Browsing Articles by imec author "effb224813386ea726c56f36e795aa9cb0bbb27e"
Now showing items 1-20 of 22
-
3D backside integration of FinFETs: Is there an impact on LF noise?
Simoen, Eddy; Jourdain, Anne; Claeys, Cor; Veloso, Anabela (2023) -
Anomalous C-V inversion in TSV's: The problem and its cure
Stucchi, Michele; De Vos, Joeri; Jourdain, Anne; Li, Yunlong; Van der Plas, Geert; Croes, Kristof; Beyne, Eric (2018) -
Creep as a reliability problem in MEMS
Modlinski, Robert; Witvrouw, Ann; Ratchev, Petar; Jourdain, Anne; Simons, Veerle; Tilmans, Harrie; den Toonder, Jaap M.J.; Puers, Bob; De Wolf, Ingrid (2004) -
Design considerations and technology assessment of phased-array antenna systems with RF-MEMS for automotive radar applications
Schoebel, Joerg; Buck, Tomas; Reimann, Matthias; Ulm, Markus; Schneider, Martin; Jourdain, Anne; Carchon, Geert; Tilmans, Harrie (2005) -
Edge trimming for surface activated dielectric bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Visker, Jakob; Peng, Lan; Moeller, Berthold; Yokoyama, Yokoyama; Phommahaxay, Alain; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2017) -
Edge trimming induced defects on direct bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric (2018) -
Electrical modeling and design of a wafer-level package for MEM resonators
Perruisseau-Carrier, Julien; Mazza, Marco; Jourdain, Anne; Skrivervik, Anja; Ionescu, Adrian; Tilmans, Harrie (2010) -
Epitaxial Growth of Active Si on Top of SiGe Etch Stop Layer in View of 3D Device Integration
Becker, L.; Storck, P.; Loo, Roger; Jourdain, Anne; Rengo, Gianluca; Porret, Clément; Hikavyy, Andriy; Liebens, Maarten; Beyer, Gerald; Beyne, Eric (2021) -
Etch process modules development and integration in 3D-SOC applications
Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric; Miller, Andy; Piumi, Daniele (2018) -
Impacts of Through-Silicon Vias on Total-Ionizing-Dose Effects and Low-Frequency Noise in FinFETs
Li, Kan; Zhang, En Xia; Gorchichko, Mariia; Wang, Peng Fei; Reaz, Mahmud; Zhao, Simeng E.; Hiblot, Gaspard; Van Huylenbroeck, Stefaan; Jourdain, Anne; Alles, Michael L.; Reed, Robert A.; Fleetwood, Daniel M.; Schrimpf, Ronald D. (2021) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, Gerard; Stoerring, Moritz; Hiebert, Stephen; Cross, Andrew (2019) -
In-line process variance monitoring of advanced 3D TSV production lines
Guittet, Pierre-Yves; Markwort, Lars; Savage, Greg; Jourdain, Anne; Halder, Sandip (2010) -
Influence of Si wafer thinning processes on (Sub)surface defects
Inoue, Fumihiro; Jourdain, Anne; Peng, Lan; Phommahaxay, Alain; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyne, Eric; Uedono, Akira (2017) -
Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies
Carchon, Geert; Jourdain, Anne; Vendier, Olivier; Schoebel, Joerg; Tilmans, Harrie (2007-08) -
Laser bonding of glass to silicon using polymer for microsystems packaging
Bardin, Fabrice; Kloss, Stephan; Wang, Changhai; Moore, Andrew J.; Jourdain, Anne; De Wolf, Ingrid; Hand, Duncan P. (2007-06) -
Low-Frequency Noise and Border Traps in Irradiated nMOS and pMOS Bulk Si FinFETs With SiO2/HfO2 Gate Dielectrics
Li, Kan; Luo, Xuyi; Rony, M. W.; Gorchichko, Mariia; Hiblot, Gaspard; Van Huylenbroeck, Stefaan; Jourdain, Anne; Alles, Michael L.; Reed, Robert A.; Zhang, En Xia; Fleetwood, Daniel M.; Schrimpf, Ronald D. (2023) -
Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-) MEMS devices
Jourdain, Anne; De Moor, Piet; Baert, Kris; De Wolf, Ingrid; Tilmans, Harrie (2005-06) -
MEMS packaging and reliability: An undividable couple
Tilmans, Harrie; De Coster, Jeroen; Helin, Philippe; Cherman, Vladimir; Jourdain, Anne; De Moor, Piet; Vandevelde, Bart; Pham, Nga; Zekry, Joseph; Witvrouw, Ann; De Wolf, Ingrid (2012) -
New hybrid bonding approach for 3D stacking of ICs
Jourdain, Anne; Soussan, Philippe; Swinnen, Bart; Beyne, Eric (2009-08) -
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
Veloso, Anabela; Jourdain, Anne; Radisic, Dunja; Chen, Rongmei; Arutchelvan, Goutham; O'Sullivan, Barry; Arimura, Hiroaki; Stucchi, Michele; De Keersgieter, An; Hosseini, Maryam; Hopf, Toby; D'have, Koen; Wang, Shouhua; Dupuy, Emmanuel; Mannaert, Geert; Vandersmissen, Kevin; Iacovo, Serena; Marien, Philippe; Choudhury, Subhobroto; Schleicher, Filip; Sebaai, Farid; Oniki, Yusuke; Zhou, X.; Gupta, Anshul; Schram, Tom; Briggs, Basoene; Lorant, Christophe; Rosseel, Erik; Hikavyy, Andriy; Loo, Roger; Geypen, Jef; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Soulie, Jean-Philippe; Devriendt, Katia; Chan, BT; Demuynck, Steven; Hiblot, Gaspard; Van der Plas, Geert; Ryckaert, Julien; Beyer, Gerald; Dentoni Litta, Eugenio; Beyne, Eric; Horiguchi, Naoto (2022)