Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration

Abstract

We demonstrate the suitability of a novel blade dicing technique introduced by DISCO that has an output comparable to that of plasma dicing, in terms of particle count and surface cleanliness - known as 'clean dicing'. This was assessed by both a simple particle counting process and image analysis of scanning acoustic microscopy (SAM) data after wafer-to-wafer (W2W) bonding, showing minimal void count in the clean diced wafers.