Recently added

Advanced etching for nanodevices and 2D materials

de Marneffe, Jean-Francois; Cooke, Mike; Goodyear, Andy; Braithwaite, Nicolas; Sutton, Yvonne; Bowden, Mark; Altamirano Sanchez, Efrain; Zotovich, Alexey; El Otell, Ziad; Chan, BT; Knoll, Armin; Rawlings, Colin; Duerig, Urs; Spiesser, Martin; Kaestner, Marcus; Neuber, Christian; Rangelow, Ivo (2016)

High-speed germanium-based waveguide electro-absorption modulator

De Heyn, Peter; Srinivasan, Ashwyn; Verheyen, Peter; Loo, Roger; De Wolf, Ingrid; Balakrishnan, Sadhishkumar; Lepage, Guy; Van Thourhout, Dries; Pantouvaki, Marianna; Absil, Philippe; Van Campenhout, Joris (2016)

A novel approach to an efficient LED on SOI

De Groote, Andreas; Cardile, Paolo; Subramanian, Ananth; Delbeke, Danaë; Baets, Roel; Roelkens, Gunther (2016)

Test-station for flexible semi-automatic wafer-level silicon photonics testing

De Coster, Jeroen; De Heyn, Peter; Pantouvaki, Marianna; Snyder, Brad; Chen, Hongtao; Marinissen, Erik Jan; Absil, Philippe; Van Campenhout, Joris; Bolt, Bryan (2016)

Troubleshooting wireless home networks using a portable testbed

Dalipi, Enri; Sercu, Vincent; Becue, Pieter; Jooris, Bart; Moerman, Ingrid; Hoebeke, Jeroen (2016)

Liquid crystal based beam deflectors

Cuypers, Dieter; Shang, Xiaobing; De Smet, Herbert (2016)

Compressed sensing and defect-based dictionaries for characteristics extraction in MM-wave non-destructive testing

Cristofani, Edison; Becquaert, Mathias; Pandey, Gokarna; Vandewal, Marijke; Deligiannis, Nikos; Stiens, Johan (2016)

Bifacial n-PERT cells (Bi-PERT) with plated contacts for multi-wire interconnection

Cornagliotti, Emanuele; Russell, Richard; Tous, Loic; Uruena De Castro, Angel; Duerinckx, Filip; Aleman, Monica; Choulat, Patrick; Sharma, Aashish; John, Joachim; Szlufcik, Jozef (2016)

Modeling of graphene for interconnect applications

Contino, Antonino; Ciofi, Ivan; Politou, Maria; Verkest, Diederik; Mocuta, Dan; Soree, Bart; Groeseneken, Guido (2016)

Challenges in LER/CDU metrology in DSA: placement error and cross-line correlations

Constantoudis, Vassilios; Kuppuswamy, V.K.M.; Gogolides, Evangelos; Vaglio Pret, Alessandro; Pathangi Sriraman, Hari; Gronheid, Roel (2016)

Combining DSM and storage to alleviate current congestion in distribution grids

Coninx, Kristof; Moradzadeh, Mohammad; Holvoet, Tom (2016)

Interface passivation of III-V/high-k materials by High Energy X-ray Photoelectron Spectroscopy: A quantitative evaluation

Conard, Thierry; Spampinato, Valentina; Nyns, Laura; Sioncke, Sonja; Ablett, James; Vandervorst, Wilfried (2016)

De l'importance des surfaces et interfaces pour le développement des matériaux et processus pour les dispositifs semi-conducteurs et photovoltaïques : avantages et limitations de la photoémission

Conard, Thierry (2016)

Vertical devices for future nano-electronic applications

Collaert, Nadine; Veloso, Anabela; Huynh Bao, Trong; Yakimets, Dmitry; Ivanov, Tsvetan; Ramesh, Siva; Matagne, Philippe; Sibaja-Hernandez, Arturo; Liu, Ziyang; Merckling, Clement; Waldron, Niamh; Thean, Aaron (2016)

Beyond-Si materials and devices for more Moore and more than Moore applications

Collaert, Nadine; Alian, AliReza; Arimura, Hiroaki; Boccardi, Guillaume; Eneman, Geert; Franco, Jacopo; Ivanov, Tsvetan; Lin, Dennis; Mitard, Jerome; Ramesh, Siva; Rooyackers, Rita; Schaekers, Marc; Sibaja-Hernandez, Arturo; Sioncke, Sonja; Smets, Quentin; Vais, Abhitosh; Vandooren, Anne; Veloso, Anabela; Verhulst, Anne; Verreck, Devin; Waldron, Niamh; Walke, Amey; Witters, Liesbeth; Yu, Hao; Zhou, Daisy; Thean, Aaron (2016)

Atomic disorder as an intrinsic source of variability in filamentary RRAM devices – ab initio investigations

Clima, Sergiu; Fantini, Andrea; Goux, Ludovic; Govoreanu, Bogdan; Jurczak, Gosia; Pourtois, Geoffrey (2016)

