Browsing by author "Chan, BT"
Now showing items 1-20 of 139
-
28nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy directed self-assembly (DSA) process flow
Chan, BT; Tahara, Shigeru; Parnell, Doni; Rincon Delgadillo, Paulina; Gronheid, Roel; de Marneffe, Jean-Francois; Xu, Kaidong; Nishimura, Eiichi; Werner, Thilo (2013) -
300 mm silicon quantum computing: a silicon-based platform for quantum computing device technologies
Kubicek, Stefan; Govoreanu, Bogdan; Jussot, Julien; Chan, BT; Dumoulin Stuyck, Nard; Mohiyaddin, Fahd Ayyalil; Li, Roy; Simion, George; Ivanov, Tsvetan; Lee, James; Radu, Iuliana (2019) -
3D sequential low temperature top tier devices using dopant activation with excimer laser anneal and strained silicon as performance boosters
Vandooren, Anne; Wu, Zhicheng; Parihar, Narendra; Franco, Jacopo; Parvais, Bertrand; Matagne, Philippe; Debruyn, Haroen; Mannaert, Geert; Devriendt, Katia; Teugels, Lieve; Vecchio, Emma; Radisic, Dunja; Rosseel, Erik; Hikavyy, Andriy; Chan, BT; Waldron, Niamh; Mitard, Jerome; Besnard, G.; Alvarez, A.; Gaudin, G.; Schwarzenbach, W.; Radu, I.; Nguyen, B. Y.; Huet, K.; Tabata, T.; Mazzamuto, F.; Demuynck, Steven; Boemmels, Juergen; Collaert, Nadine; Horiguchi, Naoto (2020) -
3D sequential stacked planar devices featuring low-temperature replacement metal gate junctionless top devices with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018-11) -
3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability
Vandooren, Anne; Franco, Jacopo; Parvais, Bertrand; Wu, Zhicheng; Witters, Liesbeth; Walke, Amey; Li, Waikin; Peng, Lan; Deshpande, Veeresh Vidyadhar; Bufler, Fabian; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Ritzenthaler, Romain; Besnard, Guillaume; Schwarzenbach, Walter; Gaudin, Gweltaz; Radu, Ionut; Nguyen, Bich-Yen; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018) -
90nm W\Al2O3\TiW\Cu 1T1R CBRAM cell showing low-power, fast and disturb-free operation
Belmonte, Attilio; Kim, Woosik; Chan, BT; Heylen, Nancy; Fantini, Andrea; Houssa, Michel; Jurczak, Gosia; Goux, Ludovic (2013) -
A flexible 300 mm integrated Si MOS platform for electron- and hole-spin qubits exploration
Li, Roy; Dumoulin Stuyck, Nard; Kubicek, Stefan; Jussot, Julien; Chan, BT; Mohiyaddin, Fahd Ayyalil; Elsayed, Asser; Shehata, Mohamed; Simion, George; Godfrin, Clement; Canvel, Yann; Ivanov, Tsvetan; Goux, Ludovic; Govoreanu, Bogdan; Radu, Iuliana (2020) -
A Scalable One Dimensional Silicon Qubit Array with Nanomagnets
Simion, George; Mohiyaddin, Fahd Ayyalil; Li, Roy; Shehata, Mohamed; Dumoulin Stuyck, Nard; Elsayed, Asser; Ciubotaru, Florin; Kubicek, Stefan; Jussot, Julien; Chan, BT; Ivanov, Tsvetan; Godfrin, Clement; Spessot, Alessio; Matagne, Philippe; Govoreanu, Bogdan; Radu, Iuliana (2020) -
A thermally stable and high-performance 90nm Al2O3\Cu-based 1T1R CBRAM cell
Belmonte, Attilio; Kim, Woosik; Chan, BT; Heylen, Nancy; Fantini, Andrea; Houssa, Michel; Jurczak, Gosia; Goux, Ludovic (2013) -
Advanced etching for nanodevices and 2D materials
