Recently added

Miniaturization of NIR/SWIR image sensors enabled by thin-film photodiode monolithic integration

Furxhi, Orges; Malinowski, Pawel; Lee, Jiwon; Li, Yunlong; Georgitzikis, Epimitheas; Pejovic, Vladimir; Lieberman, Itai; Verschooten, Tom; Thijs, Steven; Heremans, Paul; Cheyns, David (2021)

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Joa, Gaehun; Edinger, Pierre; Bleiker, Simon J.; Wang, Xiaojing; Takabayashi, Alain Yuji; Sattari, Hamed; Quack, Niels; Jezzini, Moises; Verheyen, Peter; Stemme, Goran; Bogaerts, Wim; Gylfason, Kristinn B.; Niklaus, Frank (2021)

Disagreement Options: Task Adaptation Through Temporally Extended Actions

Hutsebaut-Buysse, Matthias; De Schepper, Tom; Mets, Kevin; Latre, Steven (2021)

Securing E-Health Networks by applying Network Slicing and Blockchain Techniques

Villaca, Rodolfo; de Brito e Goncalves, Joao; Carvalho de Resende, Henrique Cesar; Municio, Esteban; Marquez-Barja, Johann (2021)

ORCHESTRA 2.0: Enhancing a multi-access solution to address 5G challenges

Nunes Pinheiro, Joao; Municio, Esteban; Leysen, Christiaan; Marquez-Barja, Johann (2021)

Unraveling Edge-based in-vehicle infotainment using the Smart Highway testbed

Slamnik, Nina; Marquez-Barja, Johann (2021)

Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers

Chery, Emmanuel; Slabbekoorn, John; Pinho, Nelson; Miller, Andy; Beyne, Eric (2021)

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021)

A novel integration scheme for wafer singulation and selective processing using temporary dry film resist

La Grappe, Alexandre; Visker, Evert; Redolfi, Augusto; Peng, Lan; Muga, Karthik; Huls, David; Vanhaelemeersch, Serge; Lauwers, Anne; Ackaert, Jan (2021)

Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology

Van Huylenbroeck, Stefaan; De Vos, Joeri; Teugels, Lieve; Iacovo, Serena; Fodor, Ferenc; Miller, Andy; Van der Plas, Geert; Beyer, Gerald; Beyne, Eric (2021)

Live Demonstration of a Highly Scalable Fog Service Orchestrator

Goethals, Tom; De Turck, Filip; Volckaert, Bruno (2021)

Parameterization of the Quality Factor for the High Throughput JPEG 2000

Ahar, Ayyoub; Watanabe, Osamu; Taubman, David; Saeed, Mahmoudpour; Schelkens, Peter (2020)

Design-Technology Co-Optimization of Sequential and Monolithic CFET as enabler of technology node beyond 2nm

Chehab, Bilal; Ryckaert, Julien; Schuddinck, Pieter; Weckx, Pieter; Horiguchi, Naoto; Mirabelli, Gioele; Spessot, Alessio; Na, Myung Hee (2021)

ALD Encapsulation of CVD WS2 for Stable and High-Performance FET Devices

Wu, Xiangyu; Lin, Dennis; Cott, Daire; De Marneffe, Jean-Francois; Groven, Benjamin; Sergeant, Stefanie; Shi, Yuanyuan; Smets, Quentin; Sutar, Surajit; Asselberghs, Inge; Radu, Iuliana (2021)

Nanosheet FETs and their Potential for Enabling Continued Moore's Law Scaling

Veloso, Anabela; Eneman, Geert; De Keersgieter, An; Jang, Doyoung; Mertens, Hans; Matagne, Philippe; Dentoni Litta, Eugenio; Ryckaert, Julien; Horiguchi, Naoto (2021)

Integrated Active Microfluidics using Flat Panel Display Technology with Two Different Semiconductor Grade Polymers

Liang, Boshen; Keulemans, Grim; Wysocka, Dominika; Podkovskiy, Alexey; Zhang, Lei; Rochus, Veronique; Stakenborg, Tim; Heremans, Paul; Cheyns, David (2021)

FMM Free Organic and Hybrid Electronics Manufacturing Enabled by Photolithography

Ke, Tung Huei; Sandehang, Calvin Mona; Tsai, Chi-Ting; Molina Alvarez, Gema; Vandenplas, Erwin; Heremans, Paul; Malinowski, Pawel (2021)

LOW-VOLTAGE SILICON PHOTONIC MEMS SWITCH WITH VERTICAL ACTUATION

Sattari, Hamed; Takabayashi, Alain Y.; Edinger, Pierre; Verheyen, Peter; Gylfason, Kristinn B.; Bogaerts, Wim; Quack, Niels (2021)

MULTI-FREQUENCY IMAGING WITH A CMOS COMPATIBLE SCANDIUM DOPED ALUMINUM NITRIDE PMUT ARRAY

Billen, Margo; Gao, Hang; Marigo, Eloi; Soundara-Pandian, Mohan; Tabruyn, Dries; Helin, Philippe; Rochus, Veronique (2021)

IMAGING OF OVERLAY AND ALIGNMENT MARKERS UNDER OPAQUE LAYERS USING PICOSECOND LASER ACOUSTIC MEASUREMENTS AM: Advanced Metrology

Mehendale, M.; Antonelli, A.; Mair, R.; Mukundhan, P.; Bogdanowicz, Janusz; Charley, Anne-Laure; Leray, Philippe; Yasin, Farrukh; Crotti, Davide (2021)

imec Publications: Recent submissions

Miniaturization of NIR/SWIR image sensors enabled by thin-film photodiode monolithic integration ﻿

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS ﻿

Disagreement Options: Task Adaptation Through Temporally Extended Actions ﻿

Securing E-Health Networks by applying Network Slicing and Blockchain Techniques ﻿

ORCHESTRA 2.0: Enhancing a multi-access solution to address 5G challenges ﻿

Unraveling Edge-based in-vehicle infotainment using the Smart Highway testbed ﻿

Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers ﻿

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps ﻿

A novel integration scheme for wafer singulation and selective processing using temporary dry film resist ﻿

Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology ﻿

Live Demonstration of a Highly Scalable Fog Service Orchestrator ﻿

Parameterization of the Quality Factor for the High Throughput JPEG 2000 ﻿

Design-Technology Co-Optimization of Sequential and Monolithic CFET as enabler of technology node beyond 2nm ﻿

ALD Encapsulation of CVD WS2 for Stable and High-Performance FET Devices ﻿

Nanosheet FETs and their Potential for Enabling Continued Moore's Law Scaling ﻿

Integrated Active Microfluidics using Flat Panel Display Technology with Two Different Semiconductor Grade Polymers ﻿

FMM Free Organic and Hybrid Electronics Manufacturing Enabled by Photolithography ﻿

LOW-VOLTAGE SILICON PHOTONIC MEMS SWITCH WITH VERTICAL ACTUATION ﻿

MULTI-FREQUENCY IMAGING WITH A CMOS COMPATIBLE SCANDIUM DOPED ALUMINUM NITRIDE PMUT ARRAY ﻿

IMAGING OF OVERLAY AND ALIGNMENT MARKERS UNDER OPAQUE LAYERS USING PICOSECOND LASER ACOUSTIC MEASUREMENTS AM: Advanced Metrology ﻿