Recently added

3D stacking using bump-less process for sub 10μm pitches

Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016)

1 μm-thin crystalline silicon solar cells with amorphous-ordered nanotextures (PhotoNVoltaics project)

Depauw, Valerie; Trompoukis, Christos; Massiot, Ines; Chen, Wanghua; Dmitriev, Alexandre; Roca i Cabarrocas, Pere; Gordon, Ivan (2016)

Integrating surface nanotextures into thin crystalline-Si solar cells: the case of a 1-μm-thin nanoimprinted heterojunction cell

Depauw, Valerie; Massiot, Ines; Chen, Wanghua; Trompoukis, Christos; Bearda, Twan; Dmitriev, Alexandre; Roca i Cabarrocas, Pere; Gordon, Ivan; Poortmans, Jef (2016)

Template assisted synthesis of porous metal oxide and metal nanostructures by ALD

Deng, Sharon; Kurttepeli, Murt; Bals, Sara; Cott, Daire; Detavernier, Christophe (2016)

Atomic layer processing of 2D materials for beyond CMOS applications

Delabie, Annelies; Caymax, Matty; Groven, Benjamin; Heyne, Markus; Zhang, Haodong; Chiappe, Daniele; Heyns, Marc; Radu, Iuliana (2016)

Quantitative model for post-program instabilities in filamentary RRAM

Degraeve, Robin; Fantini, Andrea; Gorine, G.; Roussel, Philippe; Clima, Sergiu; Chen, Michael; Govoreanu, Bogdan; Goux, Ludovic; Linten, Dimitri; Jurczak, Gosia; Thean, Aaron (2016)

Process window study of SAQP gratings used to pattern a dual damascene structure at 7nm technology node

Decoster, Stefan; Paolillo, Sara; Kesters, Els; Briggs, Basoene; van der Veen, Marleen; Lazzarino, Frederic; Piumi, Daniele; Yamashita, Fumiko; Demand, Marc; Kumar, Kaushik (2016)

Performance analysis of a parallel, multi-node pipeline for DNA sequencing

Decap, Dries; Reumers, Joke; Herzeel, Charlotte; Costanza, Pascal; Fostier, Jan (2016)

Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

De Vos, Joeri; Peng, Lan; Phommahaxay, Alain; Van Ongeval, Joost; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas (2016)

The low-temperature chemical synthesis of Li4Ti5O12 powder for Li-ion battery anodes

De Sloovere, Dries; Peys, Nick; De Dobbelaere, Christopher; Van Bael, Marlies; Hardy, An (2016)

Novel metal containing resists for EUV lithography extendibility

De Simone, Danilo; Sayan, Safak; Dei, Satoshi; Pollentier, Ivan; Kuwahara, Yuhei; Vandenberghe, Geert; Nafus, Kathleen; Shiratani, Motohiro; Nakagawa, Hisashi; Naruoka, Takehiko (2016)

Demonstration of an N7 integrated fab process for metal oxide EUV photoresist

De Simone, Danilo; Mao, Ming; Kocsis, Michael; De Schepper, Peter; Lazzarino, Frederic; Vandenberghe, Geert; Yamashita, Fumiko; Stowers, Jason; Meyers, Steven; Grenville, Andrew; Luong, Vinh; Parnell, Doni; Clark, Benjamin L. (2016)

An active artificial iris controlled by a 25- $lW flexible thin-film driver

De Roose, Florian; Steudel, Soeren; Myny, Kris; Willegems, Myriam; Smout, Steve; Ameys, Marc; Malinowski, Pawel; Gehlhaar, Robert; Poduval, Radhika; Chen, Xinyu; De Smet, Jelle; Vasquez Quintero, Andres; De Smet, Herbert; Dehaene, Wim; Genoe, Jan (2016)

A flexible thin-film pixel array with a charge-to-current gain of 59uA/pC and a 0.33% nonlinearity and a cost effective readout for large-area X-ray imaging

De Roose, Florian; Myny, Kris; Steudel, Soeren; Willegems, Myriam; Smout, Steve; Piessens, Tim; Genoe, Jan; Dehaene, Wim (2016)

Conference contributions: Recent submissions

3D stacking using bump-less process for sub 10μm pitches

1 μm-thin crystalline silicon solar cells with amorphous-ordered nanotextures (PhotoNVoltaics project)

Integrating surface nanotextures into thin crystalline-Si solar cells: the case of a 1-μm-thin nanoimprinted heterojunction cell

Template assisted synthesis of porous metal oxide and metal nanostructures by ALD

