Recently added

Modeling fluorocarbon plasmas used for etching of Si

Tinck, Stefan; Milenin, Alexey; Bogaerts, Annemie (2013)

Imaging challenges in 20nm and 14nm logic nodes: hot spots performance in Metal1 layer

Timoshkov, Vadim; Rio, David; Liu, H.; Gillijns, Werner; Wang, Jing; Wong, Patrick; Van Den Heuvel, Dieter; Wiaux, Vincent; Nikolsky, Peter; Finders, Jo (2013)

Multi-sensors module in SiGeMEMS technology

Tilmans, Harrie; Witvrouw, Ann; Severi, Simone; Helin, Philippe; Erismis, Mehmet Akif; Haspeslagh, Luc; Op de Beeck, Maaike; Sterken, Tom; Rochus, Veronique; Yazicioglu, Refet Firat; Donnay, Stephane; Van Hoof, Chris; Rottenberg, Xavier (2013)

Integration of high performance silicon optical modulators

Thomson, D.J.; Gardes, F.Y.; Hu, Y.; Mashanovich, G.; Reed, G.T.; Zimmermann, L.; Knoll, D.; Lischke, S.; Porte, H.; Goll, B.; Zimmermann, H.; Ke, L.; Wilson, P.; Chen, S.W.; Hsu, S.S.H.; Duan, G.H.; Liepvre, A.; Jany, C.; Accard, A.; Lamponi, M.; Make, D.; Lelarge, F.; Messaoudene, S.; Bordel, D.; Fedeli, J.M.; Keyvaninia, Shahram; Roelkens, Gunther; Van Thourhout, Dries (2013)

Impact of multi-gate device architectures on digital and analog circuits and its implications on system-on-chip technologies

Thean, Aaron; Wambacq, Piet; Lee, Jae Woo; Cho, Moon Ju; Veloso, Anabela; Sasaki, Yuichiro; Chiarella, Thomas; Miyaguchi, Kenichi; Parvais, Bertrand; Garcia Bardon, Marie; Schuddinck, Pieter; Kim, Min-Soo; Horiguchi, Naoto; Dehan, Morin; Mercha, Abdelkarim; Van der Plas, Geert; Collaert, Nadine; Verkest, Diederik (2013)

Silicon & beyond CMOS: The path of advanced electronic structure engineering for low-voltage transistors

Thean, Aaron (2013)

The effect of material texture in the CMP of ruthenium films

Teugels, Lieve; Amanapu, Hariprasad; Sagi, Kaushik; Heylen, Nancy; Babu, S.V. (2013)

Framework for evaluating EEG signal quality of dry electrode recordings

Tautan, Alexandra; Serdijn, W.; Mihajlovic, Vojkan; Grundlehner, Bernard; Penders, Julien (2013)

Broadband passive InP membrane regenerator for silicon-based optical interconnect applications

Tassaert, Martijn; Dorren, H.J.S.; Roelkens, Gunther; Raz, O. (2013)

Impact of mid-bond Testing in 3D stacked ICs

Taouil, Mottaqiallah; Hamdioui, Said; Marinissen, Erik Jan; Bhawmik, Sudipta (2013-10)

Using 3D-COSTAR for 2.5D test cost optimization

Taouil, Mottaqiallah; Hamdioui, Said; Marinissen, Erik Jan; Bhawmik, Sudipta (2013-10)

Statistical characterization of vertical poly-Si channel using charge pumping technique for 3D flash memory optimization

Tang, Baojun; Toledano Luque, Maria; Zhang, W.D.; Van den Bosch, Geert; Degraeve, Robin; Zhang, J.F.; Van Houdt, Jan (2013)

Watermark formation mechanism by evaporation of ultra-pure water: Study the effect of ambient

Tamaddon, Amir-Hossein; Mertens, Paul; Vereecke, Guy; Holsteyns, Frank; Doumen, Geert; De Gendt, Stefan; Heyns, Marc (2013)

Watermark formation mechanism by evaporation of ultra-pure water: Study the effect of ambient

Tamaddon, Amir-Hossein; Mertens, Paul; Vereecke, Guy; Holsteyns, Frank; De Gendt, Stefan; Heyns, Marc (2013)

Evaluation of high-speed linear air-knife based wafer dryer

Tamaddon, Amir-Hossein; Belmiloud, Naser; Doumen, Geert; Struyf, Herbert; Mertens, Paul; Heyns, Marc (2013)

