Browsing Conference contributions by title

W vs. Co-Al as gate fill-metal for aggressively scaled replacement high-k/metal gate devices for (Sub-)22nm technology nodes

Veloso, Anabela; Chew, Soon Aik; Schram, Tom; Dekkers, Harold; Van Ammel, Annemie; Witters, Thomas; Tielens, Hilde; Heylen, Nancy; Devriendt, Katia; Sebaai, Farid; Brus, Stephan; Ragnarsson, Lars-Ake; Pantisano, Luigi; Eneman, Geert; Carbonell, Laure; Richard, Olivier; Favia, Paola; Geypen, Jef; Bender, Hugo; Higuchi, Yuichi; Phatak, Anup; Thean, Aaron; Horiguchi, Naoto (2012-09)

W-band high-gain amplifier using InP dual-gate HEMT technology

van der Zanden, Koen; Baeyens, Yves; Van Hove, Marleen; Schreurs, Dominique; De Raedt, Walter; Van Rossum, Marc (1997)

W-band millimeter wave artificial magnetic conductor realization by grounded frequency selective surfaces

Islam, S.; Stiens, J.; Poesen, G.; Jaeger, I.; Koers, G.; Vounckx, Roger (2007)

W-band speckle contrast images for inspection of concealed objects

Jaeger, I.; Zhang, L.; Stiens, J.; Sahli, Hichem; Vounckx, Roger (2007)

W2W permanent stacking for 3D system integration

Peng, Lan; Kim, Soon-Wook; Soules, Michael; Gabriel, Markus; Zoberbier, Margarete; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric (2014)

Wafer alignment mark placement accuracy impact on the layer to layer overlay performance

van Haren, Richard; Steinert, Steffen; Mouraille, Orion; D'have, Koen; Van Dijk, Leon; Hermans, Jan; Beyer, Dirk (2019)

Wafer and simulations study comparing 5 LELE decomposition algorithms for both compliant and non-compliant lay-outs

Fenger, Germain; La Cour, Pat; Tritchkov, Alex; Komirenko, Sergiy; Wiaux, Vincent (2009)

Wafer backside cleaning strategies for high-k/metal gate processing

Vos, Rita; Kesters, Els; Garaud, Sylvain; De Waele, Rita; Kenis, Karine; Lux, Marcel; Kraus, Harald; Snow, Jim; Shamiryan, Denis; Catana, Gabriela; Deweerd, Wim; Schram, Tom; De Gendt, Stefan; Mertens, Paul (2005)

Wafer backside thinning process integrated with post-thinning clean and TSV exposure recess etch

Zhao, Ming; Hayakawa, Susumu; Nishida, Yoshiteru; Jourdain, Anne; Tabuchi, Tomotaka; Leunissen, Peter (2012)

Wafer bonding and heterogeneous integration: III-V/silicon photonics

Roelkens, Gunther; Liu, Liu; Brouckaert, Joost; Van Campenhout, J.; Van Laere, Frederik; Van Thourhout, Dries; Baets, Roel (2008-06)

Wafer bow of substrate transfer process for GaNLED on Si 8 inch

Pham, Nga; Rosmeulen, Maarten; Bryce, George; Sabuncuoglu Tezcan, Deniz; Osman, Haris (2012)

Wafer cleaning: a quantifiable process step

Mertens, Paul; Loewenstein, Lee; Vos, Rita; De Gendt, Stefan; Bearda, Twan; Heyns, Marc (1998)

Wafer level characterization and failure analysis of microsensors

De Wolf, Ingrid; De Coster, Jeroen; Varela Pedreira, Olalla; Haspeslagh, Luc; Witvrouw, Ann (2008)

Wafer level characterization of the sacrificial HDP oxide lateral etching by anhydrous vapor HF with ethanol vapor for SiGe MEMS structures

Cui, Hushan; Van Hoof, Rita; Severi, Simone; Witvrouw, Ann; Knoops, An; Delande, Tinne; Pancken, Joris; Claes, Martine (2010)

Wafer level characterization of the sacrificial HDP oxide lateral etching by anhydrous vapor HF with ethanol vapor for SiGe MEMS structures

Cui, Hushan; Van Hoof, Rita; Severi, Simone; Witvrouw, Ann; Knoops, An; Delande, Tinne; Pancken, Joris; Claes, Martine (2010)