Browsing by author "Jamieson, Geraldine"
Now showing items 21-40 of 43
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Highly scaled ruthenium interconnects
Dutta, Shibesh; Kundu, Shreya; Gupta, Anshul; Jamieson, Geraldine; Gomez Granados, Juan Fernando; Boemmels, Juergen; Wilson, Chris; Tokei, Zsolt; Adelmann, Christoph (2017) -
"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Heylen, Nancy; Peng, Lan; Jamieson, Geraldine; Tutunjyan, Nina; Sardo, Stefano; Miller, Andy; Beyne, Eric (2018) -
Integration of etched facet, electrically pumped, C-band fabry-perot lasers on a silicon photonic integrated circuit by transfer printing
Juvert Sandez, Joan; Cassese, Tommaso; Uvin, Sarah; De Groote, Andreas; Snyder, Brad; Bogaerts, Lieve; Jamieson, Geraldine; Van Campenhout, Joris; Roelkens, Gunther; Van Thourhout, Dries (2018-08) -
Key challenges and opportunities for 3D sequential integration
Vandooren, Anne; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Zhicheng; Li, Waikin; Rosseel, Erik; Hikavyy, Andriy; Peng, Lan; Rassoul, Nouredine; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Tao, Zheng; Waldron, Niamh; Boemmels, Juergen; De Heyn, Vincent; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine (2018-10) -
Key elements for sub-50μm pitch micro bump processes
De Vos, Joeri; Bogaerts, Lieve; Buisson, Thibault; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio; Beyne, Eric (2013) -
Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
Derakhshandeh, Jaber; Beyne, Eric; Beyer, Gerald; Capuz, Giovanni; Cherman, Vladimir; De Preter, Inge; Gerets, Carine; Shafahian, Ehsan; Kennes, Koen; Jamieson, Geraldine; Cochet, Tom; Webers, Tomas; Tobback, Bert; Van der Plas, Geert; La Tulipe, Douglas Charles; Phommahaxay, Alain; Miller, Andy (2022) -
Low temperature zero-level hermetic packaging for MEMS based on solder and polymer bonding
De Moor, Piet; Baert, Kris; Du Bois, Bert; Jamieson, Geraldine; Jourdain, Anne; Tilmans, Harrie; Van De Peer, Myriam; Witvrouw, Ann; Van Hoof, Chris (2003) -
Microbump development on small bump pitch (50μm and lower)
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012) -
Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling
Derakhshandeh, Jaber; Beyne, Eric; Capuz, Giovanni; Inoue, Fumihiro; Cherman, Vladimir; De Preter, Inge; Duval, Fabrice; Slabbekoorn, John; Gerets, Carine; Heyvaert, Cindy; Beirnaert, Filip; Cochet, Tom; Bex, Pieter; Hou, Lin; Lofrano, Melina; Jamieson, Geraldine; Heylen, Nancy; Suhard, Samuel; Honore, Mia; Webers, Tomas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald (2019) -
Patterning challenges of optical waveguides for sensing applications
Jamieson, Geraldine; Baier, Ulrich; Duval, Fabrice; Verheyen, Peter; Absil, Philippe; Lepage, Guy (2012) -
Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012-12) -
Reactive ion etching of Pt and Pt-Metal stacks, for mems applications using the DSE systems at Imec
Jamieson, Geraldine; Severi, Simone; Van Hoof, Rita; Du Bois, Bert; Helin, Philippe; Boullart, Werner (2009) -
Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process
Dutta, Shibesh; Kundu, Shreya; Wen, Lianggong; Jamieson, Geraldine; Croes, Kristof; Gupta, Anshul; Boemmels, Juergen; Wilson, Chris; Adelmann, Christoph; Tokei, Zsolt (2017) -
Ruthenium recess for buried power rail integration
Gupta, Anshul; Grzeskowiak, Jodi; Jourdan, Nicolas; Yu, Kai-Hung; Joy, Nicolas; Kundu, Shreya; Teugels, Lieve; Boemmels, Juergen; Adelmann, Christoph; Heylen, Nancy; Jamieson, Geraldine; Smith, Jeffrey; Raley, Angelique; deVilliers, Anton; Biesemans, Serge; Wilson, Chris; Leusink, Gert; Tokei, Zsolt (2019) -
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
Vandooren, Anne; Witters, Liesbeth; Franco, Jacopo; Mallik, Arindam; Parvais, Bertrand; Wu, Z.; Walke, Amey; Deshpande, Paru; Rosseel, Erik; Hikavyy, Andriy; Li, Waikin; Peng, L.; Rassoul, Nouredine; Jamieson, Geraldine; Inoue, Fumihiro; Verbinnen, Greet; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Waldron, Niamh; De Heyn, Vincent; Mocuta, Dan; Collaert, Nadine (2018) -
Si recess etch for 3D stacked IC applications.
Van Cauwenberghe, Marc; Tutunjyan, Nina; Jamieson, Geraldine; Verdonck, Patrick; Huyghebaert, Cedric; Jourdain, Anne; Conard, Thierry; Boullart, Werner; Travaly, Youssef; Swinnen, Bart (2010) -
Sub-100 nm2 cobalt interconnects
Dutta, Shibesh; Beyne, Sofie; Gupta, Anshul; Kundu, Shreya; Bender, Hugo; Van Elshocht, Sven; Jamieson, Geraldine; Vandervorst, Wilfried; Boemmels, Juergen; Wilson, Chris; Tokei, Zsolt; Adelmann, Christoph (2018) -
The influence of grinding and cleaning on Deep Reactive Ion Etching
Verdonck, Patrick; Van Cauwenberghe, Marc; Phommahaxay, Alain; Jamieson, Geraldine; Bogaerts, Lieve; Cotrin Teixeira, Ricardo; Huyghebaert, Cedric; Tutunjyan, Nina; Bearda, Twan; Boullart, Werner (2009) -
The Minipackage: a flexible wafer-level packaging solution for MEMS
De Moor, Piet; Baert, Kris; Bogaerts, Lieve; Du Bois, Bert; Jamieson, Geraldine; Jourdain, Anne; Van Hoof, Chris (2004) -
Topside release of atomic force microscopy probes with molded diamond tips
Fouchier, Marc; Eyben, Pierre; Jamieson, Geraldine; Vandervorst, Wilfried (2004)