Browsing by author "Travaly, Youssef"

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart (2010-11)

3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)

Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009)

3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009)

3D technology roadmap and status

Marchal, Pol; Van der Plas, Geert; Eneman, Geert; Moroz, V.; Badaroglu, Mustafa; Mercha, Abdelkarim; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Stucchi, Michele; Vandevelde, Bart; Oprins, Herman; Cherman, Vladimir; Croes, Kris; Redolfi, Augusto; La Manna, Antonio; Travaly, Youssef; Beyne, Eric; Cartuyvels, Rudi (2011)

3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias

Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Duval, Fabrice; Jaenen, Patrick; Travaly, Youssef; Soussan, Philippe; Swinnen, Bart; Beyne, Eric (2011)

A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007)

A theoretical and experimental study of atomic-layer-deposited films onto porous dielectric substrates

Travaly, Youssef; Schuhmacher, Jorg; Baklanov, Mikhaïl; Giangrandi, Simone; Richard, Olivier; Brijs, Bert; Van Hove, Marleen; Maex, Karen; Abell, Thomas; Somers, K.R.F; Hendrickx, M.F.A; Vanquickenborne, L.G.; Ceulemans, A.; Jonas, A.M (2005-10)

Aggressive scaling of Cu lowk: impact on metrology

Maex, Karen; Brongersma, Sywert; Iacopi, Francesca; Vanstreels, Kris; Travaly, Youssef; Baklanov, Mikhaïl; D'Haen, Jan; Beyer, Gerald (2005)

Air-gap formation by UV-assisted decomposition of CVD material

Pantouvaki, Marianna; Humbert, Aurelie; Van Besien, Els; Camerotto, Elisabeth; Travaly, Youssef; Richard, Olivier; Willegems, Myriam; Volders, Henny; Kellens, Kristof; Daamen, Roel; Hoofman, Romano; Beyer, Gerald (2008)

Air-gap formation by UV-assisted decomposition of CVD material

Pantouvaki, Marianna; Humbert, Aurelie; Van Besien, Els; Camerotto, Elisabeth; Travaly, Youssef; Richard, Olivier; Willegems, Myriam; Volders, Henny; Kellens, Kristof; Daamen, Roel; Hoofman, Romano; Beyer, Gerald (2008)

Atomic layer deposited barriers for copper interconnects

Schuhmacher, Jorg; Martin Hoyas, Ana; Ernur, Didem; Tokei, Zsolt; Travaly, Youssef; Bruynseraede, Christophe; Satta, Alessandra; Whelan, Caroline; Shamiryan, Denis; Beyer, Gerald; Abell, Thomas; Sutcliffe, Victor; Schaekers, Marc; Maex, Karen (2004)

Bottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayers

Maestre Caro, Arantxa; Armini, Silvia; Richard, Olivier; Maes, Guido; Borghs, Gustaaf; Whelan, Caroline M.; Travaly, Youssef (2010)

Challenges for structural stability of ultra-low-k based interconnects

Iacopi, Francesca; Brongersma, Sywert; Vandevelde, Bart; Travaly, Youssef; Maex, Karen (2004)

Challenges in the implentation of low-k dielectrics in the back-end of line

Hoofman, Romano; Brom - Verheyden, Greja; Michelon, Julien; Iacopi, Francesca; Travaly, Youssef; Baklanov, Mikhaïl; Tokei, Zsolt; Beyer, Gerald (2005)

Characterization and optimization of Cu-low k for 45nm and beyond

Maex, Karen; Brongersma, Sywert; Iacopi, Francesca; Travaly, Youssef; Tokei, Zsolt; Bruynseraede, Christophe; Beyer, Gerald (2004)

Characterization and optimization of porogen based PECVD deposited extreme low-k materials as a function of UV-cure time

Verdonck, Patrick; De Roest, David; Kaneko, Shinya; Caluwaerts, Rudy; Tsuji, Naoto; Matsushita, Kiyohiro; Kemeling, Nathan; Travaly, Youssef; Sprey, Hessel; Schaekers, Marc; Beyer, Gerald (2007)

Characterization of atomic layer deposited nanoscale structure on dense dielectric substrates by X-ray reflectivity

Travaly, Youssef; Schuhmacher, J.; Martin Hoyas, Ana; Abell, T.; Sutcliffe, Vic; Jonas, M.; Van Hove, Marleen; Maex, Karen (2005)

Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material

Travaly, Youssef; Kemeling, N.; Maenhoudt, Mireille; Peeters, S.; Tokei, Zsolt; Abell, Thomas; Schuhmacher, Jörg; Turturro, S.; Vos, Ingrid; Eugene, Lino; Matsuki, N.; Fukazawa, A.; Goundar, K.; Satoh, K.; Kato, M.; Kaneko, S.; Vertommen, Johan; Sprey, Hessel; Van Hove, Marleen; Jonas, A.; Maex, Karen (2004)

Characterization of the growth of atomic layer deposited WNxCy films on various substrates

Martin Hoyas, Ana; Travaly, Youssef; Schuhmacher, Jorg; Sajavaara, Timo; Whelan, Caroline; Eyckens, Brenda; Richard, Olivier; Giangrandi,; Brijs, Bert; Jonas, A.M.; Vantomme, Andre; Vandervorst, Wilfried; Celis, Jean-Pierre; Maex, Karen (2005)

Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration

Wostyn, Kurt; Zhao, Ming; Cui, Hushan; Laermans, Patrick; Jourdain, Anne; Verbinnen, Greet; Struyf, Herbert; De Strycker, Steven; Claes, Martine; Travaly, Youssef; Leunissen, Peter (2010)