Browsing Presentations by author "Maex, Karen"
Now showing items 41-60 of 90
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Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
Zhang, Wenqi; Brongersma, Sywert; Van Aelst, Joke; Richard, Olivier; Bamal, Mandeep; Heylen, Nancy; Li, Yunlong; Beyer, Gerald; Maex, Karen (2005) -
Impurity determination in narrow copper lines
Zhang, Wenqi; Brongersma, Sywert; Conard, Thierry; Vandervorst, Wilfried; Maex, Karen (2004) -
Influence of plating conditions on the dynamics of copper grain growth during thermal annealing
Brongersma, Sywert; D'Haen, Jan; Vanstreels, Kris; De Ceuninck, Ward; Maex, Karen (2003) -
Integration HSQ into direct-on-metal approach for 0.25µm technology
Gao, Teng; Witvrouw, Ann; Coenegrachts, Bart; Bruynseraede, Christophe; Van Hove, Marleen; Maex, Karen (1999) -
Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
Gao, Teng; Coenegrachts, Bart; Waeterloos, Joost; Beyer, Gerald; Meynen, Herman; Van Hove, Marleen; Maex, Karen (1998) -
Integrations of Cu and low-k dielectrics: effect of hard mask dry etch and post-CMP clean on electrical performance of damascene structures
Donaton, R. A.; Coenegrachts, Bart; Maenhoudt, Mireille; Pollentier, Ivan; Struyf, Herbert; Vanhaelemeersch, Serge; Grillaert, Joost; Fyen, Wim; Beyer, Gerald; Stucchi, Michele; Richard, Emmanuel; Vervoort, Iwan; De Roest, David; Maex, Karen (2000) -
Kilometer long copper low-k interconnects
Tokei, Zsolt; Brongersma, Sywert; Maex, Karen (2002) -
Local mechanical stress induced during Ti- and Co/Ti silicidation reaction in sub-0.25 µm MOS technologies
Steegen, An; De Wolf, Ingrid; Bender, Hugo; Maex, Karen (1998) -
Low temperature oxidation and selective etching of CVD SiC films
Baklanov, Mikhaïl; Mannaert, Geert; Vanhaelemeersch, Serge; Maex, Karen (1999) -
Material characteristics and damascene patterning of a fluoropolymer low-k film
Struyf, Herbert; Donaton, R. A.; Lepage, Muriel; Lanckmans, Filip; Vereecke, Guy; Maex, Karen; Vanhaelemeersch, Serge; Scheid, D. (2000) -
Nanoindentation on low-k dielectrics
Brongersma, Sywert; Wright, S.; Maex, Karen (2002) -
Nanoindentation on low-k dielectrics
Brongersma, Sywert; Nolan, M.; Vervoort, Iwan; Maex, Karen (2002) -
Narrow trench corrosion
Ernur, Didem; Kondo, Seiichi; Maex, Karen (2001) -
New plating path for electroless copper deposition on sputtered barrier layers
Lantasov, Yuri; Min, Woo Sig; Palmans, Roger; Maex, Karen (1999) -
New sensitive electrical measurement techniques for the study of stress induced voiding
Witvrouw, Ann; Drijbooms, Chris; Bender, Hugo; Maex, Karen (1997) -
Ni-germanide contacts on Ge: phase formation and electrical characterization
Opsomer, Karl; Simoen, Eddy; Detavernier, C.; Lauwers, Anne; Lavoie, C.; Van Meirhaeghe, R.L.; Maex, Karen (2007) -
Optimized thermal processing for Ti-capped CoSi2 for 0.13μm technology
Lindsay, Richard; Lauwers, A.; de Potter de ten Broeck, Muriel; Roelandts, Nico; Vrancken, Christa; Maex, Karen (2000) -
Orientation dependent stress build-up during the formation of epitaxial CoSi2
Steegen, An; Detavernier, C.; Maex, Karen; Van Meirhaeghe, R. L.; Cardon, F. (2000) -
Plasticity of electromigration-induced hillocking and how it affects the critical length
Proost, Joris; Maex, Karen; Delaey, L. (2001) -
Post dry-etch cleaning issues of an organic low-K dielectric
Lanckmans, Filip; Baklanov, Mikhaïl; Alaerts, Carine; Vanhaelemeersch, Serge; Maex, Karen (1998)