Browsing by Author "Chanson, Romain"

A Novel Volatile Film for Dielectric Plasma Damage Protection

Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL)

Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50° C

Gas Phase Pore Stuffing (GPPS)

Gas phase pore stuffing for the protection of organo-silicate glass dielectric materials

Low damage ULK etching by means of high boiling point organic condensation

Low damage ultra-low-k patterning using a high boiling point organic (HBPO) combined with NF3

Low-k cryo-etching : comparison of four different High Boiling Point Organic (HBPO)

Low-k integration: Gas screening for cryogenic etching and damage mitigation

Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage

Low-k protection from F radicals and VUV photons using a multilayer pore grafting approach

Novel volatile film for the protection of organo-silicate glass dielectric materials

Use of a thermally degradable chemical vapor deposited polymer film for low damage plasma processing of highly porous dielectrics