Browsing Conference contributions by author "Labie, Riet"
Now showing items 1-20 of 54
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A PoF based methodology to assess the reliability of a sensor module operating in harsh industrial environments
Nawghane, Chinmay; Vandevelde, Bart; Labie, Riet; Michiels, Sam; Hughes, Danny; Liu, Mengyao (2022-04-20) -
A simple copper metallisation process for high cell efficiencies and reliable modules
Russell, Richard; Tous, Loic; Philipsen, Harold; Horzel, Jörg; Cornagliotti, Emanuele; Ngamo Toko, Michel; Choulat, Patrick; Labie, Riet; Beckers, Johan; Bertens, Jurgen; Fuji, Masaki; John, Joachim; Poortmans, Jef; Mertens, Robert (2012) -
Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Labie, Riet; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2018) -
Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures
Degryse, Dominiek; Labie, Riet; Vandevelde, Bart; Gonzalez, M.; Beyne, Eric (2002) -
Cell-module integration concept compatible with c-Si epitaxial thin foils and with efficiencies over 18%
Dross, Frederic; Van Nieuwenhuysen, Kris; Bearda, Twan; Debucquoy, Maarten; Depauw, Valerie; Govaerts, Jonathan; Boulord, Caroline; Granata, Stefano; Labie, Riet; Loozen, Xavier; Martini, Roberto; O'Sullivan, Barry; Radhakrishnan, S.; Baert, Kris; Gordon, Ivan; Poortmans, Jef (2012) -
Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
Labie, Riet; Ratchev, Petar; Beyne, Eric (2005-06) -
Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Limaye, Paresh; Labie, Riet; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2007) -
Cu plated I-perl cells: ageing and humidity reliability tests
Labie, Riet; Hernandez, Jose Luis; Govaerts, Jonathan; Allebe, Christophe; Tous, Loic; Uruena De Castro, Angel; Russell, Richard; Gordon, Ivan; Baert, Kris (2011) -
Cu-Cu bonding alternative to solder based micro-bumping
Ruythooren, Wouter; Beltran Amenabar, Amaia; Labie, Riet (2007) -
Cu/Sn microbumps interconnect for 3D TSV chip stacking
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Electrically active defects in plated crystalline silicon n+p solar cells: a DLTS perspective
Simoen, Eddy; Dang Thi Thuy, Chi; Labie, Riet; Poortmans, Jef (2018) -
Electro-migration behavior of Pb-free flip chip bumps
Labie, Riet; Webers, Tomas; Swinnen, Bart; Beyne, Eric (2005) -
Electromigration failure mechanisms for different flip chip configurations
Labie, Riet; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Croes, Kristof; Vandevelde, Bart; Dosseul, Franck (2011) -
Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies
Vandevelde, Bart; Labie, Riet; Cherman, Vladimir; Webers, Tomas; Winters, Christophe; Beyne, Eric; Dosseul, Franck (2011) -
Elimination of the axial deformation problem of Cu-TSV in 3D integration
Okoro, Chukwudi; Huyghebaert, Cedric; Van Olmen, Jan; Labie, Riet; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk (2010) -
Encapsulant-integrated interconnection of bifacial solar cells for BIPV applications: Latest results in the TWILL-BIPV project
Govaerts, Jonathan; Borgers, Tom; Van Dyck, Rik; Andries, Nick; Meyers, Pieter; van der Heide, Arvid; Vastmans, Luc; Moors, Reinoud; Doumen, Geert; Nivelle, Philippe; Daenen, Michaël; Voroshazi, Eszter; Arnett, Chad; Labie, Riet; Van den Storme, Manuel; Van den Storme, Guy; Dekens, Marc; Vandebroek, Steven; Schroyen, Peter; Smeers, Kris; Vavilkin, Tatjana; Dewallef, Stefan; Abgrall, Florent; Jousset, Dominique; Poortmans, Jef (2020-10) -
ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
Vandevelde, Bart; Nawghane, Chinmay; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel (2021) -
Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration
Zhang, Wenqi; Limaye, Paresh; Civale, Yann; Labie, Riet; Soussan, Philippe (2010) -
Finite element analysis of ultra thin BGA package: first and second level reliability
Limaye, Paresh; Vandevelde, Bart; de Vries, Hans; Degryse, Dominiek; Slob, Kees; van Veen, Co; Labie, Riet (2004-05)