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Browsing by Author "Chickermane, Vivek"

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    3D design-for-test architecture

    Marinissen, Erik Jan  
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    Konijnenburg, Mario  
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    Verbree, Jouke
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    Chi, Chun-Chuan
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    Deutsch, Sergej
    Book chapter
    2019-03
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    A DfT architecture and tool flow for 3D-SICs with test data compression, embedded cores, and multiple towers

    Papameletis, Christos
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    Keller, Brion
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    Chickermane, Vivek
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    Hamdioui, Said
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    Marinissen, Erik Jan  
    Journal article
    2015, IEEE Design & Test, (32) 4, p.40-48
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    At-speed delay testing of inter-die connections of 2.5D- and 3D-SICs

    Shibin, Konstantin
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    Chickermane, Vivek
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    Keller, Brion
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    Papameletis, Christos
    Proceedings paper
    2015-05, IEEE European Test Symposium - ETS, 25/05/2015
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    At-speed delay testing of inter-die connections of 2.5D- and 3D-SICs

    Shibin, Konstantin
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    Chickermane, Vivek
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    Keller, Brion
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    Papameletis, Christos
    Meeting abstract
    2015-05, CDN Live EMEA, 27/04/2015
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    At-Speed delay testing of inter-die connections of 2.5D- and 3D-SICs

    Shibin, Konstantin
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    Chickermane, Vivek
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    Keller, Brion
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    Papameletis, Christos
    Proceedings paper
    2015-05, IEEE North-Atlantic Test Workshop - NATW, 11/05/2015
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    At-speed inter-die interconnect test in 2.5D- and 3D-SICs

    Shibin, Konstantin
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    Chickermane, Vivek
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    Keller, Brion
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    Papameletis, Christos
    Proceedings paper
    2015-10, IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits (3D-TEST), 8/10/2015
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    At-speed testing of inter-die connections of 3D-SICs in the presence of shore logic

    Shibin, Konstantin
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    Chickermane, Vivek
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    Keller, Brion
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    Papameletis, Christos
    Proceedings paper
    2015-11, IEEE Asian Test Symposium - ATS, 22/11/2015
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    Automated design-for-test for 2.5D and 3D SICs

    Marinissen, Erik Jan  
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    Konijnenburg, Mario  
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    Deutsch, Sergej
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    Keller, Brion
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    Chickermane, Vivek
    Journal article
    2011-09, Chip Scale Review, (?) 5, p.18-22
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    Automated DfT insertion and test generation for 3D-SICs with embedded cores and multiple towers

    Papameletis, Christos
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    Keller, Brion
    ;
    Chickermane, Vivek
    ;
    Marinissen, Erik Jan  
    ;
    Hamdioui, Said
    Proceedings paper
    2013-05, IEEE European Test Symposium - ETS, 27/05/2013, p.15-20
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    Automated DfT insertion and test generation for 3D-SICs with embedded cores and multiple towers

    Papameletis, Christos
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    Keller, Brion
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    Chickermane, Vivek
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    Marinissen, Erik Jan  
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    Hamdioui, Said
    Oral presentation
    2013, Cadence CDNLive! EMEA
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    Automation of 3D DfT insertion and interconnect test generation

    Deutsch, Sergej
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    Chickermane, Vivek
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    Keller, Brion
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    Konijnenburg, Mario  
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    Marinissen, Erik Jan  
    Oral presentation
    2011, IEEE International Test Conference - ITC
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    Automation of 3D-DfT insertion

    Deutsch, Sergej
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    Chickermane, Vivek
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    Keller, Brion
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    Mukherjee, Subhasish
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    Konijnenburg, Mario  
    Proceedings paper
    2011-11, IEEE Asian Test Symposium - ATS, 21/11/2011
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    Automation of 3D-DfT insertion

    Deutsch, Sergej
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    Chickermane, Vivek
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    Keller, Brion
    ;
    Mukherjee, Subhasish
    ;
    Konijnenburg, Mario  
    Proceedings paper
    2011-09, IEEE International Workshop on Testing Three-Dimensional Stacked ICs- 3D-TEST, 22/09/2011
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    Automation of DfT insertion and interconnect test generation for 3D stacked ICs

    Deutsch, Sergej
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    Chickermane, Vivek
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    Keller, Brion
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    Konijnenburg, Mario  
    ;
    Marinissen, Erik Jan  
    Proceedings paper
    2011-05, IEEE North-Atlantic Test Workshop - NATW, 11/05/2011
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    DfT architecture and ATPG for interconnect tests of JEDEC wide-IO DRAM memory-on-Logic 2.5D/3D-stacks

    Deutsch, Sergej
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    Chickermane, Vivek
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    Keller, Brion
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    Mukherjee, Subhasish
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    Sood, Navdeep
    Proceedings paper
    2012-05, Cadence CDNLive! EMEA, 14/05/2012
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    DfT architecture and ATPG for interconnect tests of JEDEC wide-IO memory-on-logic die stacks

    Deutsch, Sergej
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    Keller, Brion
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    Chickermane, Vivek
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    Mukherjee, Subhasish
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    Sood, Navdeep
    Proceedings paper
    2012-11, IEEE International Test Conference - ITC, 6/11/2012, p.1-10
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    DfT insertion and interconnect test generation for 3D stacks with JEDEC wide-IO DRAM

    Deutsch, Sergej
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    Keller, Brion
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    Chickermane, Vivek
    ;
    Goel, Sandeep K.
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    Marinissen, Erik Jan  
    Proceedings paper
    2012-05, IEEE North-Atlantic Test Workshop - NATW, 9/05/2012
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    Extension of a 3D-DfT architecture for embedded cores and multiple towers

    Papameletis, Christos
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    Chickermane, Vivek
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    Keller, Brion
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    Marinissen, Erik Jan  
    Proceedings paper
    2012, IEEE International Workshop on Testing Three-Dimensional Stacked ICs - 3D-TEST, 8/11/2012
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    Implementation aspects of a 3D DfT architecture

    Deutsch, Sergej
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    Chickermane, Vivek
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    Keller, Brion
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    Mukherjee, Subhasish
    ;
    Konijnenburg, Mario  
    Oral presentation
    2011, CDNLive! EMEA (Cadence Design Systems)
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    Interconnect test for wide-IO memory-on-logic stacks

    Marinissen, Erik Jan  
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    Deutsch, Sergej
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    Keller, Brion
    ;
    Chickermane, Vivek
    Journal article
    2012-07, Future Fab International, 42, p.112-117
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