A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow

Clark, William; Juncker, Aurelie; Paladugu, E.; Fried, David; Wilson, Chris; Pourtois, Geoffrey; Gallagher, Emily; de Jamblinne de Meux, Albert; Piumi, Daniele; Boemmels, Juergen; Tokei, Zsolt; Mocuta, Dan (2016)

Conference contributions: Recent submissions

Advanced etching for nanodevices and 2D materials

High-speed germanium-based waveguide electro-absorption modulator

A novel approach to an efficient LED on SOI

Test-station for flexible semi-automatic wafer-level silicon photonics testing

Troubleshooting wireless home networks using a portable testbed

Liquid crystal based beam deflectors

Compressed sensing and defect-based dictionaries for characteristics extraction in MM-wave non-destructive testing

Bifacial n-PERT cells (Bi-PERT) with plated contacts for multi-wire interconnection

Modeling of graphene for interconnect applications

Challenges in LER/CDU metrology in DSA: placement error and cross-line correlations

Combining DSM and storage to alleviate current congestion in distribution grids

Interface passivation of III-V/high-k materials by High Energy X-ray Photoelectron Spectroscopy: A quantitative evaluation

De l'importance des surfaces et interfaces pour le développement des matériaux et processus pour les dispositifs semi-conducteurs et photovoltaïques : avantages et limitations de la photoémission

Vertical devices for future nano-electronic applications

Beyond-Si materials and devices for more Moore and more than Moore applications

Atomic disorder as an intrinsic source of variability in filamentary RRAM devices – ab initio investigations

A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow

Random telegraph signal noise in advanced high performance and memory devices

Technology development challenges for advanced group IV semiconductor devices

Low-frequency and random telegraph noise performance of Ge-based and III-V devices on a Si platform

Conference contributions: Recent submissions

Advanced etching for nanodevices and 2D materials ﻿

High-speed germanium-based waveguide electro-absorption modulator ﻿

A novel approach to an efficient LED on SOI ﻿

Test-station for flexible semi-automatic wafer-level silicon photonics testing ﻿

Troubleshooting wireless home networks using a portable testbed ﻿

Liquid crystal based beam deflectors ﻿

Compressed sensing and defect-based dictionaries for characteristics extraction in MM-wave non-destructive testing ﻿

Bifacial n-PERT cells (Bi-PERT) with plated contacts for multi-wire interconnection ﻿

Modeling of graphene for interconnect applications ﻿

Challenges in LER/CDU metrology in DSA: placement error and cross-line correlations ﻿

Combining DSM and storage to alleviate current congestion in distribution grids ﻿

Interface passivation of III-V/high-k materials by High Energy X-ray Photoelectron Spectroscopy: A quantitative evaluation ﻿

De l'importance des surfaces et interfaces pour le développement des matériaux et processus pour les dispositifs semi-conducteurs et photovoltaïques : avantages et limitations de la photoémission ﻿

Vertical devices for future nano-electronic applications ﻿

Beyond-Si materials and devices for more Moore and more than Moore applications ﻿

Atomic disorder as an intrinsic source of variability in filamentary RRAM devices – ab initio investigations ﻿

A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow ﻿

Random telegraph signal noise in advanced high performance and memory devices ﻿

Technology development challenges for advanced group IV semiconductor devices ﻿

Low-frequency and random telegraph noise performance of Ge-based and III-V devices on a Si platform ﻿

Advanced etching for nanodevices and 2D materials

High-speed germanium-based waveguide electro-absorption modulator

A novel approach to an efficient LED on SOI

Test-station for flexible semi-automatic wafer-level silicon photonics testing

Troubleshooting wireless home networks using a portable testbed

Liquid crystal based beam deflectors

Compressed sensing and defect-based dictionaries for characteristics extraction in MM-wave non-destructive testing

Bifacial n-PERT cells (Bi-PERT) with plated contacts for multi-wire interconnection

Modeling of graphene for interconnect applications

Challenges in LER/CDU metrology in DSA: placement error and cross-line correlations

Combining DSM and storage to alleviate current congestion in distribution grids

Interface passivation of III-V/high-k materials by High Energy X-ray Photoelectron Spectroscopy: A quantitative evaluation

De l'importance des surfaces et interfaces pour le développement des matériaux et processus pour les dispositifs semi-conducteurs et photovoltaïques : avantages et limitations de la photoémission

Vertical devices for future nano-electronic applications

Beyond-Si materials and devices for more Moore and more than Moore applications

Atomic disorder as an intrinsic source of variability in filamentary RRAM devices – ab initio investigations

A million wafer, virtual fabrication approach to determine process capability requirements for an industry-standard 5nm BEOL two-level metal flow

Random telegraph signal noise in advanced high performance and memory devices

Technology development challenges for advanced group IV semiconductor devices

Low-frequency and random telegraph noise performance of Ge-based and III-V devices on a Si platform