Browsing by Author "De Messemaeker, Joke"

A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon

Co-Sn intermetallic compoundsfor potential integration in 3D interconnects

Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's

Composite polymer core – ceria shell abrasive particles during silicon oxide CMP

Correlation between Cu microstructure and TSV Cu pumping

Cu TSV stress: avoiding Cu protrusion and impact on devices

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds

Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits

Impact of Cu TSVs on BEOL metal and dielectric reliability

Impact of oxide liner properties on TSV Cu pumping and TSV stress

Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumping

Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Interaction forces between a glass surface and ceria-modified PMMA-based abrasives for CMP measured by colloidal probe AFM

Microstructure simulation of grain growth in Cu Through Silicon Via using phase-field modeling

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling