Browsing by author "Travaly, Youssef"
Now showing items 21-40 of 102
-
CMOS 32nm technology node: business as usual for interconnect damascene patterning?
Beyer, Gerald; Ciofi, Ivan; Van Olmen, Jan; Carbonell, Laure; Versluijs, Janko; Wiaux, Vincent; Op de Beeck, Maaike; Maenhoudt, Mireille; Struyf, Herbert; Hendrickx, Dirk; de Marneffe, Jean-Francois; Vereecke, Guy; Claes, Martine; Bearda, Twan; Volders, Henny; Heylen, Nancy; Travaly, Youssef; Stucchi, Michele; Tokei, Zsolt; Cartuyvels, Rudi (2008-12) -
Comparison of modulus and density measurements by nanoidentation, SAWS, XRR and EP techniques of a porous low k MSQ dielectric
Abell, Thomas; Iacopi, Francesca; Prokopowicz, Greg; Sun, Brad; Mazurenko, Alex; Travaly, Youssef; Baklanov, Mikhaïl; Jonas, Alain; Sullivan, Chris; Brongersma, Sywert; Liou, Huey-Chiang; Tower, Josua; Gostein, Michael; Gallagher, Mike; Calvert, Jeff; Moinpour, Mansour; Maex, Karen (2005-01) -
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances
Mercha, Abdelkarim; Van der Plas, Geert; Moroz, V.; De Wolf, Ingrid; Asimakopoulos, Panagiotis; Minas, Nikolaos; Domae, Shinichi; Perry, Dan; Choi, M.; Redolfi, Augusto; Okoro, Chukwudi; Yang, Yu; Van Olmen, Jan; Thangaraju, Sarasvathi; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Cho, Jong Hoon; Yakovlev, A.; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Continued scalability of copper/low-k interconnects
Brongersma, Sywert; Carbonell, Laure; Vanstreels, Kris; Iacopi, Francesca; D'Haen, Jan; Zhang, Wenqi; Travaly, Youssef; Demuynck, Steven; Tokei, Zsolt; De Ceuninck, Ward; Maex, Karen (2005) -
Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment
Urbanowicz, Adam; Baklanov, Mikhaïl; Heijlen, Jeroen; Travaly, Youssef; Cockburn, Andrew (2007) -
Deposition and characterization of porogen based PECVD deposited and UV-cured extreme low-k materials
Verdonck, Patrick; De Roest, David; Kaneko, Shinya; Tsuji, Naoto; Matsushita, Kiyohiro; Travaly, Youssef; Sprey, Hessel; Schaekers, Marc; Beyer, Gerald (2007) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Jaenen, Patrick; Agarwal, Rahul; Duval, Fabrice; Soussan, Philippe; Travaly, Youssef; Beyne, Eric (2009) -
Effects of UV-cure on mechanical, physical and electrical properties of microporous SiOC:H dielectric films
Iacopi, Francesca; Waldfried, Carlo; Abell, Thomas; Guyer, Eric; Eyckens, Brenda; Travaly, Youssef; Sajavaara, Timo; Gage, David M.; Beyer, Gerald; Berry, Ivan; Dauskardt, Reinhold; Maex, Karen (2005) -
Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules
Maestre Caro, Arantxa; Travaly, Youssef; Maes, Guido; Borghs, Gustaaf; Armini, Silvia (2011) -
ESD evaluation of 3D SIC technology using TSV
Thijs, Steven; Linten, Dimitri; Scholz, Mirko; Mercha, Abdelkarim; Van der Plas, Geert; Travaly, Youssef; Van Olmen, Jan; Groeseneken, Guido (2010) -
ESH solvent for stripping positive and negative photoresists in 3D-WLP and 3D-SIC applications
Suhard, Samuel; Claes, Martine; Civale, Yann; Nolmans, Philip; Sabuncuoglu Tezcan, Deniz; Travaly, Youssef (2010) -
Evaluation of an advanced organic ultra-low-k material
Ferchichi, Abdelkarim; Travaly, Youssef; Beyer, Gerald; Baklanov, Mikhaïl; Vanstreels, Kris (2008) -
Evaluation of an advanced organic ultra-low-k material
Ferchichi, Abdelkarim; Travaly, Youssef; Carbonell, Laure; Vanstreels, Kris; Beyer, Gerald; Baklanov, Mikhaïl; Asakuma, S.; Nakajima, M. (2009) -
Evaluation of gas cluster ion beam processing for sealing af a porous dielectric
Brongersma, Sywert; Sherman, S.; Tabat, M.; Patz, Michael; Beyer, Gerald; Travaly, Youssef; Le, Quoc Toan; Caluwaerts, Rudy; Hautala, J. (2005-01) -
Filling of 80 nm structures using a novel copper oxide reduction and reflow approach
Carbonell, Laure; Palmans, Roger; Travaly, Youssef; Brongersma, Sywert; Maex, Karen (2004) -
Filling of 80nm trenches using a novel copper oxide reduction and reflow approach
Carbonell, Laure; Palmans, Roger; Travaly, Youssef; Tokei, Zsolt; Jonas, Alain M.; Brongersma, Sywert; Maex, Karen (2005) -
Growth and characterization of atomic layer deposited WCxNy
Martin Hoyas, Ana; Travaly, Youssef; Schuhmacher, Jorg; Sajavaara, T.; Whelan, Caroline; Eyckens, Brenda; Richard, Olivier; Giangrandi, Simone; Brijs, Bert; Jonas, A.M.; Vantomme, A.; Vandervorst, Wilfried; Celis, Jean-Pierre; Maex, Karen (2005) -
High quality NH2SAM (Self Assembled Monolayer) diffusion barrier for advanced copper interconnects
Maestre Caro, Arantxa; Zhao, Larry; Maes, Guido; Borghs, Gustaaf; Beyer, Gerald; Tokei, Zsolt; Armini, Silvia; Travaly, Youssef (2010) -
Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film
Tsutsue, Makoto; Travaly, Youssef; Ikeda, Atsushi; Tokei, Zsolt; Willegems, Myriam; Struyf, Herbert; Sinapi, Fabrice; Richard, Olivier; Kemeling, Nathan; De Roest, David; Fukuzawa, A.; Matsuki, N.; Sprey, Hessel; Beyer, Gerald (2007)