Browsing Conference contributions by author "Labie, Riet"
Now showing items 21-40 of 53
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Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks
Beerten, Steven; Labie, Riet; Beyne, Eric; Van Hoof, Rita; Honoré, Mia (2000) -
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Labie, Riet; Willems, Geert (2016-04) -
Hermetically sealed on-chip packaging of MEMS devices
De Moor, Piet; Tilmans, Harrie; Van De Peer, Myriam; Labie, Riet; Beerten, Steven; Beyne, Eric; Van Hoof, Chris (2000) -
High-quality epitaxial foils, obtained by a layer transfer process, for integration in back-contacted solar cells processed on glass
Van Nieuwenhuysen, Kris; Gordon, Ivan; Bearda, Twan; Boulord, Caroline; Debucquoy, Maarten; Depauw, Valerie; Dross, Frederic; Govaerts, Jonathan; Granata, Stefano; Labie, Riet; Loozen, Xavier; Martini, Roberto; O'Sullivan, Barry; Sivaramakrishnan Radhakrishnan, Hariharsudan; Baert, Kris; Poortmans, Jef (2012) -
Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance
Mercha, Abdelkarim; Redolfi, Augusto; Stucchi, Michele; Minas, Nikolaos; Van Olmen, Jan; Thangaraju, Sarasvathi; Velenis, Dimitrios; Domae, Shinichi; Yang, Yu; Katti, Guruprasad; Labie, Riet; Okoro, Chukwudi; Zhao, Ming; Asimakopoulos, Panagiotis; De Wolf, Ingrid; Chiarella, Thomas; Schram, Tom; Rohr, Erika; Van Ammel, Annemie; Jourdain, Anne; Ruythooren, Wouter; Armini, Silvia; Radisic, Alex; Philipsen, Harold; Heylen, Nancy; Kostermans, Maarten; Jaenen, Patrick; Sleeckx, Erik; Sabuncuoglu Tezcan, Deniz; Debusschere, Ingrid; Soussan, Philippe; Perry, Dan; Van der Plas, Geert; Cho, Jong Hoon; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel; Vanderstraeten, Daniel; Blansaer, Eddy; Lannoo, Jonas; Pissoort, Davy (2019) -
Improving the QFN Board level Reliability using Low Melting LMPAQ Solder
Vandevelde, Bart; Labie, Riet; Lauwaert, R.; Telizsewski, S.; Werkhoven, D. (2020) -
In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs
De Wolf, Ingrid; Simons, Veerle; Cherman, Vladimir; Labie, Riet; Vandevelde, Bart; Beyne, Eric (2012) -
In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module
Labie, Riet; Vandevelde, Bart; Van Meensel, Wesley; Vogeleer, Mike; Werkhoven, Daniel; Allaert, Bart; Willems, Geert (2017) -
Influence of dielectric materials and via geometry on the thermomechanical behavior of silicon through interconnects
Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Beyne, Eric (2005) -
Influence of the processing method on the amount and development of voids in miniaturized interconnections
Dimcic, Biljana; Labie, Riet; Zhang, Wenqi; De Wolf, Ingrid; Verlinden, Bert (2010) -
Insights into the reliability of Ni/Cu plated p-PERC silicon solar cells
Dang Thi Thuy, Chi; Labie, Riet; Simoen, Eddy; Tous, Loic; Russell, Richard; Duerinckx, Filip; Mertens, Robert; Poortmans, Jef (2017) -
Investigation of Co UBM for direct bumping on Cu/lowK dies
Labie, Riet; Beyne, Eric; Ratchev, Petar (2003) -
Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Ratchev, Petar; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2005) -
Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests
Labie, Riet; Beyne, Eric; Mertens, Robert; Ratchev, Petar; Humbeeck, J.V. (2003-12) -
Large area copper plated silicon solar cell exceeding 19.5% efficiency
Tous, Loic; Russell, Richard; Das, Jo; Labie, Riet; Ngamo, Michel; Horzel, Jörg; Philipsen, Harold; Sniekers, Jeroen; Vandersmissen, Kevin; van den Brekel, Lukas; Janssens, Tom; Aleman, Monica; van Dorp, Dennis; Poortmans, Jef; Mertens, Robert (2012) -
Large-area hybrid silicon heterojunction solar cells with Ni/Cu plated front contacts
Tous, Loic; Granata, Stefano; Rouhi Najaf Abadi, Alireza; Lerat, Jean-Francois; Emeraud, Thierry; Martin de Nicolas, Silvia; Pletzer, Tobias Markus; Labie, Riet; Aleman, Monica; Russell, Richard; John, Joachim; Duerinckx, Filip; Szlufcik, Jozef; De Wolf, Stefaan; Ballif, Christophe; Mertens, Robert; Poortmans, Jef (2014) -
Mechanical and thermo-mechanical behavior of electroplated Copper Through Silicon Vias
Vanstreels, Kris; Okoro, Chukwudi; Labie, Riet (2010) -
Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints
Ratchev, Petar; Labie, Riet; Beyne, Eric (2004) -
Outperformance of Cu pillar flip chip bumps in electromigration testing
Labie, Riet; Dosseul, Franck; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Beyne, Eric; Vandevelde, Bart (2011)