Atomic layer processing of 2D materials for beyond CMOS applications

Quantitative model for post-program instabilities in filamentary RRAM

Process window study of SAQP gratings used to pattern a dual damascene structure at 7nm technology node

Performance analysis of a parallel, multi-node pipeline for DNA sequencing

Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

The low-temperature chemical synthesis of Li4Ti5O12 powder for Li-ion battery anodes

Novel metal containing resists for EUV lithography extendibility

Demonstration of an N7 integrated fab process for metal oxide EUV photoresist

An active artificial iris controlled by a 25- $lW flexible thin-film driver

A flexible thin-film pixel array with a charge-to-current gain of 59uA/pC and a 0.33% nonlinearity and a cost effective readout for large-area X-ray imaging

Impact of NiB and Cu ELD layers on surface morphology and IMC growth rate of CoSn CuSn and NiSn systems

Study morphology and growth rate of intermetallic compound (IMC) for 3D stacking of fine pitch microbumps

3D stacking of Co and Ni based microbumps

Imager technologies for high speed applications

TDI imaging using embedded CCD in CMOS technology: the optimal solution for low orbit earth observation

EuroCMOSHF: demonstration of a fully European supply chain for space image sensors

Conference contributions: Recent submissions

3D stacking using bump-less process for sub 10μm pitches ﻿

1 μm-thin crystalline silicon solar cells with amorphous-ordered nanotextures (PhotoNVoltaics project) ﻿

Integrating surface nanotextures into thin crystalline-Si solar cells: the case of a 1-μm-thin nanoimprinted heterojunction cell ﻿

Template assisted synthesis of porous metal oxide and metal nanostructures by ALD ﻿

Atomic layer processing of 2D materials for beyond CMOS applications ﻿

Quantitative model for post-program instabilities in filamentary RRAM ﻿

Process window study of SAQP gratings used to pattern a dual damascene structure at 7nm technology node ﻿

Performance analysis of a parallel, multi-node pipeline for DNA sequencing ﻿

Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects ﻿

The low-temperature chemical synthesis of Li4Ti5O12 powder for Li-ion battery anodes ﻿

Novel metal containing resists for EUV lithography extendibility ﻿

Demonstration of an N7 integrated fab process for metal oxide EUV photoresist ﻿

An active artificial iris controlled by a 25- $lW flexible thin-film driver ﻿

A flexible thin-film pixel array with a charge-to-current gain of 59uA/pC and a 0.33% nonlinearity and a cost effective readout for large-area X-ray imaging ﻿

Impact of NiB and Cu ELD layers on surface morphology and IMC growth rate of CoSn CuSn and NiSn systems ﻿

Study morphology and growth rate of intermetallic compound (IMC) for 3D stacking of fine pitch microbumps ﻿

3D stacking of Co and Ni based microbumps ﻿

Imager technologies for high speed applications ﻿

TDI imaging using embedded CCD in CMOS technology: the optimal solution for low orbit earth observation ﻿

EuroCMOSHF: demonstration of a fully European supply chain for space image sensors ﻿

3D stacking using bump-less process for sub 10μm pitches

1 μm-thin crystalline silicon solar cells with amorphous-ordered nanotextures (PhotoNVoltaics project)

Integrating surface nanotextures into thin crystalline-Si solar cells: the case of a 1-μm-thin nanoimprinted heterojunction cell

Template assisted synthesis of porous metal oxide and metal nanostructures by ALD

Atomic layer processing of 2D materials for beyond CMOS applications

Quantitative model for post-program instabilities in filamentary RRAM

Process window study of SAQP gratings used to pattern a dual damascene structure at 7nm technology node

Performance analysis of a parallel, multi-node pipeline for DNA sequencing

Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

The low-temperature chemical synthesis of Li4Ti5O12 powder for Li-ion battery anodes

Novel metal containing resists for EUV lithography extendibility

Demonstration of an N7 integrated fab process for metal oxide EUV photoresist

An active artificial iris controlled by a 25- $lW flexible thin-film driver

A flexible thin-film pixel array with a charge-to-current gain of 59uA/pC and a 0.33% nonlinearity and a cost effective readout for large-area X-ray imaging

Impact of NiB and Cu ELD layers on surface morphology and IMC growth rate of CoSn CuSn and NiSn systems

Study morphology and growth rate of intermetallic compound (IMC) for 3D stacking of fine pitch microbumps

3D stacking of Co and Ni based microbumps

Imager technologies for high speed applications

TDI imaging using embedded CCD in CMOS technology: the optimal solution for low orbit earth observation

EuroCMOSHF: demonstration of a fully European supply chain for space image sensors