Now showing items 21-40 of 45

    • Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations 

      Bertheau, Julien; Inoue, Fumihiro; Phommahaxay, Alain; Peng, Lan; Iacovo, Serena; Rassoul, Nouredine; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Nakamura, Atsushi (2018)
    • Extreme thinning of Si wafers for via-last and multi wafer stacking applications 

      Jourdain, Anne; De Vos, Joeri; Rassoul, Nouredine; Zahedmanesh, Houman; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Ashraf, Huma; Thomas, Dave; Li, Shifang; Chang, Timothy; Hiebert, Stephen; Cross, Andrew; Stoerring, Moritz (2018)
    • Fabrication of magnetic tunnel junctions connected through a continuous free layer to enable spin logic devices 

      Wan, Danny; Manfrini, Mauricio; Vaysset, Adrien; Souriau, Laurent; Wouters, Lennaert; Thiam, Arame; Raymenants, Eline; Sayan, Safak; Jussot, Julien; Swerts, Johan; Couet, Sebastien; Rassoul, Nouredine; Babaei Gavan, Khashayar; Paredis, Kristof; Huyghebaert, Cedric; Ercken, Monique; Wilson, Chris; Mocuta, Dan; Radu, Iuliana (2018)
    • First demonstration of 3D stacked Finfets at a 45nm fin pitch and 110nm gate pitch technology on 300mm wafers 

      Vandooren, Anne; Franco, Jacopo; Wu, Zhicheng; Parvais, Bertrand; Li, Waikin; Walke, Amey; Peng, Lan; Deshpande, Paru; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Mannaert, Geert; Chan, BT; Ritzenthaler, Romain; Mitard, Jerome; Ragnarsson, Lars-Ake; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine (2018)
    • First demonstration of sub-12 nm gate last IGZO-TFTs with oxygen tunnel architecture for front gate devices 

      Subhechha, Subhali; Rassoul, Nouredine; Belmonte, Attilio; Delhougne, Romain; Donadio, Gabriele Luca; Banerjee, Kaustuv; Dekkers, Harold; van Setten, Michiel; Mao, Ming; Puliyalil, Harinarayanan; Kundu, Shreya; Pak, Murat; Teugels, Lieve; Tsvetanova, Diana; Bazzazian, Nina; Klijs, Lars; Vaisman Chasin, Adrian; Heijlen, Jeroen; Kar, Gouri Sankar (2021)
    • IGZO integration scheme for enabling IGZO nFETs 

      Kljucar, Luka; Mitard, Jerome; Rassoul, Nouredine; Dekkers, Harold; Steudel, Soeren; del Agua Borniquel, Jose Ignacio; De Wachter, Bart; Teugels, Lieve; Tsvetanova, Diana; Devriendt, Katia; Grisin, Ilja; Boccardi, Guillaume; Hody, Hubert; Nag, Manoj; Di Piazza, Luca; Wilson, Chris; Kar, Gouri Sankar; Tokei, Zsolt; Ramalingam, J.; Cao, Yong; Diehl, Daniel L. (2019)
    • IGZO-based compute cell for analog in-memory computing - DTCO analysis to enable ultralow-power AI at edge 

      Saito, Daisuke; Doevenspeck, Jonas; Cosemans, Stefan; Oh, Hyungrock; Perumkunnil, Manu; Papistas, Ioannis; Belmonte, Attilio; Rassoul, Nouredine; Delhougne, Romain; Kar, Gouri Sankar; Debacker, Peter; Mallik, Arindam; Verkest, Diederik; Na, Myung Hee (2020)
    • Integration challenges of spin torque majority gatelogic 

      Wilson, Chris; Manfrini, Mauricio; Thiam, Arame; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Vaysset, Adrien; Trivkovic, Darko; Ercken, Monique; Swerts, Johan; Briggs, Basoene; Sayan, Safak; Radu, Iuliana; Mocuta, Dan (2016)
    • Integration of interconnected magnetic tunnel junctions for spin torque majority gates 

      Wan, Danny; Manfrini, Mauricio; Souriau, Laurent; Sayan, Safak; Jussot, Julien; Swerts, Johan; Rassoul, Nouredine; Babaei Gavan, Khashayar; Wouters, Lennaert; Paredis, Kristof; Huyghebaert, Cedric; Vaysset, Adrien; Thiam, Arame; Ercken, Monique; Wilson, Chris; Mocuta, Dan; Radu, Iuliana (2017)
    • Interconnected magnetic tunnel junctions for spin-logic applications 

      Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Zografos, Odysseas; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, Morin; Sayan, Safak; Nikonov, Dmitry E.; Manipatruni, Sasikanth; Young, Ian A.; Mocuta, Dan; Radu, Iuliana (2018)
    • Interconnected MTJs driven by STT for spin-logic applications 

      Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, M; Sayan, S; Nikonov, D.E.; Manipatruni, S; Young, I. A.; Mocuta, Dan; Radu, Iuliana (2017)
    • Key challenges and opportunities for 3D sequential integration 

      Vandooren, Anne; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Zhicheng; Li, Waikin; Rosseel, Erik; Hikavyy, Andriy; Peng, Lan; Rassoul, Nouredine; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Waldron, Niamh; Boemmels, Juergen; De Heyn, Vincent; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine (2018-10)
    • Oxygen Defect Stability in Amorphous, C-Axis Aligned, and Spinel IGZO 

      van Setten, Michiel; Dekkers, Harold; Kljucar, Luka; Mitard, Jerome; Pashartis, Christopher; Subhechha, Subhali; Rassoul, Nouredine; Delhougne, Romain; Kar, Gouri Sankar; Pourtois, Geoffrey (2021)
    • Patterning challenges for beyond 3nm logic devices: Example of an interconnected magnetic tunnel junction 

      Thiam, Arame; Wan, Danny; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Swerts, Johan; Couet, Sebastien; Raymenants, Eline; Jussot, Julien; Trivkovic, Darko; Ercken, Monique; Wilson, Chris; Radu, Iuliana (2019)
    • Process-induced charging damage in IGZO nTFTs 

      Hiblot, Gaspard; Rassoul, Nouredine; Teugels, Lieve; Devriendt, Katia; Vaisman Chasin, Adrian; van Setten, Michiel; Belmonte, Attilio; Delhougne, Romain; Kar, Gouri Sankar (2021)
    • RIE dynamics for extreme wafer thinning applications 

      Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Inoue, Fumihiro; Piumi, Daniele; Miller, Andy; Beyne, Eric; Walsby, Edward; Jash Patel, Patel; Oliver, Ansell; Huma, Ashraf; Janet, Hopkins; Dave, Thomas (2017)
    • Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling 

      Vandooren, Anne; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Z.; Walke, Amey; Deshpande, Paru; Rosseel, Erik; Hikavyy, Andriy; Li, Waikin; Peng, L.; Rassoul, Nouredine; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018)
    • Staggered pillar patterning using 0.33NA EUV lithography 

      De Simone, Danilo; Blanc, Romuald; Van de Kerkhove, Jeroen; Tamaddon, Amir-Hossein; Fallica, Roberto; Van Look, Lieve; Rassoul, Nouredine; Lazzarino, Frederic; Vandenbroeck, Nadia; Vanelderen, Pieter; Lorusso, Gian; Van Roey, Frieda; Charley, Anne-Laure; Vandenberghe, Geert; Ronse, Kurt; Lee, Kilyoung; Lee, Junghyung; Park, Sarohan; Lim, Chang-Moon; Park, Chan-Ha (2019)
    • Study of Contact Resistance Components in Short-Channel Indium-Gallium-Zinc-Oxide Transistor 

      Tang, Hongwei; Dekkers, Harold; Rassoul, Nouredine; Sutar, Surajit; Subhechha, Subhali; Afanasiev, Valeri; Van Houdt, Jan; Delhougne, Romain; Kar, Gouri Sankar; Belmonte, Attilio (2024)
    • Sub-40mV Sigma-VTH IGZO nFETs in 300mm Fab 

      Mitard, Jerome; Kljucar, Luka; Rassoul, Nouredine; Dekkers, Harold; van Setten, Michiel; Vaisman Chasin, Adrian; Pourtois, Geoffrey; Belmonte, Attilio; Donadio, Gabriele Luca; Goux, Ludovic; Mao, Ming; Puliyalil, Harinarayanan; Teugels, Lieve; Tsvetanova, Diana; Nag, Manoj; Steudel, Soeren; del Agua Borniquel, Jose Ignacio; Ramalingam, Jothilingam; Delhougne, Romain; Wilson, Chris; Tokei, Zsolt; Kar, Gouri Sankar (2020)