Residual stress in silicon caused by Cu-Sn wafer-level packaging

Taklo, Maaike; Vardĝy, Astrid-Sofie; De Wolf, Ingrid; Simons, Veerle; van de Wiel, H.J.; van der Waal, Adri; Martinsen, Stian; Lapadatu, Adriana; Wunderle, Bernhard (2013)

Numerical investigation of the pressure drop through micro-pillar arrays for a wide range of aspect ratios

Taher, Ahmed; Jones, Ben; Adam, Ihab; Lagae, Liesbet (2013)

Ruthenium nanowires by selective atomic layer deposition

Swerts, Johan; Wen, Liang Gong; Delabie, Annelies; Phung, Quan; Boemmels, Juergen; Tokei, Zsolt; Van Elshocht, Sven (2013)

Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

Swerts, Johan; Siew, Yong Kong; Van Besien, Els; Barbarin, Yohan; Boemmels, Juergen; Tokei, Zsolt; Van Elshocht, Sven (2013)

The effect of Ar/H2 plasma pretreatments on porous k=2.0 dielectrics for pore sealing by self-assembled monolayers deposition

Sun, Yiting; Swerts, Johan; Verdonck, Patrick; Maheshwari, Abhishek; Prado, J.L.; De Feyter, Steven; Armini, Silvia (2013)

Conference contributions: Recent submissions

Modeling fluorocarbon plasmas used for etching of Si ﻿

Imaging challenges in 20nm and 14nm logic nodes: hot spots performance in Metal1 layer ﻿

Multi-sensors module in SiGeMEMS technology ﻿

Integration of high performance silicon optical modulators ﻿

Impact of multi-gate device architectures on digital and analog circuits and its implications on system-on-chip technologies ﻿

Silicon & beyond CMOS: The path of advanced electronic structure engineering for low-voltage transistors ﻿

The effect of material texture in the CMP of ruthenium films ﻿

Framework for evaluating EEG signal quality of dry electrode recordings ﻿

Broadband passive InP membrane regenerator for silicon-based optical interconnect applications ﻿

Impact of mid-bond Testing in 3D stacked ICs ﻿

Using 3D-COSTAR for 2.5D test cost optimization ﻿

Statistical characterization of vertical poly-Si channel using charge pumping technique for 3D flash memory optimization ﻿

Watermark formation mechanism by evaporation of ultra-pure water: Study the effect of ambient ﻿

Watermark formation mechanism by evaporation of ultra-pure water: Study the effect of ambient ﻿

Evaluation of high-speed linear air-knife based wafer dryer ﻿

Residual stress in silicon caused by Cu-Sn wafer-level packaging ﻿

Numerical investigation of the pressure drop through micro-pillar arrays for a wide range of aspect ratios ﻿

Ruthenium nanowires by selective atomic layer deposition ﻿

Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects ﻿

The effect of Ar/H2 plasma pretreatments on porous k=2.0 dielectrics for pore sealing by self-assembled monolayers deposition ﻿

Modeling fluorocarbon plasmas used for etching of Si

Imaging challenges in 20nm and 14nm logic nodes: hot spots performance in Metal1 layer

Multi-sensors module in SiGeMEMS technology

Integration of high performance silicon optical modulators

Impact of multi-gate device architectures on digital and analog circuits and its implications on system-on-chip technologies

Silicon & beyond CMOS: The path of advanced electronic structure engineering for low-voltage transistors

The effect of material texture in the CMP of ruthenium films

Framework for evaluating EEG signal quality of dry electrode recordings

Broadband passive InP membrane regenerator for silicon-based optical interconnect applications

Impact of mid-bond Testing in 3D stacked ICs

Using 3D-COSTAR for 2.5D test cost optimization

Statistical characterization of vertical poly-Si channel using charge pumping technique for 3D flash memory optimization

Watermark formation mechanism by evaporation of ultra-pure water: Study the effect of ambient

Watermark formation mechanism by evaporation of ultra-pure water: Study the effect of ambient

Evaluation of high-speed linear air-knife based wafer dryer

Residual stress in silicon caused by Cu-Sn wafer-level packaging

Numerical investigation of the pressure drop through micro-pillar arrays for a wide range of aspect ratios

Ruthenium nanowires by selective atomic layer deposition

Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

The effect of Ar/H2 plasma pretreatments on porous k=2.0 dielectrics for pore sealing by self-assembled monolayers deposition