de Marneffe, Jean-Francois; Cooke, Mike; Goodyear, Andy; Braithwaite, Nicolas; Sutton, Yvonne; Bowden, Mark; Altamirano Sanchez, Efrain; Zotovich, Alexey; El Otell, Ziad; Chan, BT; Knoll, Armin; Rawlings, Colin; Duerig, Urs; Spiesser, Martin; Kaestner, Marcus; Neuber, Christian; Rangelow, Ivo (2016) -
Advanced processing steps for high efficiency solar cells based on EFG material
Junge, J.; Kaes, M.; Groetschel, D.; Zuschlag, A.; Seren, S.; Hahn, G.; Metz, A.; Chan, BT; John, Joachim; Beaucarne, Guy (2008) -
Advanced simulation & design of a spin-photon interface in silicon
Mohiyaddin, Fahd Ayyalil; Dumoulin Stuyck, Nard; Govoreanu, Bogdan; Li, Roy; Potocnik, Anton; Verjauw, Jeroen; Ciubotaru, Florin; Brebels, Steven; Chan, BT; Jussot, Julien; Kubicek, Stefan; Spessot, Alessio; Radu, Iuliana (2019) -
Area selective atomic layer deposition: a bottom-up approach for patterning
Delabie, Annelies; Soethoudt, Job; Tomczak, Yoann; Briggs, Basoene; Chan, BT; Tokei, Zsolt; Van Elshocht, Sven; Altamirano Sanchez, Efrain; Stevens, Eric; Parsons, Gregory, N (2018) -
Area-selective atomic layer deposition of TiN, TiO2, and HfO2 for advanced thin film patterning by delayed nucleation on plasma-treated amorphous carbon
Stevens, Eric; Tomczak, Yoann; Chan, BT; Altamirano Sanchez, Efrain; Parsons, Gregory; Delabie, Annelies (2018) -
Area-selective atomic layer deposition of TiN, TiO2, and HfO2 on Si3N4 in Sub-50 nanometer Si3N4/amorphous carbon structures
Stevens, Eric; Tomczak, Yoann; Chan, BT; Altamirano Sanchez, Efrain; Parsons, Gregory; Delabie, Annelies (2018) -
Area-selective atomic layer deposition of TiN, TiO2, and HfO2 on silicon ntride with inhibition on amorphous carbon
Stevens, Eric; Tomczak, Yoann; Chan, BT; Altamirano Sanchez, Efrain; Parsons, Gregory; Delabie, Annelies (2018) -
Area-selective Ru ALD by amorphous carbon modification using H plasma: from atomistic modeling to full wafer process integration
Zyulkov, Ivan; Voronina, Ekaterina; Krishtab, Mikhail; Voloshin, Dmitry; Chan, BT; Mankelevich, Yuri; Rakhimova, Tatyana; Armini, Silvia; De Gendt, Stefan (2020) -
Area-selective Ru-ALD by amorphous carbon modification using H radicals
Zyulkov, Ivan; Voronina,; Voloshin,; Chan, BT; Manchelevich,; Rachimova,; Armini, Silvia; De Gendt, Stefan (2019) -
Assessment of STI dry etch process variability by means of dynamic time warping technique
Milenin, Alexey; Chan, BT; Lazzarino, Frederic (2023) -
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Vandooren, Anne; Wu, Zhicheng; Khaled, Ahmad; Franco, Jacopo; Parvais, Bertrand; Li, W.; Witters, Liesbeth; Walke, Amey; Peng, Lan; Rassoul, Nouredine; Matagne, Philippe; Jamieson, Geraldine; Inoue, Fumihiro; Nguyen, B.Y.; Debruyn, Haroen; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Radisic, Dunja; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Chan, BT; Besnard, G.; Schwarzenbach, W.; Gaudin, G.; Radu, Iuliana; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Ryckaert, Julien; Collaert, Nadine; Mocuta, Dan (2019)