Browsing by author "Murdoch, Gayle"
Now showing items 21-40 of 41
-
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP
Murdoch, Gayle; O'Toole, Martin; Marti, Giulio; Pokhrel, Ankit; Tsvetanova, Diana; Decoster, Stefan; Kundu, Souvik; Oniki, Yusuke; Thiam, Arame; Le, Quoc Toan; Varela Pedreira, Olalla; Lesniewska, Alicja; Martinez Alanis, Gerardo Tadeo; Park, Seongho; Tokei, Zsolt (2022-06-15) -
imec's iN5 BEOL patterning development
Li, Waikin; Mao, Ming; Trivkovic, Darko; Murdoch, Gayle; Halder, Sandip; Ercken, Monique (2017) -
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2017) -
Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; Murdoch, Gayle; De Vos, Joeri; Boemmels, Juergen; Beyne, Eric; Tokei, Zsolt (2016) -
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Tokei, Zsolt; Vega Gonzalez, Victor; Murdoch, Gayle; O'Toole, Martin; Croes, Kristof; Baert, Rogier; van der Veen, Marleen; Adelmann, Christoph; Soulie, Jean-Philippe; Boemmels, Juergen; Wilson, Chris; Park, Seongho; Sankaran, Kiroubanand; Pourtois, Geoffrey; Swerts, Johan; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Lazzarino, Frederic; Versluijs, Janko; Blanco, Victor; Ercken, Monique; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank; Heylen, Nancy; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Morin, Pierre; Jourdan, Nicolas; Van Elshocht, Sven; Ciofi, Ivan; Gupta, Anshul; Zahedmanesh, Houman; Vanstreels, Kris; Na, Myung Hee (2020) -
Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications
Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Murdoch, Gayle; Miller, Andy; Rebibis, Kenneth June; Guerrero, Alice; McCutcheon, Jeremy; Privett, Mark; Neidrich, Jason; Beyer, Gerald; Beyne, Eric (2013) -
Integration of ultralow-k dielectrics using a template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Murdoch, Gayle; Vega Gonzalez, Victor; Verdonck, Patrick; Heylen, Nancy; Zha, Lichen; Wu, Chen; Lesniewska, Alicja; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Lefferts, Scott (2017) -
Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below
Decoster, Stefan; Camerotto, Elisabeth; Murdoch, Gayle; Kundu, Souvik; Jurczak, Gosia; Le, Quoc Toan; Tokei, Zsolt; Lazzarino, Frederic (2022-04-26) -
Patterning of Ru metal lines at 18 nm pitch
Decoster, Stefan; Kundu, Souvik; Lazzarino, Frederic; Lariviere, Stephane; O'Toole, Martin; Murdoch, Gayle; van der Veen, Marleen; Heylen, Nancy; Le, Quoc Toan (2022) -
Process development using negative tone development for the dark field critical layers in a 28 nm node process
Versluijs, Janko; Truffert, Vincent; Murdoch, Gayle; De Bisschop, Peter; Trivkovic, Darko; Wiaux, Vincent; Kunnen, Eddy; Souriau, Laurent; Demuynck, Steven; Ercken, Monique (2012) -
Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations
Vega Gonzalez, Victor; Montero Alvarez, Daniel; Versluijs, Janko; Varela Pedreira, Olalla; Jourdan, Nicolas; Puliyalil, Harinarayanan; Chehab, Bilal; Peissker, Tobias; Haider, Ali; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Le, Quoc Toan; Bazzazian, Nina; Heylen, Nancy; van der Veen, Marleen; El-Mekki, Zaid; Webers, Tomas; Vats, H.; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Gillijns, Werner; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Ciofi, Ivan; De Wachter, Bart; Swerts, Johan; Grieten, Eva; Ercken, Monique; Kim, Ryan Ryoung han; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Nagesh, Nishanth; Ramakers, Leon; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021) -
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps
Lesniewska, Alicja; Varela Pedreira, Olalla; Lofrano, Melina; Murdoch, Gayle; van der Veen, Marleen; Dangol, Anish; Horiguchi, Naoto; Tokei, Zsolt; Croes, Kristof (2021) -
Self-aligned block and fully self-aligned via for iN5 metal 2 self-aligned quadruple patterning
Vincent, Benjamin; Franke, Joern-Holger; Juncker, Aurelie; Lazzarino, Frederic; Murdoch, Gayle; Halder, Sandip; Ervin, Joseph (2018) -
Self-aligned block and fully self-aligned via for iN5 Metal 2 Self-aligned quadruple patterning
Vincent, Benjamin; Franke, Joern-Holger; Juncker, Aurelie; Lazzarino, Frederic; Murdoch, Gayle; Halder, Sandip; Ervin, Joseph (2018) -
Semi-damascene Integration of a 2-layer MOL VHV Scaling Booster to Enable 4-track Standard Cells
Vega Gonzalez, Victor; Radisic, Dunja; Choudhury, Subhobroto; Tierno, Davide; Thiam, Arame; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Seidel, Felix; Decoster, Stefan; Kundu, Souvik; Tsvetanova, Diana; Peter, Antony; De Coster, Hanne; Sepulveda Marquez, Alfonso; Altamirano Sanchez, Efrain; Chan, BT; Drissi, Youssef; Sherazi, Yasser; Lee, Jae Uk; Ciofi, Ivan; Murdoch, Gayle; Nagesh, Nishanth; Hellings, Geert; Ryckaert, Julien; Biesemans, Serge; Dentoni Litta, Eugenio; Horiguchi, Naoto; Park, Seongho; Tokei, Zsolt (2022) -
Spacer self aligned double patterning: process control
Vandeweyer, Tom; Altamirano Sanchez, Efrain; Vangoidsenhoven, Diziana; Murdoch, Gayle; Groenendijk, Remco; Hepp, Birgitt; Mos, Evert; Finders, Jo; Vleeming, Bert; Dusa, Mircea; Maenhoudt, Mireille (2009) -
Subtractive etch of ruthenium for sub-5nm interconnect
Wan, Danny; Paolillo, Sara; Rassoul, Nouredine; Kutrzeba Kotowska, Bogumila; Blanco, Victor; Adelmann, Christoph; Lazzarino, Frederic; Ercken, Monique; Murdoch, Gayle; Boemmels, Juergen; Wilson, Chris; Tokei, Zsolt (2018) -
Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium
Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020) -
Toward successful integration of gap-filling ultralow-k dielectrics
Zhang, Liping; de Marneffe, Jean-Francois; Lesniewska, Alicja; Verdonck, Patrick; Heylen, Nancy; Murdoch, Gayle; Croes, Kristof; Tokei, Zsolt; Boemmels, Juergen; Lefferts, S.; De Gendt, Stefan; Baklanov, Mikhaïl (2016) -
Towards 26nm hp: advances in litho-process-litho
Wong, Patrick; Vangoidsenhoven, Diziana; Murdoch, Gayle; Maenhoudt, Mireille; Verhaegen, Staf; Wiaux, Vincent (2009)