne; Sood, Sumant; Farrens, Shari; Soussan, Philippe (2010) -
Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Jaenen, Patrick; Agarwal, Rahul; Duval, Fabrice; Soussan, Philippe; Travaly, Youssef; Beyne, Eric (2009) -
Dry etch solutions for 3D integration technology
Tutunjyan, Nina; Van Cauwenberghe, Marc; Verdonck, Patrick; Majeed, Bivragh; Buisson, Thibault; Civale, Yann; Boullart, Werner (2010) -
Effect of TSV presence on FEOL yield and reliability
Kauerauf, Thomas; Branka, Anna; Croes, Kristof; Redolfi, Augusto; Civale, Yann; Torregiani, Cristina; Groeseneken, Guido; Beyne, Eric (2013) -
Electrical characterization method to study barrier integrity in 3D through-silicon vias
Li, Yunlong; Velenis, Dimitrios; Kauerauf, Thomas; Stucchi, Michele; Civale, Yann; Redolfi, Augusto; Croes, Kristof (2012) -
Electrodeposition for 3D integration
Philipsen, Harold; Radisic, Alex; Luhn, Ole; Civale, Yann; Vandersmissen, Kevin; Rodet, Simon; Honore, Mia; Leunissen, Peter (2010) -
Electroless copper bath stability monitoring with UV-VIS spectroscopy, pH, and mixed potential measurements
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Shingubara, Shoso; Leunissen, Peter (2012) -
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Inoue, Fumihiro; Philipsen, Harold; Radisic, Alex; Armini, Silvia; Civale, Yann; Leunissen, Peter; Kondo, Muneharu; Webb, Eric; Shingubara, Shoso (2013) -
Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects
Civale, Yann; Armini, Silvia; Philipsen, Harold; Redolfi, Augusto; Velenis, Dimitrios; Croes, Kristof; Heylen, Nancy; El-Mekki, Zaid; Vandersmissen, Kevin; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications
Suhard, Samuel; Claes, Martine; Civale, Yann; Nolmans, Philip; Sabuncuoglu Tezcan, Deniz (2012) -
ESH solvent for stripping positive and negative photoresists in 3D-WLP and 3D-SIC applications
Suhard, Samuel; Claes, Martine; Civale, Yann; Nolmans, Philip; Sabuncuoglu Tezcan, Deniz; Travaly, Youssef (2010) -
Fabrication and electrical evaluation of va last polymer liner TSVs
Sabuncuoglu Tezcan, Deniz; Majeed, Bivragh; Civale, Yann; Soussan, Philippe; Beyne, Eric (2010)